公开(公告)号：US20220344281A1

公开(公告)日：2022-10-27

申请号：US17701693

申请日：2022-03-23

Applicant: Innolux Corporation

Inventor： Ming-Tsang Wu ,  Jia-Sin Li ,  Chia-Chieh Fan

IPC: H01L23/00 ,  H01L27/12

Abstract: An electronic device including a flexible substrate, a plurality of light emitting units, and a plurality of supporting elements is provided. The flexible substrate has a first surface and a second surface opposite to each other. The light emitting units are disposed on the first surface. The supporting elements are disposed on the second surface. The supporting element includes an arc-shaped structure.

公开(公告)号：US20220328460A1

公开(公告)日：2022-10-13

申请号：US17694644

申请日：2022-03-14

Applicant: Innolux Corporation

Inventor： Chia-Chieh Fan ,  Ming-Tsang Wu

IPC: H01L25/075 ,  H01L33/56 ,  H01L33/62

Abstract: An electronic device is provided. The electronic device includes a supporting board, multiple circuit boards, a gap, and a molding material. The circuit boards are disposed on the supporting board. Each circuit board includes a substrate and multiple semiconductor elements. The semiconductor elements are disposed on the substrate. The gap is disposed between two adjacent circuit boards. The molding material is disposed on the supporting board and covers the circuit boards and the gap. The electronic device of the embodiment of the disclosure can improve uniformity of product appearance or uniformity of a display image.

公开(公告)号：US20210375643A1

公开(公告)日：2021-12-02

申请号：US17402595

申请日：2021-08-15

Applicant: InnoLux Corporation

Inventor： Chia-Chieh Fan ,  Chin-Lung Ting ,  Cheng-Chi Wang ,  Ming-Tsang Wu

IPC: H01L21/56 ,  H01L21/683 ,  H01L21/48 ,  H01L25/00 ,  H01L23/00

Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, forming a resin layer on the sacrificial layer, disposing first chips on the sacrificial layer, and forming a first dielectric layer having trenches and surrounding the first chips, wherein an upper surface of the first dielectric layer and an upper surface of the resin layer are at a same plane.

公开(公告)号：US11782308B2

公开(公告)日：2023-10-10

申请号：US17697080

申请日：2022-03-17

Applicant: InnoLux Corporation

Inventor： Shan-Shan Hsu ,  Ming-Tsang Wu ,  Chia-Chieh Fan

IPC: G02F1/13357 ,  H05K1/18 ,  G02F1/1335

CPC classification number: G02F1/133603 ,  G02F1/133528 ,  H05K1/189 ,  G02F2202/28 ,  H05K2201/10136

Abstract: An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.

公开(公告)号：US20190214288A1

公开(公告)日：2019-07-11

申请号：US16211194

申请日：2018-12-05

Applicant: InnoLux Corporation

Inventor： Chia-Chieh Fan ,  Chin-Lung Ting ,  Cheng-Chi Wang ,  Ming-Tsang Wu

IPC: H01L21/683 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L25/00 ,  H01L25/10

CPC classification number: H01L21/6835 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/95001 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/3511

Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, disposing first chips on the sacrificial layer, forming a first dielectric layer surrounding the first chips, forming trenches in the first dielectric layer, and forming a second dielectric layer in the trenches, wherein an upper surface of the first dielectric layer and an upper surface of the second dielectric layer are at a same plane.

公开(公告)号：US10095060B2

公开(公告)日：2018-10-09

申请号：US15495577

申请日：2017-04-24

Applicant: InnoLux Corporation

Inventor： Chun-Sheng Yen ,  Chia-Chieh Fan ,  Ming-Tsang Wu ,  Pai-Chi Tsai

IPC: G06F1/16 ,  G02F1/1333 ,  G02F1/1335

Abstract: A display device includes a first substrate, a second substrate, a first polarizer, a second polarizer and a frame. The frame contacts with a first surface and a first side of the first substrate, a second surface and a second side of the second substrate, and a third side of the first polarizer. The frame has a fourth surface and a fourth side connecting to the fourth surface, and the fourth side is disposed corresponding to the second side. In a first direction perpendicular to the first surface, a shortest distance between the fourth and first surfaces is a first distance, a shortest distance between the fourth and first surfaces is a second distance, and a shortest distance between the third and first surfaces is a third distance. The third distance is substantially equal to the first distance, and the first distance and the second distance are different.

公开(公告)号：US20240103308A1

公开(公告)日：2024-03-28

申请号：US18527392

申请日：2023-12-04

Applicant: Innolux Corporation

Inventor： Ming-Tsang Wu ,  Jia-Sin Li ,  Chia-Chieh Fan

IPC: G02F1/1333 ,  H01L27/12

CPC classification number: G02F1/133305 ,  H01L27/1218 ,  G02F1/1368

Abstract: An electronic device including a substrate, a circuit structure, two adjacent supporting elements and another two adjacent supporting elements is provided. The flexible substrate has a first surface and comprises a region connected with a circuit board. The circuit structure is disposed on the first surface. The two adjacent supporting elements are disposed on the first surface and separated by a first distance. The another two adjacent supporting elements are disposed on the first surface and separated by a second distance, wherein the two adjacent support elements are farther away from the region than the another two adjacent support elements, and the first distance is less than the second distance.

公开(公告)号：US11880100B2

公开(公告)日：2024-01-23

申请号：US17701693

申请日：2022-03-23

Applicant: Innolux Corporation

Inventor： Ming-Tsang Wu ,  Jia-Sin Li ,  Chia-Chieh Fan

IPC: G02F1/1333 ,  H01L27/12 ,  G02F1/1368

CPC classification number: G02F1/133305 ,  H01L27/1218 ,  G02F1/1368 ,  G02F2201/50

Abstract: An electronic device including a flexible substrate, a plurality of light emitting units, and a plurality of supporting elements is provided. The flexible substrate has a first surface and a second surface opposite to each other. The light emitting units are disposed on the first surface. The supporting elements are disposed on the second surface. The supporting element includes an arc-shaped structure.

公开(公告)号：US11721560B2

公开(公告)日：2023-08-08

申请号：US17402595

申请日：2021-08-15

Applicant: InnoLux Corporation

Inventor： Chia-Chieh Fan ,  Chin-Lung Ting ,  Cheng-Chi Wang ,  Ming-Tsang Wu

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L25/00 ,  H01L21/683 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L21/568 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L24/97 ,  H01L25/50 ,  H01L23/3128 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/12105 ,  H01L2224/95001 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/18162 ,  H01L2924/3511

Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, forming a resin layer on the sacrificial layer, disposing first chips on the sacrificial layer, and forming a first dielectric layer having trenches and surrounding the first chips, wherein an upper surface of the first dielectric layer and an upper surface of the resin layer are at a same plane.

公开(公告)号：US11307454B2

公开(公告)日：2022-04-19

申请号：US17010186

申请日：2020-09-02

Applicant: InnoLux Corporation

Inventor： Shan-Shan Hsu ,  Ming-Tsang Wu ,  Chia-Chieh Fan

IPC: G02F1/13357 ,  H05K1/18 ,  G02F1/1335

Abstract: An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.