TOOLS AND METHODS FOR SURFACE LEVELING
    2.
    发明公开

    公开(公告)号:US20240282591A1

    公开(公告)日:2024-08-22

    申请号:US18171683

    申请日:2023-02-21

    CPC classification number: H01L21/486 C23F1/02

    Abstract: The present disclosure is directed to a planarization tool having at least one module with a target holder for supporting a target with a metal layer, at least one of a plurality of etch inhibitor dispensers for discharging an etch inhibitor toward the target, and a plurality of nozzles for discharging a chemical etchant at an angle towards the target to perform selective removal of the metal layer for planarization of the target. In an aspect, the plurality of etch inhibitor dispensers and the plurality of nozzles may be combined as a single unit to discharge the chemical etchant and the etch inhibitor together. In another aspect, the plurality of etch inhibitor dispensers and the plurality of nozzles may be configured in a single module or separate modules.

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