公开(公告)号：US20250093413A1

公开(公告)日：2025-03-20

申请号：US18963838

申请日：2024-11-29

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Renzhi LIU ,  Jong-Ru GUO ,  Kenneth P. FOUST ,  Jason A. MIX ,  Kai XIAO ,  Zuoguo WU ,  Daqiao DU

IPC: G01R31/302 ,  G01R31/28 ,  G01R31/303 ,  H01P3/08 ,  H01Q9/16 ,  H04B5/48

Abstract: A high volume manufacturing (HVM) test system including a test device defining an opening configured to receive a package under test, the test device including an external access agent (EAA) including: a first leaky surface wave launcher for near field wireless communication, the first leaky surface wave launcher configured to wirelessly provide sideband signals to and wirelessly receive the sideband signals from a silicon package agent physically positioned in a separate package as the EAA; and a first transceiver electrically coupled to the first leaky surface wave launcher, the first transceiver configured to: process the sideband signals received by the first leaky surface wave launcher; and generate the sideband signals for wireless transmission by the first leaky surface wave launcher.

公开(公告)号：US20230420396A1

公开(公告)日：2023-12-28

申请号：US18253954

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Tolga ACIKALIN ,  Arnaud AMADJIKPE ,  Brent R. CARLTON ,  Chia-Pin CHIU ,  Timothy F. COX ,  Kenneth P. FOUST ,  Bryce D. HORINE ,  Telesphor KAMGAING ,  Renzhi LIU ,  Jason A. MIX ,  Sai VADLAMANI ,  Tae Young YANG ,  Zhen ZHOU

IPC: H01L23/66 ,  H01Q9/42 ,  H01Q1/22 ,  H01Q9/36 ,  H01Q21/24 ,  H01L25/065 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L23/66 ,  H01Q9/42 ,  H01Q1/2283 ,  H01Q9/36 ,  H01Q21/24 ,  H01L25/0652 ,  H01L2924/1421 ,  H01L24/16 ,  H01L23/5381 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L25/0655

Abstract: In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.

公开(公告)号：US20220206064A1

公开(公告)日：2022-06-30

申请号：US17133659

申请日：2020-12-24

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Renzhi LIU ,  Jong-Ru GUO ,  Kenneth P. FOUST ,  Jason A. MIX ,  Kai XIAO ,  Zuoguo WU ,  Daqiao DU

IPC: G01R31/302 ,  H01P3/08 ,  H01Q9/16 ,  H04B5/02 ,  G01R31/28 ,  G01R31/303

Abstract: A package substrate may include a circuit and a leaky surface wave launcher. The circuit may perform engineering tests and end-user operations using sideband signals. The leaky surface wave launcher may perform near field wireless communication. The leaky surface wave launcher may include a via and a strip line. The via may be electrically coupled to the circuit. The via may provide the sideband signals to and receive the sideband signals from the circuit. The strip line may be electrically coupled to the via. The strip line may be excited by the sideband signals to wirelessly couple the leaky surface wave launcher with an external device. The strip line and the via may be unbalanced such that the strip line generates a leaky wave that propagates at least a portion of the package substrate and an environment proximate the package substrate.