公开(公告)号：US12284793B2

公开(公告)日：2025-04-22

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu Bawa ,  Ruander Cardenas ,  Kathiravan D ,  Jia Yan Go ,  Chin Kung Goh ,  Jeff Ku ,  Prakash Kurma Raju ,  Baomin Liu ,  Twan Sing Loo ,  Mikko Makinen ,  Columbia Mishra ,  Juha Paavola ,  Prasanna Pichumani ,  Daniel Ragland ,  Kannan Raja ,  Khal Ern See ,  Javed Shaikh ,  Gokul Subramaniam ,  George Baoci Sun ,  Xiyong Tian ,  Hua Yang ,  Mark Carbone ,  Vivek Paranjape ,  Nehakausar Pinjari ,  Hari Shanker Thakur ,  Christopher Moore ,  Gustavo Fricke ,  Justin Huttula ,  Gavin Sung ,  Sammi Wy Liu ,  Arnab Sen ,  Chun-Ting Liu ,  Jason Y. Jiang ,  Gerry Juan ,  Shih Wei Nien ,  Lance Lin ,  Evan Kuklinski

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/34

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US12117876B2

公开(公告)日：2024-10-15

申请号：US17100849

申请日：2020-11-21

Applicant: Intel Corporation

Inventor： Prakash Kurma Raju ,  Samarth Alva ,  Bhavaneeswaran Anbalagan ,  Triplicane Gopikrishnan Babu ,  Prasanna Pichumani ,  Raghavendra Doddi ,  Sudheera Sudhakar ,  Ritu Bawa

IPC: G06F1/16 ,  G06F1/20

CPC classification number: G06F1/1681 ,  G06F1/1618 ,  G06F1/203 ,  G06F2200/203

Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.

公开(公告)号：US20240334715A1

公开(公告)日：2024-10-03

申请号：US18126833

申请日：2023-03-27

Applicant: Intel Corporation

Inventor： Navneet Kumar Singh ,  Phani Alaparthi ,  Samarth Alva ,  Ritu Bawa ,  Gaurav Hada ,  Aiswarya M. Pious

IPC: H10B80/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L25/065 ,  H01L25/18

CPC classification number: H10B80/00 ,  H01L23/315 ,  H01L23/481 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2225/06572

Abstract: Technologies for memory on package with reduced package thickness are disclosed. In the illustrative embodiment, a die assembly includes a substrate with a processor die mounted on the top surface and a memory die mounted on the bottom surface. The die assembly is mounted on another substrate, such as a mainboard. A cavity is defined in the mainboard, and the memory die mounted on the bottom surface of the die assembly is positioned in the cavity. Positioning the memory die on the bottom surface of the die assembly can reduce the overall thickness of the die assembly and, therefore, can reduce the overall thickness of a device that incorporates the die assembly.

公开(公告)号：US11573055B2

公开(公告)日：2023-02-07

申请号：US16728812

申请日：2019-12-27

Applicant: Intel Corporation

Inventor： Juha Tapani Paavola ,  Mark Carbone ,  Vivek Paranjape ,  Prakash Kurma Raju ,  Mikko Antero Makinen ,  Christopher M. Moore ,  Gustavo Fricke ,  Kathiravan D ,  Ritu Bawa ,  Nehakausar Shaikh Ramjan Pinjari ,  Hari Shanker Thakur

IPC: F28D15/04 ,  H01L23/427 ,  H05K7/20

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.

公开(公告)号：US20220225536A1

公开(公告)日：2022-07-14

申请号：US17711821

申请日：2022-04-01

Applicant: The Intel Corporation

Inventor： Arunpandi R. ,  Kathiravan D ,  Triplicane Gopikrishnan Babu ,  Doddi Raghavendra ,  Ritu Bawa ,  Bijendra Singh

IPC: H05K7/20 ,  G06F1/20

Abstract: Synthetic jet systems and related methods are disclosed. An electronic device includes a heat spreader including a first surface and a second surface opposite the first surface. A synthetic jet is coupled to the first surface of the heat spreader. The synthetic jet and the heat spreader define a fluid flow passageway having an inlet, a first outlet and a second outlet. The synthetic jet and the heat spreader to bifurcate airflow from the inlet such that the first outlet is to exhaust airflow from the passageway adjacent the first surface of the heat spreader and the second outlet is to exhaust airflow from the passageway adjacent the second surface of the heat spreader.

公开(公告)号：US20210103317A1

公开(公告)日：2021-04-08

申请号：US17100849

申请日：2020-11-21

Applicant: Intel Corporation

Inventor： Prakash Kurma Raju ,  Samarth Alva ,  Bhavaneeswaran Anbalagan ,  Triplicane Gopikrishnan Babu ,  Prasanna Pichumani ,  Raghavendra Doddi ,  Sudheera Sudhakar ,  Ritu Bawa

IPC: G06F1/16 ,  G06F1/20

Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.