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    Method of fabrication for a socket with embedded conductive structure
    2.
    发明申请
    Method of fabrication for a socket with embedded conductive structure 失效
    具有嵌入式导电结构的插座的制造方法

    公开(公告)号：US20020151218A1

    公开(公告)日：2002-10-17

    申请号：US10176302

    申请日：2002-06-20

    Applicant: Intel Corporation

    Inventor： David G. Figueroa ,  Chee-Yee Chung ,  Kristopher Frutschy ,  Farzaneh Yahyaei-Moayyed

    IPC: H01R013/648 ,  H01R043/02

    CPC classification number: H01R13/6585 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49211 ,  Y10T29/49222

    Abstract: A socket (300, FIG. 3) includes a housing (302) with multiple openings (304) formed in the top surface. Each opening (304) provides access to conductive contacts (502, FIG. 5), which provide an electrical interface between a device that is inserted into the socket and the next level of interconnect (e.g., a PC board). Embedded within the socket is a conductive structure (310, FIG. 3). In one embodiment, the conductive structure is electrically connected to one or more ground conducting contacts (708, FIG. 7B). The conductive structure includes column walls (312), which run in parallel with columns of contacts, and row walls (314), which run in parallel with rows of contacts and which intersect the column walls. In this manner, the conductive structure forms multiple chambers (402, FIG. 4). Each signal carrying and power conducting contact is positioned within a chamber. Accordingly, the walls of the conductive structure function as a ground plane that surrounds the signal carrying and power conducting contacts.

    Abstract translation: 插座（300，图3）包括具有形成在顶表面中的多个开口（304）的壳体（302）。 每个开口（304）提供对导电触点（502，图5）的访问，其提供插入到插座中的装置与下一级互连（例如，PC板）之间的电接口。 嵌入在插座内的是导电结构（图3中的310）。 在一个实施例中，导电结构电连接到一个或多个接地导电触头（图7B的708）。 导电结构包括与触点列平行延伸的柱壁（312）和平行于触点行并与柱壁相交的行壁（314）。 以这种方式，导电结构形成多个室（图4中的402）。 每个信号承载和电力传导触点位于一个室内。 因此，导电结构的壁用作围绕信号承载和电力传导触点的接地平面。

    Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
    3.
    发明申请
    Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment 失效

    公开(公告)号：US20020080584A1

    公开(公告)日：2002-06-27

    申请号：US09970954

    申请日：2001-10-04

    Applicant: Intel Corporation.

    Inventor： Ravi Prasher ,  Abhay A. Watwe ,  Gregory M. Chrysler ,  Kristopher Frutschy ,  Leo Ofman ,  Ajit V. Sathe

    IPC: H05K007/20

    CPC classification number: H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.

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