公开(公告)号：US20250038163A1

公开(公告)日：2025-01-30

申请号：US18917500

申请日：2024-10-16

Applicant: Intel Corporation

Inventor： Zhichao ZHANG ,  Kemal AYGÜN ,  Suresh V. POTHUKUCHI ,  Xiaoqian LI ,  Omkar KARHADE

IPC: H01L25/18 ,  G02B6/42 ,  H01L23/373 ,  H01L23/538 ,  H01L25/00

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to disaggregating co-packaged SOC and photonic integrated circuits on an multichip package. The photonic integrated circuits may also be silicon photonics engines. In embodiments, multiple SOCs and photonic integrated circuits may be electrically coupled, respectively, into modules, with multiple modules then incorporated into an MCP using a stacked die structure. Other embodiments may be described and/or claimed.

公开(公告)号：US20220199600A1

公开(公告)日：2022-06-23

申请号：US17132976

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Zhichao ZHANG ,  Kemal AYGÜN ,  Suresh V. POTHUKUCHI ,  Xiaoqian LI ,  Omkar KARHADE

IPC: H01L25/18 ,  H01L25/00 ,  G02B6/42

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to disaggregating co-packaged SOC and photonic integrated circuits on an multichip package. The photonic integrated circuits may also be silicon photonics engines. In embodiments, multiple SOCs and photonic integrated circuits may be electrically coupled, respectively, into modules, with multiple modules then incorporated into an MCP using a stacked die structure. Other embodiments may be described and/or claimed.

公开(公告)号：US20220155539A1

公开(公告)日：2022-05-19

申请号：US16953146

申请日：2020-11-19

Applicant: Intel Corporation

Inventor： Srinivas V. PIETAMBARAM ,  Brandon C. MARIN ,  Sameer PAITAL ,  Sai VADLAMANI ,  Rahul N. MANEPALLI ,  Xiaoqian LI ,  Suresh V. POTHUKUCHI ,  Sujit SHARAN ,  Arnab SARKAR ,  Omkar KARHADE ,  Nitin DESHPANDE ,  Divya PRATAP ,  Jeremy ECTON ,  Debendra MALLIK ,  Ravindranath V. MAHAJAN ,  Zhichao ZHANG ,  Kemal AYGÜN ,  Bai NIE ,  Kristof DARMAWIKARTA ,  James E. JAUSSI ,  Jason M. GAMBA ,  Bryan K. CASPER ,  Gang DUAN ,  Rajesh INTI ,  Mozhgan MANSURI ,  Susheel JADHAV ,  Kenneth BROWN ,  Ankar AGRAWAL ,  Priyanka DOBRIYAL

IPC: G02B6/42

Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.

公开(公告)号：US20220085001A1

公开(公告)日：2022-03-17

申请号：US17539088

申请日：2021-11-30

Applicant: Intel Corporation

Inventor： Suresh V. POTHUKUCHI ,  Andrew ALDUINO ,  Ravindranath V. MAHAJAN ,  Srikant NEKKANTY ,  Ling LIAO ,  Harinadh POTLURI ,  David M. BOND ,  Sushrutha Reddy GUJJULA ,  Donald Tiendung TRAN ,  David HUI ,  Vladimir TAMARKIN

IPC: H01L25/16 ,  H01L23/367 ,  H01L23/40 ,  H01L23/473 ,  H01L23/538 ,  H04Q11/00

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

公开(公告)号：US20210280566A1

公开(公告)日：2021-09-09

申请号：US16809515

申请日：2020-03-04

Applicant: Intel Corporation

Inventor： Suresh V. POTHUKUCHI ,  Andrew ALDUINO ,  Ravindranath V. MAHAJAN ,  Srikant NEKKANTY ,  Ling LIAO ,  Harinadh POTLURI ,  David M. BOND ,  Sushrutha Reddy GUJJULA ,  Donald Tiendung TRAN ,  David HUI ,  Vladimir TAMARKIN

IPC: H01L25/16 ,  H01L23/538 ,  H01L23/367 ,  H01L23/473 ,  H01L23/40 ,  H04Q11/00

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.