公开(公告)号：US11929330B2

公开(公告)日：2024-03-12

申请号：US17712944

申请日：2022-04-04

Applicant: Intel Corporation

Inventor： Kristof Darmawikarta ,  Hiroki Tanaka ,  Robert May ,  Sameer Paital ,  Bai Nie ,  Jesse Jones ,  Chung Kwang Christopher Tan

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L23/22 ,  H01L23/522 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/538 ,  H01L23/5226 ,  H01L23/5381 ,  H01L24/82 ,  H01L2224/12105

Abstract: Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.

公开(公告)号：US11923312B2

公开(公告)日：2024-03-05

申请号：US16366661

申请日：2019-03-27

Applicant: Intel Corporation

Inventor： Bai Nie ,  Gang Duan ,  Srinivas Pietambaram ,  Jesse Jones ,  Yosuke Kanaoka ,  Hongxia Feng ,  Dingying Xu ,  Rahul Manepalli ,  Sameer Paital ,  Kristof Darmawikarta ,  Yonggang Li ,  Meizi Jiao ,  Chong Zhang ,  Matthew Tingey ,  Jung Kyu Han ,  Haobo Chen

IPC: H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/5381 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/214 ,  H01L2924/3511 ,  H01L2924/381

Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.

公开(公告)号：US11322444B2

公开(公告)日：2022-05-03

申请号：US15934343

申请日：2018-03-23

Applicant: Intel Corporation

Inventor： Kristof Darmawikarta ,  Hiroki Tanaka ,  Robert May ,  Sameer Paital ,  Bai Nie ,  Jesse Jones ,  Chung Kwang Christopher Tan

IPC: H01L23/538 ,  H01L23/522 ,  H01L23/00 ,  H01L25/00 ,  H01L21/48 ,  H01L25/065

Abstract: Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.