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公开(公告)号：US09293428B2
公开(公告)日：2016-03-22
申请号：US13706986
申请日：2012-12-06
申请人： Intel Corporation
发明人： Ioan Sauciuc
CPC分类号： H01L24/03 , G06F1/203 , H01L23/36 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/0401 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/29393 , H01L2224/32225 , H01L2224/32245 , H01L2224/83424 , H01L2224/83447 , H01L2924/15153 , H01L2924/15159 , H01L2924/15162 , H01L2924/1517 , H01L2924/15724 , H01L2924/15747 , H01L2924/00014 , H01L2924/01006
摘要： Embodiments of semiconductor chip assemblies, and methods are shown that include adhesive thermal interface materials between a heat spreader and a semiconductor die. Assemblies and methods are shown where the heat spreader is not adhered to a substrate beneath the semiconductor die.
摘要翻译： 示出了半导体芯片组件的实施例和方法，其包括在散热器和半导体管芯之间的粘合剂热界面材料。 显示组件和方法，其中散热器不粘附到半导体管芯下面的衬底。
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2.发明授权公开(公告)号：US09943931B2
公开(公告)日：2018-04-17
申请号：US15221102
申请日：2016-07-27
申请人： Intel Corporation
发明人： Zhihua Li , Hemanth K. Dhavaleswarapu , Joseph B. Petrini , Shankar Devasenathipathy , Steven B. Roach , Ioan Sauciuc , Pranav K. Desai , George S. Kostiew , Sanjoy K. Saha
CPC分类号： B23K37/003 , B23K3/085 , B23K20/023 , F25B21/02 , F25B2321/0251 , H01L24/13 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/291 , H01L2224/75252 , H01L2224/75301 , H01L2224/75502 , H01L2224/81203 , H01L2224/83203 , H05K3/34 , H01L2924/014
摘要： Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
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3.发明授权公开(公告)号：US09448278B2
公开(公告)日：2016-09-20
申请号：US14746764
申请日：2015-06-22
申请人： INTEL CORPORATION
发明人： Christopher R. Schroeder , Christopher W. Ackerman , James C. Shipley , Tolga Acikalin , Ioan Sauciuc , Michael L. Rutigliano , James G. Maveety , Ashish Gupta
IPC分类号： G01R31/28 , G01R31/26 , G06F1/20 , H01L23/473 , H01L23/467 , F28F3/12
CPC分类号： G01R31/2875 , F28F3/12 , G01R31/2642 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.
摘要翻译： 测试半导体装置的装置包括保持至少一个传热流体单元的基座。 至少一个传热流体单元包括包括供给孔横截面的流体供应结构以及包括回流孔横截面的流体返回结构。 供应孔横截面大于回流孔横截面。 模具界面也被包括为液体不可渗透的材料。
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4.发明申请公开(公告)号：US20170014957A1
公开(公告)日：2017-01-19
申请号：US15221102
申请日：2016-07-27
申请人： Intel Corporation
发明人： Zhihua Li , Hemanth K. Dhavaleswarapu , Joseph B. Petrini , Shankar Devasenathipathy , Steven B. Roach , Ioan Sauciuc , Pranav K. Desai , George S. Kostiew , Sanjoy K. Saha
CPC分类号： B23K37/003 , B23K3/085 , B23K20/023 , F25B21/02 , F25B2321/0251 , H01L24/13 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/291 , H01L2224/75252 , H01L2224/75301 , H01L2224/75502 , H01L2224/81203 , H01L2224/83203 , H05K3/34 , H01L2924/014
摘要： Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
摘要翻译： 描述了热压接瞬态冷却方案的各种实施例。 这些实施例包括耦合到加热器表面的垂直分离的微通道的阵列，其中每个出口微通道包括两个相邻的入口微通道，并且其中入口和出口歧管联接到微通道阵列，并且其中加热器表面 并且微通道在同一块内耦合。
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