PLANAR CONTACT WITH SOLDER
    5.
    发明申请
    PLANAR CONTACT WITH SOLDER 有权
    平面与焊接接触

    公开(公告)号:US20100236815A1

    公开(公告)日:2010-09-23

    申请号:US12727146

    申请日:2010-03-18

    Applicant: Jack Seidler

    Inventor: Jack Seidler

    Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

    Abstract translation: 将可回流元件固定在电触点上的方法。 该方法包括提供具有多个电触点的条带,每个触点包括接触体和远离接触体延伸的尾部。 然后将触头的尾部设置在细长的可回流构件附近。 细长可回流构件被推到多个触点的尾部。 随后,细长可回流构件被切割成多个单独的可回流元件,每个可回流元件对应于尾部中的一个。 与附接到其上的可回流元件的电接触与条分离。

    Lead(Pb)-free electronic component attachment
    7.
    发明授权
    Lead(Pb)-free electronic component attachment 有权
    无铅(Pb)电子元件附件

    公开(公告)号:US07630210B2

    公开(公告)日:2009-12-08

    申请号:US11604710

    申请日:2006-11-28

    Abstract: A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb)-free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. To further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.

    Abstract translation: 用于电子部件的接触尾部,其可用于使用导电粘合剂附接部件,其可以是无铅(Pb)。 接触尾部被冲压,提供相对低的制造成本和高精度。 接触尾部具有每单位长度具有大的表面积的远端部分。 远端部分将导电粘合剂形成接头,将粘合剂保持在邻近引线的位置,用于更牢固的接头。 此外,远端部分在形成接头之前将粘合剂保持在接触尾部,便于使用粘合剂转移过程来分配粘合剂。 为了进一步有助于粘合剂的转移,接触尾部可以形成有凹部,其增加粘附到接触尾部的粘合剂的体积。 通过将增加但可控制的粘合剂量粘附到接触尾部,接触尾部的阵列可以简单且可靠地附接到印刷电路板和其它基底。

    Lead(Pb)-free electronic component attachment
    8.
    发明申请
    Lead(Pb)-free electronic component attachment 有权
    无铅(Pb)电子元件附件

    公开(公告)号:US20070205497A1

    公开(公告)日:2007-09-06

    申请号:US11604710

    申请日:2006-11-28

    Abstract: A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb)-free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. To further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.

    Abstract translation: 用于电子部件的接触尾部,其可用于使用导电粘合剂附接部件,其可以是无铅(Pb)。 接触尾部被冲压,提供相对低的制造成本和高精度。 接触尾部具有每单位长度具有大的表面积的远端部分。 远端部分将导电粘合剂形成接头,将粘合剂保持在铅附近,以保持更牢固的接头。 此外,远端部分在形成接头之前将粘合剂保持在接触尾部,便于使用粘合剂转移过程来分配粘合剂。 为了进一步有助于粘合剂的转移,接触尾部可以形成有凹部,其增加粘附到接触尾部的粘合剂的体积。 通过将增加但可控制的粘合剂量粘附到接触尾部,接触尾部的阵列可以简单且可靠地附接到印刷电路板和其它基底。

    Shield structure for electronic circuit parts
    9.
    发明授权
    Shield structure for electronic circuit parts 失效
    电子电路部件的屏蔽结构

    公开(公告)号:US06593523B2

    公开(公告)日:2003-07-15

    申请号:US09883946

    申请日:2001-06-20

    Abstract: The invention provides a shield structure that allows an easy installment of a shield case on a circuit board with more strength and firmness even if the shield case is warped or distorted. The proposed shield case includes a frame member consisting of four sidewalls and a cover member covering a farther end of the frame member from the circuit board. The frame member comprises a supporting member for sustaining the frame member on the circuit board and end faces confronting the circuit board. The supporting member comprises three projections protruding from the end face toward the circuit board.

    Abstract translation: 本发明提供了一种屏蔽结构,即使屏蔽壳体翘曲或变形,也能够在电路板上容易地安装屏蔽壳体,并具有更强的强度和坚固性。 所提出的屏蔽壳包括由四个侧壁构成的框架构件和覆盖框架构件与电路板的更远端的盖构件。 框架构件包括用于维持电路板上的框架构件的支撑构件和面对电路板的端面。 支撑构件包括从端面朝向电路板突出的三个突起。

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