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1.发明申请公开(公告)号：US20220113092A1
公开(公告)日：2022-04-14
申请号：US17560070
申请日：2021-12-22
申请人： Intel Corporation
发明人： Jeff Ku , Baomin Liu , Cora Nien
摘要： Particular embodiments described herein provide for an electronic device that can be configured to include a first support structure that includes a first heat source, a second support structure that includes a second heat source, and a heat pipe that has a first side and an opposite second side, where the first heat source is coupled to the first side of the heat pipe and the second heat source is coupled to the second side of the heat pipe. In some examples, the heat pipe can be a vapor chamber.
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公开(公告)号：US20210112679A1
公开(公告)日：2021-04-15
申请号：US17130689
申请日：2020-12-22
申请人： Intel Corporation
IPC分类号： H05K7/20
摘要： Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a plurality of heat sources on the substrate, a heat spreader that extends over the plurality of heat sources, and a plurality of heat spreader mounting brackets. Each of the plurality of heat spreader mounting brackets are over a corresponding heat source from the plurality of heat sources and the plurality of heat spreaders secure the heat spreader to the substrate without extending through the heat spreader. In some examples, the heat spreader is a vapor chamber and the plurality of heat spreader mounting brackets are soldered to the vapor chamber.
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公开(公告)号：US20240314921A1
公开(公告)日：2024-09-19
申请号：US18121297
申请日：2023-03-14
申请人： Intel Corporation
发明人： Jeff Ku , Baomin Liu , Cora Nien , Min Suet Lim , Tongyan Zhai
CPC分类号： H05K1/0209 , F16K31/504 , H05K7/20254 , H05K2201/0209
摘要： Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second side opposite the first side. The second cooling plate is fluidically coupled with the first cooling plate.
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公开(公告)号：US11073878B2
公开(公告)日：2021-07-27
申请号：US15957874
申请日：2018-04-19
申请人： INTEL CORPORATION
发明人： Baomin Liu , Eduardo Escamilla , James Utz
摘要： Particular embodiments described herein provide for a device that can include at least one heat source and a vapor chamber, where the vapor chamber is bigger than the at least one heat source and a portion of the vapor chamber is in direct contact with the at least one heat source, where the portion of the vapor chamber in direct contact with the at least one heat source does not include a stiffener. In an example, the device can include a first air mover on a first side of the at least one heat source and a second air mover on an opposite side of the at least one heat source. Exhaust from the first air mover can pass through a vented foot and exhaust from the second air mover can pass through a second vented foot.
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公开(公告)号：US20190072999A1
公开(公告)日：2019-03-07
申请号：US15698183
申请日：2017-09-07
申请人： Intel Corporation
发明人： Eduardo Escamilla , James Utz , Baomin Liu
摘要： Illustrative examples include a docking system for a foldable electronic device such as a 2-in-1 convertible computer. The docking system may include a housing having an engagement surface to interface with a portion of the foldable electronic device when the foldable electronic device is operably engaged with the docking system. The engagement surface may include a vent opening arranged to direct airflow in between a first portion and a second portion of the plurality of portions, and a separator to maintain separation between the first portion and the second portion when the foldable electronic device is operably engaged with the engagement surface. A blower coupled to the housing may supply airflow through the vent opening.
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公开(公告)号：US20210349509A1
公开(公告)日：2021-11-11
申请号：US17384536
申请日：2021-07-23
申请人： Intel Corporation
发明人： James Utz , Baomin Liu , Eduardo Escamilla
摘要： Particular embodiments described herein provide for a device that can include at least one heat source and a vapor chamber, where the vapor chamber is bigger than the at least one heat source and a portion of the vapor chamber is in direct contact with the at least one heat source, where the portion of the vapor chamber in direct contact with the at least one heat source does not include a stiffener. In an example, the device can include a first air mover on a first side of the at least one heat source and a second air mover on an opposite side of the at least one heat source. Exhaust from the first air mover can pass through a vented foot and exhaust from the second air mover can pass through a second vented foot.
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公开(公告)号：US10768676B2
公开(公告)日：2020-09-08
申请号：US15698183
申请日：2017-09-07
申请人： Intel Corporation
发明人： Baomin Liu , Eduardo Escamilla , James Utz
摘要： Illustrative examples include a docking system for a foldable electronic device such as a 2-in-1 convertible computer. The docking system may include a housing having an engagement surface to interface with a portion of the foldable electronic device when the foldable electronic device is operably engaged with the docking system. The engagement surface may include a vent opening arranged to direct airflow in between a first portion and a second portion of the plurality of portions, and a separator to maintain separation between the first portion and the second portion when the foldable electronic device is operably engaged with the engagement surface. A blower coupled to the housing may supply airflow through the vent opening.
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公开(公告)号：US20190050031A1
公开(公告)日：2019-02-14
申请号：US15957874
申请日：2018-04-19
申请人： INTEL CORPORATION
发明人： James Utz , Baomin Liu , Eduardo Escamilla
摘要： Particular embodiments described herein provide for a device that can include at least one heat source and a vapor chamber, where the vapor chamber is bigger than the at least one heat source and a portion of the vapor chamber is in direct contact with the at least one heat source, where the portion of the vapor chamber in direct contact with the at least one heat source does not include a stiffener. In an example, the device can include a first air mover on a first side of the at least one heat source and a second air mover on an opposite side of the at least one heat source. Exhaust from the first air mover can pass through a vented foot and exhaust from the second air mover can pass through a second vented foot.
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