公开(公告)号：US20230380071A1

公开(公告)日：2023-11-23

申请号：US18225692

申请日：2023-07-25

申请人： InnoLux Corporation

发明人： Hsueh-Hsuan Chou ,  Yi-Hung Lin

IPC分类号： H05K3/00 ,  H01L21/48 ,  H05K3/06

CPC分类号： H05K3/007 ,  H01L21/4846 ,  H05K3/064

摘要： An electronic device is disclosed. The electronic device includes a circuit structure. The circuit structure includes a metal member and an insulating layer. The insulating layer surrounds the metal member and includes at least one recess. The metal member corresponds to the recess, the recess exposes a surface of the metal member, and a width of the recess is greater than a width of the metal member in a cross-sectional view of the metal member and the insulating layer.

公开(公告)号：US20200051902A1

公开(公告)日：2020-02-13

申请号：US16655201

申请日：2019-10-16

申请人： InnoLux Corporation

发明人： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Cheng-Chi Wang ,  Kuan-Jen Wang

IPC分类号： H01L23/498 ,  H01L21/66 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31

摘要： A package structure includes a redistribution layer having a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface, at least one bonding electrode disposed on the first surface of the redistribution layer, and a mounting layer disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads that are spaced apart from each other. At least one of the conductive pads is exposed by the sidewall of the redistribution layer.

公开(公告)号：US20190035715A1

公开(公告)日：2019-01-31

申请号：US16018003

申请日：2018-06-25

申请人： InnoLux Corporation

发明人： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

摘要： The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.

公开(公告)号：US11075155B2

公开(公告)日：2021-07-27

申请号：US16655201

申请日：2019-10-16

申请人： InnoLux Corporation

发明人： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Cheng-Chi Wang ,  Kuan-Jen Wang

IPC分类号： H01L21/66 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31

摘要： A package structure includes a redistribution layer having a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface, at least one bonding electrode disposed on the first surface of the redistribution layer, and a mounting layer disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads that are spaced apart from each other. At least one of the conductive pads is exposed by the sidewall of the redistribution layer.

公开(公告)号：US20180190579A1

公开(公告)日：2018-07-05

申请号：US15854728

申请日：2017-12-26

申请人： InnoLux Corporation

发明人： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Cheng-Chi Wang ,  Kuan-Jen Wang

IPC分类号： H01L23/498 ,  H01L21/66 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L22/14 ,  H01L22/32 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16502 ,  H01L2224/80411 ,  H01L2224/80444 ,  H01L2224/80455 ,  H01L2224/81005 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81455 ,  H01L2224/81805 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/37001 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/013

摘要： A package structure includes a redistribution layer, at least one bonding electrode, and a mounting layer. The redistribution layer has a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface. The bonding electrode is disposed on the first surface of the redistribution layer. The mounting layer is disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads spaced apart from each other, wherein at least one of the conductive pads is exposed by the sidewall of the redistribution layer.

公开(公告)号：US11758666B2

公开(公告)日：2023-09-12

申请号：US17486935

申请日：2021-09-28

申请人： InnoLux Corporation

发明人： Hsueh-Hsuan Chou ,  Yi-Hung Lin

IPC分类号： H05K3/00 ,  H05K3/06 ,  H01L21/48

CPC分类号： H05K3/007 ,  H01L21/4846 ,  H05K3/064

摘要： A manufacturing method of a metal structure is disclosed, which includes the following steps: forming a seed layer on a substrate; forming a patterned metal layer on the seed layer, wherein the patterned metal layer includes a metal member; forming a first patterned photoresist layer on the seed layer, wherein a thickness of the first patterned photoresist layer is less than a thickness of the patterned metal layer; and performing a first patterning process to the seed layer through the first patterned photoresist layer to form a patterned seed layer, wherein after the first patterning process, the metal member includes a first part and a second part, the first part is disposed between the patterned seed layer and the second part, and a width of the first part is greater than a width of the second part.

公开(公告)号：US11672081B2

公开(公告)日：2023-06-06

申请号：US16953338

申请日：2020-11-20

申请人： InnoLux Corporation

发明人： Hsueh-Hsuan Chou ,  Yi-Hung Lin

IPC分类号： H05K3/02 ,  H05K3/00

CPC分类号： H05K3/027 ,  H05K3/007

摘要： A manufacturing method of a metal structure is disclosed, which includes the following steps: forming a seed layer on a substrate; forming a patterned metal layer on the seed layer, wherein the patterned metal layer includes a metal member; forming a first patterned photoresist layer on the seed layer, wherein a thickness of the first patterned photoresist layer is less than a thickness of the patterned metal layer; and performing a first patterning process to the seed layer through the first patterned photoresist layer to form a patterned seed layer, wherein after the first patterning process, the metal member includes a first part and a second part, the first part is disposed between the patterned seed layer and the second part, and a width of the first part is greater than a width of the second part.

公开(公告)号：US20230027220A1

公开(公告)日：2023-01-26

申请号：US17960816

申请日：2022-10-05

申请人： InnoLux Corporation

发明人： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56

摘要： The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.

公开(公告)号：US11488899B2

公开(公告)日：2022-11-01

申请号：US16941516

申请日：2020-07-28

申请人： InnoLux Corporation

发明人： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

摘要： The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.