公开(公告)号：US09943931B2

公开(公告)日：2018-04-17

申请号：US15221102

申请日：2016-07-27

申请人： Intel Corporation

发明人： Zhihua Li ,  Hemanth K. Dhavaleswarapu ,  Joseph B. Petrini ,  Shankar Devasenathipathy ,  Steven B. Roach ,  Ioan Sauciuc ,  Pranav K. Desai ,  George S. Kostiew ,  Sanjoy K. Saha

IPC分类号： B23K37/00 ,  B23K3/08 ,  H01L23/00 ,  H05K3/34 ,  B23K20/02 ,  F25B21/02

CPC分类号： B23K37/003 ,  B23K3/085 ,  B23K20/023 ,  F25B21/02 ,  F25B2321/0251 ,  H01L24/13 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/291 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/81203 ,  H01L2224/83203 ,  H05K3/34 ,  H01L2924/014

摘要： Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.

公开(公告)号：US20170014957A1

公开(公告)日：2017-01-19

申请号：US15221102

申请日：2016-07-27

申请人： Intel Corporation

发明人： Zhihua Li ,  Hemanth K. Dhavaleswarapu ,  Joseph B. Petrini ,  Shankar Devasenathipathy ,  Steven B. Roach ,  Ioan Sauciuc ,  Pranav K. Desai ,  George S. Kostiew ,  Sanjoy K. Saha

IPC分类号： B23K37/00 ,  H05K3/34 ,  B23K20/02 ,  H01L23/00 ,  F25B21/02 ,  B23K3/08

CPC分类号： B23K37/003 ,  B23K3/085 ,  B23K20/023 ,  F25B21/02 ,  F25B2321/0251 ,  H01L24/13 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/291 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/81203 ,  H01L2224/83203 ,  H05K3/34 ,  H01L2924/014

摘要： Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.

摘要翻译： 描述了热压接瞬态冷却方案的各种实施例。 这些实施例包括耦合到加热器表面的垂直分离的微通道的阵列，其中每个出口微通道包括两个相邻的入口微通道，并且其中入口和出口歧管联接到微通道阵列，并且其中加热器表面 并且微通道在同一块内耦合。