公开(公告)号：US20240222859A1

公开(公告)日：2024-07-04

申请号：US18147768

申请日：2022-12-29

Applicant: Intel Corporation

Inventor： Tae Young YANG ,  Zhen ZHOU ,  Shuhei YAMADA ,  Tolga ACIKALIN ,  Kenneth P. FOUST ,  Bryce D. HORINE

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q17/00 ,  H01Q19/10

CPC classification number: H01Q1/526 ,  H01Q1/2291 ,  H01Q17/00 ,  H01Q19/10

Abstract: An apparatus may include a substrate including: a first antenna configured to form a first short range wireless interconnection with a first antenna of a further substrate, a second antenna spaced apart from the first antenna, the second antenna is configured to form a second short range wireless interconnection with a second antenna of the further substrate, and a metamaterial configured to form a surface with effective negative permeability within a space formed between a surface of the substrate and a surface of the further substrate for an established short range wireless interconnection of the first short range wireless interconnection and the second short range wireless interconnection.

公开(公告)号：US20230420396A1

公开(公告)日：2023-12-28

申请号：US18253954

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Tolga ACIKALIN ,  Arnaud AMADJIKPE ,  Brent R. CARLTON ,  Chia-Pin CHIU ,  Timothy F. COX ,  Kenneth P. FOUST ,  Bryce D. HORINE ,  Telesphor KAMGAING ,  Renzhi LIU ,  Jason A. MIX ,  Sai VADLAMANI ,  Tae Young YANG ,  Zhen ZHOU

IPC: H01L23/66 ,  H01Q9/42 ,  H01Q1/22 ,  H01Q9/36 ,  H01Q21/24 ,  H01L25/065 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L23/66 ,  H01Q9/42 ,  H01Q1/2283 ,  H01Q9/36 ,  H01Q21/24 ,  H01L25/0652 ,  H01L2924/1421 ,  H01L24/16 ,  H01L23/5381 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L25/0655

Abstract: In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.

公开(公告)号：US20220352622A1

公开(公告)日：2022-11-03

申请号：US17762749

申请日：2019-12-27

Applicant: Intel Corporation

Inventor： Debabani CHOUDHURY ,  Jose Rodrigo CAMACHO PEREZ ,  Shuhei YAMADA ,  Vida Ilderem BURGER ,  Bryce D. HORINE ,  Harry SKINNER

IPC: H01Q1/32 ,  H01Q3/34 ,  B60Q1/00

Abstract: Various antennas elements including antennas arrays can support various communication technologies and can be integrated into different components or subcomponents of a vehicle, including various vehicle light assemblies. The vehicular antennas elements include low profile and/or concealed antenna elements that are inconspicuous aesthetically and do not affect or substantially affect vehicle aerodynamics.