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公开(公告)号：US20200030850A1
公开(公告)日：2020-01-30
申请号：US16592618
申请日：2019-10-03
申请人： InvenSense, Inc.
摘要： A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.
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公开(公告)号：US20170328866A1
公开(公告)日：2017-11-16
申请号：US15424720
申请日：2017-02-03
申请人： InvenSense, Inc.
CPC分类号： G01N29/326 , B06B1/0207 , B06B1/0292 , B06B1/0622 , B06B2201/20 , B06B2201/40 , B06B2201/50 , G01N29/04 , G01N29/30 , G01N29/38 , G01N29/4463 , G01S7/5205 , G01S7/521
摘要： An electronic device including an array of ultrasonic transducers, a temperature sensor for determining a temperature of the array of ultrasonic transducers, and a control module communicatively coupled to the array of ultrasonic devices and the temperature sensor. The control module is for receiving the temperature and for controlling operation of the array of ultrasonic transducers based at least in part on the temperature.
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公开(公告)号：US20170322291A1
公开(公告)日：2017-11-09
申请号：US15294130
申请日：2016-10-14
申请人： InvenSense, Inc.
发明人： James Christian SALVIA , Michael H. PERROTT , Marian VOROS , Eldwin NG , Julius Ming-Lin TSAI , Nikhil APTE
IPC分类号： G01S7/521 , H01L27/092
CPC分类号： B06B1/0622 , G06F3/03547 , G06F2203/0338 , G06K9/0002 , G06K9/0008 , G06K9/001 , H01L27/0922
摘要： An electronic device includes a plurality of CMOS control elements arranged in a two-dimensional array, where each CMOS control element of the plurality of CMOS control elements includes two semiconductor devices. The plurality of CMOS control elements include a first subset of CMOS control elements, each CMOS control element of the first subset of CMOS control elements including a semiconductor device of a first class and a semiconductor device of a second class, and a second subset of CMOS control elements, each CMOS control element of the second subset of CMOS control elements including a semiconductor device of the first class and a semiconductor device of a third class. The plurality of CMOS control elements are arranged in the two-dimensional array such that CMOS semiconductor devices of the first class are only adjacent to other CMOS semiconductor devices of the first class, CMOS semiconductor devices of the second class are only adjacent to other CMOS semiconductor devices of the second class, and CMOS semiconductor devices of the third class are only adjacent to other CMOS semiconductor devices of the third class.
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公开(公告)号：US20200074135A1
公开(公告)日：2020-03-05
申请号：US16679067
申请日：2019-11-08
申请人： InvenSense, Inc.
IPC分类号： G06K9/00
摘要： A method for generating an image is provided. The method comprises capturing a first set of image pixels by an ultrasonic sensor comprising an array of ultrasonic transducers using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of transmit signals routed to a plurality of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of image pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of transmit signals routed to the plurality of ultrasonic transducers. The second beamforming pattern is different than the first beamforming pattern. The second set of image pixels corresponds to an edge region of the ultrasonic sensor. The method additionally comprises combining the first set of image pixels and the second set of image pixels to form the image. An electronic device and a method of generating an image of a fingerprint with a fingerprint sensor are also provided.
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公开(公告)号：US20180349663A1
公开(公告)日：2018-12-06
申请号：US15611704
申请日：2017-06-01
申请人： InvenSense, Inc.
IPC分类号： G06K9/00
CPC分类号： G06K9/0002
摘要： A method for generating an image is provided. The method comprises capturing a first set of image pixels by an ultrasonic sensor comprising an array of ultrasonic transducers using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of transmit signals routed to a plurality of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of image pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of transmit signals routed to the plurality of ultrasonic transducers. The second beamforming pattern is different than the first beamforming pattern. The second set of image pixels corresponds to an edge region of the ultrasonic sensor. The method additionally comprises combining the first set of image pixels and the second set of image pixels to form the image. An electronic device and a method of generating an image of a fingerprint with a fingerprint sensor are also provided.
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公开(公告)号：US20170322292A1
公开(公告)日：2017-11-09
申请号：US15294186
申请日：2016-10-14
申请人： InvenSense, Inc.
发明人： James Christian SALVIA , Michael H. PERROTT , Marian VOROS , Eldwin NG , Julius Ming-Lin TSAI , Nikhil APTE
IPC分类号： G01S7/521 , H01L27/092
CPC分类号： H01L27/0925 , B06B1/0622 , B81C1/00246 , G06F3/03547 , G06F2203/0338 , G06K9/0002 , H01L21/823885 , H01L27/0922
摘要： An electronic device includes a plurality of CMOS control elements arranged in a two-dimensional array, where each CMOS control element of the plurality of CMOS control elements includes semiconductor devices. The plurality of CMOS control elements each including a PMOS semiconductor device portion comprising a high voltage PMOS device and a low voltage PMOS device and an NMOS semiconductor device portion comprising a high voltage NMOS device and a low voltage NMOS device. The plurality of CMOS control elements are arranged in the two-dimensional array such that the PMOS semiconductor device portion of a CMOS control element of the plurality of CMOS control elements is only adjacent to other PMOS semiconductor device portions of adjacent CMOS control elements of the plurality of CMOS control elements, and such that the NMOS semiconductor device portion of a CMOS control element of the plurality of CMOS control elements is only adjacent to other NMOS semiconductor device portions of adjacent CMOS control elements of the plurality of CMOS control elements.
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公开(公告)号：US20190247887A1
公开(公告)日：2019-08-15
申请号：US16395045
申请日：2019-04-25
申请人： InvenSense, Inc.
发明人： James Christian SALVIA , Michael H. PERROTT , Marian VOROS , Eldwin NG , Julius Ming-Lin TSAI , Nikhil APTE
IPC分类号： B06B1/06 , G06K9/00 , G06F3/0354
CPC分类号： B06B1/0622 , G06F3/03547 , G06F2203/0338 , G06K9/0002 , G06K9/0008 , G06K9/001 , H01L27/0922
摘要： An electronic device includes a plurality of CMOS control elements arranged in a two-dimensional array, where each CMOS control element of the plurality of CMOS control elements includes two semiconductor devices. The plurality of CMOS control elements include a first subset of CMOS control elements, each CMOS control element of the first subset of CMOS control elements including a semiconductor device of a first class and a semiconductor device of a second class, and a second subset of CMOS control elements, each CMOS control element of the second subset of CMOS control elements including a semiconductor device of the first class and a semiconductor device of a third class. The plurality of CMOS control elements are arranged in the two-dimensional array such that CMOS semiconductor devices of the first class are only adjacent to other CMOS semiconductor devices of the first class, CMOS semiconductor devices of the second class are only adjacent to other CMOS semiconductor devices of the second class, and CMOS semiconductor devices of the third class are only adjacent to other CMOS semiconductor devices of the third class.
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公开(公告)号：US20170326591A1
公开(公告)日：2017-11-16
申请号：US15419835
申请日：2017-01-30
申请人： InvenSense, Inc.
CPC分类号： B06B1/064 , B06B1/0292 , B06B1/06 , B06B2201/51 , B06B2201/55
摘要： A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.
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公开(公告)号：US20170322305A1
公开(公告)日：2017-11-09
申请号：US15266673
申请日：2016-09-15
申请人： InvenSense, Inc.
IPC分类号： G01S15/06
摘要： In a method of operating a two-dimensional array of ultrasonic transducers, a plurality of array positions comprising pluralities of ultrasonic transducers of the two-dimensional array of ultrasonic transducers is defined, the plurality of array positions each comprising a portion of ultrasonic transducers of the two dimensional array of ultrasonic transducers. For each array position of the plurality of array positions, a plurality of ultrasonic transducers associated with the respective array position are activated. The activation includes transmitting ultrasonic signals from a first group of ultrasonic transducers of the plurality of ultrasonic transducers, wherein at least some ultrasonic transducers of the first group of ultrasonic transducers are phase delayed with respect to other ultrasonic transducers of the first group of ultrasonic transducers, the first group of ultrasonic transducers for forming a focused ultrasonic beam. The activation also includes receiving reflected ultrasonic signals at a second group of ultrasonic transducers of the plurality of ultrasonic transducers.
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公开(公告)号：US20200061670A1
公开(公告)日：2020-02-27
申请号：US16107894
申请日：2018-08-21
申请人： InvenSense, Inc.
发明人： Mei-Lin CHAN , Nikhil APTE , Renata Melamud BERGER
摘要： An electronic device includes a substrate layer having a front surface and a back surface opposite the front surface, a plurality of ultrasonic transducers formed on the front surface of the substrate layer, wherein the plurality of ultrasonic transducers generate backward waves during operation, the backward waves propagating through the substrate layer, and a plurality of substrate structures formed within the back surface of the substrate layer, the plurality of substrate structures configured to modify the backward waves during the operation.
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