公开(公告)号：US20210408285A1

公开(公告)日：2021-12-30

申请号：US16913294

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Ryan HICKEY ,  Glenn A. GLASS ,  Anand S. MURTHY ,  Rushabh SHAH ,  Ju-Hyung NAM

IPC: H01L29/78 ,  H01L29/423 ,  H01L29/786

Abstract: Gate-all-around integrated circuit structures having germanium-doped nanowire/nanoribbon channel structures, and methods of fabricating gate-all-around integrated circuit structures having germanium-doped nanowire/nanoribbon channel structures, are described. For example, an integrated circuit structure includes a vertical arrangement of nanowires above a substrate. Individual ones of the vertical arrangement of nanowires have a relatively higher germanium concentration at a lateral mid-point of the nanowire than at lateral ends of the nanowire.

公开(公告)号：US20230087399A1

公开(公告)日：2023-03-23

申请号：US17482880

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： Debaleena NANDI ,  Cory BOMBERGER ,  Rushabh SHAH ,  Gilbert DEWEY ,  Nazila HARATIPOUR ,  Mauro J. KOBRINSKY ,  Anand S. MURTHY ,  Tahir GHANI

IPC: H01L27/088 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/66

Abstract: Gate-all-around integrated circuit structures having confined epitaxial source or drain structures, are described. For example, an integrated circuit structure includes a plurality of nanowires above a sub-fin. A gate stack is over the plurality of nanowires and the sub-fin. Epitaxial source or drain structures are on opposite ends of the plurality of nanowires. The epitaxial source or drain structures comprise i) a first PMOS epitaxial (pEPI) region of germanium and boron, ii) a second pEPI region of silicon, germanium and boron on the first pEPI region at a contact location, iii) a capping layer comprising silicon over the second pEPI region. A conductive contact material comprising titanium is on the capping layer.

公开(公告)号：US20220416050A1

公开(公告)日：2022-12-29

申请号：US17359327

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Debaleena NANDI ,  Cory BOMBERGER ,  Gilbert DEWEY ,  Anand S. MURTHY ,  Mauro KOBRINSKY ,  Rushabh SHAH ,  Chi-Hing CHOI ,  Harold W. KENNEL ,  Omair SAADAT ,  Adedapo A. ONI ,  Nazila HARATIPOUR ,  Tahir GHANI

IPC: H01L29/45 ,  H01L29/08 ,  H01L29/161 ,  H01L29/78 ,  H01L29/06 ,  H01L29/423 ,  H01L29/786

Abstract: Embodiments disclosed herein include semiconductor devices with improved contact resistances. In an embodiment, a semiconductor device comprises a semiconductor channel, a gate stack over the semiconductor channel, a source region on a first end of the semiconductor channel, a drain region on a second end of the semiconductor channel, and contacts over the source region and the drain region. In an embodiment, the contacts comprise a silicon germanium layer, an interface layer over the silicon germanium layer, and a titanium layer over the interface layer.

公开(公告)号：US20230101725A1

公开(公告)日：2023-03-30

申请号：US17485167

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Debaleena NANDI ,  Mauro J. KOBRINSKY ,  Gilbert DEWEY ,  Chi-hing CHOI ,  Harold W. Kennel ,  Brian J. KRIST ,  Ashkar ALIYARUKUNJU ,  Cory BOMBERGER ,  Rushabh SHAH ,  Rishabh MEHANDRU ,  Stephen M. CEA ,  Chanaka MUNASINGHE ,  Anand S. MURTHY ,  Tahir GHANI

IPC: H01L29/423 ,  H01L29/06 ,  H01L29/786

Abstract: Gate-all-around integrated circuit structures having confined epitaxial source or drain structures, are described. For example, an integrated circuit structure includes a plurality of nanowires above a sub-fin. A gate stack is over the plurality of nanowires and the sub-fin. Epitaxial source or drain structures are on opposite ends of the plurality of nanowires. The epitaxial source or drain structures comprise germanium and boron, and a protective layer comprises silicon, and germanium that at least partially covers the epitaxial source or drain structures. A conductive contact comprising titanium silicide is on the epitaxial source or drain structures.

公开(公告)号：US20220416043A1

公开(公告)日：2022-12-29

申请号：US17359422

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Cory BOMBERGER ,  Anand S. MURTHY ,  Rushabh SHAH ,  Kevin COOK ,  Anupama BOWONDER

IPC: H01L29/423 ,  H01L29/06 ,  H01L29/786 ,  H01L29/08 ,  H01L29/417

Abstract: Gate-all-around integrated circuit structures having confined epitaxial source or drain structures, are described. For example, an integrated circuit structure includes a plurality of nanowires above a sub-fin. A gate stack is over the plurality of nanowires and the sub-fin. Epitaxial source or drain structures are on opposite ends of the plurality of nanowires. The epitaxial source or drain structures comprise germanium and boron, and a protective layer comprising germanium, silicon and boron that at least partially covers the epitaxial source or drain structures to provide low contact resistivity.