公开(公告)号：US20230090350A1

公开(公告)日：2023-03-23

申请号：US17478439

申请日：2021-09-17

申请人： Intel Corporation

发明人： Kyle MCELHINNY ,  Haobo CHEN ,  Hongxia FENG ,  Xiaoying GUO ,  Leonel ARANA

IPC分类号： H01L23/538 ,  H01L23/498 ,  H01L21/48 ,  H01L25/065 ,  H01L23/00

摘要： Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a package substrate, and a first pad over the package substrate. In an embodiment, a layer is over the package substrate, where the layer is an insulating material. In an embodiment, the electronic package further comprises a via through the layer and in contact with the first pad. In an embodiment a first end of the via has a first width and a second end of the via that is in contact with the first pad has a second width that is larger than the first width. In an embodiment, the electronic package further comprises a second pad over the via.

公开(公告)号：US20240105580A1

公开(公告)日：2024-03-28

申请号：US17953213

申请日：2022-09-26

申请人： Intel Corporation

发明人： Kristof DARMAWIKARTA ,  Srinivas V. PIETAMBARAM ,  Kyle MCELHINNY ,  Hiroki TANAKA

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/13 ,  H01L23/15

CPC分类号： H01L23/49866 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49838

摘要： Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a core, and a pad over the core. In an embodiment, a shell is around the core, and a surface finish is over the shell. In an embodiment, the electronic package further comprises a solder resist over the pad, where an opening is formed through the solder resist to expose the surface finish.

公开(公告)号：US20240105576A1

公开(公告)日：2024-03-28

申请号：US17953210

申请日：2022-09-26

申请人： Intel Corporation

发明人： Kyle MCELHINNY ,  Xiaoying GUO ,  Hiroki TANAKA ,  Haobo CHEN

IPC分类号： H01L23/498 ,  C25D3/12 ,  C25D3/48 ,  C25D3/50 ,  C25D7/12 ,  H01L21/48

CPC分类号： H01L23/49838 ,  C25D3/12 ,  C25D3/48 ,  C25D3/50 ,  C25D7/123 ,  H01L21/481 ,  H01L21/4846 ,  H01L23/49866 ,  H01L24/16

摘要： Embodiments disclosed herein include package substrates and methods of forming package substrates. In an embodiment, the package substrate comprises a core and a pad over the core. In an embodiment, a solder resist is over the pad, and an opening into the solder resist exposes a portion of the pad. In an embodiment, the package substrate further comprises a surface finish over the pad and within the opening.

公开(公告)号：US20240105575A1

公开(公告)日：2024-03-28

申请号：US17953206

申请日：2022-09-26

申请人： Intel Corporation

发明人： Jason M. GAMBA ,  Haifa HARIRI ,  Kristof DARMAWIKARTA ,  Srinivas V. PIETAMBARAM ,  Hiroki TANAKA ,  Kyle MCELHINNY ,  Xiaoying GUO ,  Steve S. CHO ,  Ali LEHAF ,  Haobo CHEN ,  Bai NIE ,  Numair AHMED

IPC分类号： H01L23/498 ,  C25D3/12 ,  C25D3/48 ,  C25D3/50 ,  C25D7/12 ,  H01L21/48

CPC分类号： H01L23/49838 ,  C25D3/12 ,  C25D3/48 ,  C25D3/50 ,  C25D7/123 ,  H01L21/481 ,  H01L21/4846 ,  H01L23/49866 ,  H01L24/16

摘要： Embodiments disclosed herein include package substrates and methods of forming package substrates. In an embodiment, the package substrate comprises a core, and a pad over the core, where the pad has a first width. In an embodiment, a surface finish is over the pad, where the surface finish has a second width that is substantially equal to the first width. In an embodiment, the package substrate further comprises a solder resist over the pad, where the solder resist comprises an opening that exposes a portion of the surface finish. In an embodiment, the opening has a third width that is smaller than the second width.