公开(公告)号：US20180263117A1

公开(公告)日：2018-09-13

申请号：US15810800

申请日：2017-11-13

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Robert L. Sankman ,  Charles Gealer ,  Omkar Karhade ,  John S. Guzek ,  Ravindranath V. Mahajan ,  James C. Matayabas, JR. ,  Johanna M. Swan ,  Feras Eid ,  Shawna Liff ,  Timothy McIntosh ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Kemal Aygun

IPC: H05K1/18 ,  H01L23/00

CPC classification number: H05K1/189 ,  G06F1/163 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/185 ,  H05K13/0469 ,  H05K2201/0137 ,  H05K2203/1469 ,  Y10T29/49146 ,  H01L2924/00

Abstract: This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.

公开(公告)号：US09820384B2

公开(公告)日：2017-11-14

申请号：US14102676

申请日：2013-12-11

Applicant: Intel Corporation

Inventor： Sasha Oster ,  Robert L. Sankman ,  Charles Gealer ,  Omkar Karhade ,  John S. Guzek ,  Ravi V. Mahajan ,  James C. Matayabas, Jr. ,  Johanna Swan ,  Feras Eid ,  Shawna Liff ,  Timothy McIntosh ,  Telesphor Kamgaing ,  Adel Elsherbini ,  Kemal Aygun

IPC: H05K1/18 ,  H05K13/04 ,  H01L23/00 ,  H05K1/03 ,  G06F1/16 ,  H01L21/56

CPC classification number: H05K1/189 ,  G06F1/163 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/185 ,  H05K13/0469 ,  H05K2201/0137 ,  H05K2203/1469 ,  Y10T29/49146 ,  H01L2924/00

Abstract: This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.