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    SYSTEM AND METHOD FOR COMMERCIAL FABRICATION OF PATTERNED MEDIA
    3.
    发明申请
    SYSTEM AND METHOD FOR COMMERCIAL FABRICATION OF PATTERNED MEDIA 审中-公开

    公开(公告)号：US20130098761A1

    公开(公告)日：2013-04-25

    申请号：US13712916

    申请日：2012-12-12

    Applicant: Intevac, Inc.

    Inventor： Kevin P. Fairbairn ,  Michael S. Barnes ,  Terry Bluck ,  Ren Xu ,  Charles Liu ,  Ralph Kerns

    IPC: G11B5/84

    CPC classification number: G11B5/84 ,  G11B5/855 ,  H01J37/3438

    Abstract: A system is provided for etching patterned media disks for hard drive. The modular system may be tailored to perform specific processes sequences so that a patterned media disk is fabricated without removing the disk from vacuum environment. In some sequence the magnetic stack is etched while in other the etch is performed prior to forming the magnetic stack. In a further sequence ion implantation is used without etching steps. For etching a movable non-contact electrode is utilized to perform sputter etch. The cathode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched.

    High throughput load lock for solar wafers
    5.
    发明授权
    High throughput load lock for solar wafers 有权
    太阳能硅片的高通量负载锁定

    公开(公告)号：US08998553B2

    公开(公告)日：2015-04-07

    申请号：US13708751

    申请日：2012-12-07

    Applicant: Intevac, Inc.

    Inventor： Vinay Shah ,  William Runstadler, Jr. ,  Kevin P. Fairbairn ,  Terry Bluck ,  Richard Henry Cooke

    IPC: H01L21/677 ,  H01L21/67

    CPC classification number: H01L21/67736 ,  H01L21/67126 ,  H01L21/67201 ,  H01L21/67271 ,  H01L21/67288

    Abstract: A system for transporting substrates from an atmospheric pressure to high vacuum pressure and comprising: a rough vacuum chamber having an entry valve and an exit opening; a high vacuum chamber having an entry opening, the high vacuum chamber coupled to the rough vacuum chamber such that the exit opening and the entry opening are aligned; a valve situated between the exit opening and the entry opening; a first conveyor belt provided in the rough vacuum chamber; a second conveyor provided in the high vacuum chamber; a sensing element provided in the high vacuum chamber to enable detection of broken substrates on the second conveyor; and, a mechanism provided on the second conveyor belt enabling dumping of broken substrates onto the bottom of the high vacuum chamber.

    Abstract translation: 一种用于将基板从大气压输送到高真空压力的系统，包括：具有入口阀和出口的粗真空室; 具有进入开口的高真空室，所述高真空室联接到所述粗真空室，使得所述出口和入口开口对齐; 位于出口和入口之间的阀; 设置在粗糙真空室中的第一传送带; 设置在高真空室中的第二传送器; 设置在所述高真空室中以便能够检测所述第二输送机上的破裂的基板的感测元件; 以及设置在第二传送带上的机构，其能够将破碎的基板倾倒到高真空室的底部上。

    SYSTEM ARCHITECTURE FOR COMBINED STATIC AND PASS-BY PROCESSING
    6.
    发明申请
    SYSTEM ARCHITECTURE FOR COMBINED STATIC AND PASS-BY PROCESSING 有权
    用于组合静态和通过处理的系统架构

    公开(公告)号：US20130161183A1

    公开(公告)日：2013-06-27

    申请号：US13728145

    申请日：2012-12-27

    Applicant: Intevac, Inc.

    Inventor： Patrick Leahey ,  Eric Lawson ,  Charles Liu ,  Terry Bluck ,  Kevin P. Fairbairn ,  Robert L. Ruck ,  Samuel D. Harkness, IV

    IPC: C23C14/34

    CPC classification number: C23C14/34 ,  C23C14/50 ,  C23C14/566 ,  C23C14/568

    Abstract: Disclosed is a substrate processing system which enables combined static and pass-by processing. Also, a system architecture is provided, which reduces footprint size. The system is constructed such that the substrates are processed therein vertically, and each chamber has a processing source attached to one sidewall thereof, wherein the other sidewall backs to a complementary processing chamber. The chamber system can be milled from a single block of metal, e.g., aluminum, wherein the block is milled from both sides, such that a wall remains and separates each two complementary processing chambers.

    Abstract translation: 公开了一种能够组合静态和通过处理的衬底处理系统。 此外，还提供了一种减小占位面积的系统架构。 该系统构造成使得基板在其中垂直处理，并且每个室具有附接到其一个侧壁的处理源，其中另一个侧壁返回到互补处理室。 室系统可以从单块金属例如铝碾磨，其中块从两侧铣削，使得壁保持并分离每两个补充处理室。

    HIGH THROUGHPUT LOAD LOCK FOR SOLAR WAFERS
    7.
    发明申请
    HIGH THROUGHPUT LOAD LOCK FOR SOLAR WAFERS 有权
    用于太阳能轮的高阻力负载锁

    公开(公告)号：US20130149075A1

    公开(公告)日：2013-06-13

    申请号：US13708751

    申请日：2012-12-07

    Applicant: INTEVAC, INC.

    Inventor： Vinay Shah ,  William Runstadler, JR. ,  Kevin P. Fairbairn ,  Terry Bluck ,  Richard Henry Cooke

    IPC: H01L21/677

    CPC classification number: H01L21/67736 ,  H01L21/67126 ,  H01L21/67201 ,  H01L21/67271 ,  H01L21/67288

    Abstract: A system for transporting substrates from an atmospheric pressure to high vacuum pressure and comprising: a rough vacuum chamber having an entry valve and an exit opening; a high vacuum chamber having an entry opening, the high vacuum chamber coupled to the rough vacuum chamber such that the exit opening and the entry opening are aligned; a valve situated between the exit opening and the entry opening; a first conveyor belt provided in the rough vacuum chamber; a second conveyor provided in the high vacuum chamber; a sensing element provided in the high vacuum chamber to enable detection of broken substrates on the second conveyor; and, a mechanism provided on the second conveyor belt enabling dumping of broken substrates onto the bottom of the high vacuum chamber.

    Abstract translation: 一种用于将基板从大气压输送到高真空压力的系统，包括：具有入口阀和出口的粗真空室; 具有进入开口的高真空室，所述高真空室联接到所述粗真空室，使得所述出口和入口开口对齐; 位于出口和入口之间的阀; 设置在粗糙真空室中的第一传送带; 设置在高真空室中的第二传送器; 设置在所述高真空室中以便能够检测所述第二输送机上的破裂的基板的感测元件; 以及设置在第二传送带上的机构，其能够将破碎的基板倾倒到高真空室的底部上。

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