公开(公告)号：US20180226310A1

公开(公告)日：2018-08-09

申请号：US15748138

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Feras EID ,  Adel A. ELSHERBINI ,  Henning BRAUNISCH ,  Yidnekachew MEKONNEN ,  Krishna BHARATH ,  Mathew J. MANUSHAROW ,  Aleksandar ALEKSOV ,  Nathan FRITZ

IPC: H01L23/14 ,  H01L21/48 ,  H01L23/473 ,  H01L23/538 ,  H01L23/492

CPC classification number: H01L23/147 ,  H01L21/486 ,  H01L21/4871 ,  H01L23/12 ,  H01L23/473 ,  H01L23/492 ,  H01L23/5389

Abstract: Embodiments of the invention include package substrates that include microchannels and methods of making such package substrates. In an embodiment, the package substrate may include a first package layer. In some embodiments, a bottom channel wall may be formed over the first package layer. Embodiments may also include a channel sidewall that is formed in contact with the bottom channel wall. An organic dielectric layer may be formed over the first package layer. However, embodiments include a package substrate where the dielectric layer is not present within a perimeter of the channel sidewall. Additionally, a top channel wall may be supported by the channel sidewall. According to an embodiment, the top channel wall, the channel sidewall, and the bottom channel wall define a microchannel.