公开(公告)号：US20090130417A1

公开(公告)日：2009-05-21

申请号：US12292284

申请日：2008-11-14

申请人： Itsuro Maeda ,  Kenji Shiga ,  Yasuto Fujii ,  Satoshi Sakai

发明人： Itsuro Maeda ,  Kenji Shiga ,  Yasuto Fujii ,  Satoshi Sakai

IPC分类号： B32B27/34

CPC分类号： C08L77/06 ,  C08L23/14 ,  C08L51/06 ,  F02F7/006 ,  F05C2253/16 ,  F05C2253/20 ,  F05C2253/22 ,  C08L2666/24

摘要： A thin-walled light resin composition engine cover has reduced mass and thickness while retaining radiated sound reduction effects, heat resistance, and mechanical properties. The cover has an average thickness of 2.0 mm or less. The resin composition includes (a) a polyamide resin composed of essentially at least one of scrap of vehicle airbag fabric made of nylon 66 containing a copper-based stabilizer and vehicle airbag fabric recycled, (b) a modified polypropylene resin, (c) a reinforcement material, (d) a metal deactivator and a photo-thermal stabilizer, and (e) a viscosity regulator. The resin composition has a melt flow rate of not less than 40 g/10 min.

摘要翻译： 薄壁轻树脂组合物发动机盖具有减小的质量和厚度，同时保持辐射声音降低效果，耐热性和机械性能。 该盖的平均厚度为2.0mm以下。 树脂组合物包括（a）由基本上至少一种由包含铜基稳定剂的尼龙66制成的车辆气囊织物的废料和再循环的车辆气囊织物中的至少一种构成的聚酰胺树脂，（b）改性聚丙烯树脂，（c） 增强材料，（d）金属钝化剂和光热稳定剂，和（e）粘度调节剂。 树脂组合物的熔体流动速率不低于40g / 10min。

公开(公告)号：US20140329942A1

公开(公告)日：2014-11-06

申请号：US14352442

申请日：2012-06-24

申请人： Takashi Matsuo ,  Kenji Shiga

发明人： Takashi Matsuo ,  Kenji Shiga

IPC分类号： C08L69/00 ,  C08L67/02

CPC分类号： C08L69/00 ,  B32B27/06 ,  B32B27/18 ,  B32B27/302 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2307/3065 ,  B32B2307/412 ,  C08G63/6926 ,  C08K5/49 ,  C08K5/5313 ,  C08L67/02 ,  C08L101/00

摘要： Provided is a flame-retardant resin composition which has excellent flame retardancy and less bleed out, while exhibiting high transparency that is close to the original state of a thermoplastic resin. This flame-retardant resin composition contains (A) a thermoplastic resin, (B) a copolymerized polyester resin wherein a phosphorus-containing component represented by general formula (1) is copolymerized, and (C) a phosphorus-containing compound represented by general formula (2). General formula (1); (In general formula (1), each of R1 and R2 independently represents a substituent such as an alkyl group having 1-4 carbon atoms; each of m and n independently represents an integer of 0-4; and B represents an ester-forming functional group.) General formula (2): (In general formula (2), each of R1-R5 independently represents a hydrogen atom or a substituent such as an alkyl group having 1-6 carbon atoms; and each of X1-X3 independently represents a hydrogen atom or a substituent such as an alkyl group having 1-6 carbon atoms.)

摘要翻译： 提供阻燃性树脂组合物，其具有优异的阻燃性和较少的渗出性，同时具有接近热塑性树脂的原始状态的高透明度。 该阻燃性树脂组合物含有（A）热塑性树脂，（B）共聚聚酯树脂，其中由通式（1）表示的含磷组分共聚，和（C）由通式 （2）。 通式（1）; （通式（1）中，R 1和R 2各自独立地表示例如具有1-4个碳原子的烷基的取代基; m和n各自独立地表示0-4的整数; B表示酯形成 官能团）通式（2）:(通式（2）中，R 1 -R 5各自独立地表示氢原子或具有1-6个碳原子的烷基的取代基，X1-X3各自独立地 表示氢原子或具有1-6个碳原子的烷基的取代基。）

公开(公告)号：US20130331521A1

公开(公告)日：2013-12-12

申请号：US14000943

申请日：2012-02-21

申请人： Daiki Funaoka ,  Kenji Shiga

发明人： Daiki Funaoka ,  Kenji Shiga

IPC分类号： C08L67/03 ,  C08L23/08 ,  C08L23/06 ,  C08L65/04 ,  C08L71/08

CPC分类号： C08L67/03 ,  C08L23/02 ,  C08L23/06 ,  C08L23/08 ,  C08L23/0815 ,  C08L65/04 ,  C08L67/00 ,  C08L71/08 ,  C09K3/10 ,  C09K2200/0617 ,  C09K2200/0655 ,  C09K2200/0672 ,  H01L23/293 ,  H01L2924/0002 ,  C08L61/18 ,  C08L61/06 ,  H01L2924/00

摘要： It is provided that a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high temperature conditions, and which are excellent in initial bond strength to an aluminum material, and which exhibits superior durability under a cooling and heating cycle load and the like. It is also provided that a sealed electrical electronic component with the resin composition for sealing electrical electronic components. A resin composition for sealing electrical electronic components, containing a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenol resin (B2), and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3000 dPa·s or less when dried to a water content of 0.1% or less, heated to 220° C., subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm.

摘要翻译： 本发明提供一种用于密封电子电子部件的树脂组合物，即使在高温条件下停滞时也不易凝胶化，并且与铝材料的初始结合强度优异，并且在冷却和加热循环下表现出优异的耐久性 负载等。 还提供了具有用于密封电子电子部件的树脂组合物的密封电子电子部件。 含有结晶性聚酯类弹性体（A），苯酚改性二甲苯树脂（B1）和/或酚醛树脂（B2）和聚烯烃树脂（C）的电子电子部件密封用树脂组合物，具有 当干燥至含水量为0.1％以下时的熔融粘度为5dPa·s以上且3000dPa·s以下，加热至220℃，进行1MPa的压力，并通过模具挤出 孔直径为1.0mm，厚度为10mm。

公开(公告)号：US20070173629A1

公开(公告)日：2007-07-26

申请号：US10594031

申请日：2004-12-01

申请人： Kenji Shiga ,  Nishida Mitsuo

发明人： Kenji Shiga ,  Nishida Mitsuo

IPC分类号： C08G63/02

CPC分类号： C08L67/02 ,  C08L101/025 ,  C08L101/06 ,  C08L2666/02

摘要： An object of the present invention is to provide a modifier which improves moldability in melt molding, particularly, injection molding, extrusion molding, profile molding, direct blow molding, or calendar processing molding using a polyester resin and, furthermore, which can improve mechanical physical property while maintaining transparency, and a polyester molded article using the modifier. The present invention relates to a modifier for a polyester resin, comprising an amorphous polyester resin (I), and a reactive compound (II) containing two or more glycidyl groups and/or isocyanate groups per one molecule and having a weight average molecular weight of not less than 200 and not more than 500 thousands.

摘要翻译： 本发明的目的是提供一种改进剂，其改进了熔融模塑中的成型性，特别是注射成型，挤出成型，轮廓成型，直接吹塑成型或使用聚酯树脂的日历加工成型，此外，其可以改善机械物理 同时保持透明性，以及使用该改性剂的聚酯模制品。 本发明涉及一种聚酯树脂改性剂，其包含无定形聚酯树脂（I）和每分子含有两个或更多个缩水甘油基基团和/或异氰酸酯基团的反应性化合物（II），其重均分子量为 不低于200，不超过500,000。

公开(公告)号：US09080091B2

公开(公告)日：2015-07-14

申请号：US14003061

申请日：2012-02-21

申请人： Junko Sakai ,  Kenji Shiga

发明人： Junko Sakai ,  Kenji Shiga

IPC分类号： C08L67/07 ,  C09K3/10 ,  C08G63/64 ,  B29C39/00 ,  H01L23/29 ,  H01G9/10 ,  H01G4/224 ,  C08L69/00 ,  B29K75/00 ,  B29K105/12

CPC分类号： C09K3/1006 ,  B29C39/006 ,  B29K2075/00 ,  B29K2105/122 ,  C08G63/64 ,  C08L69/005 ,  C09K3/10 ,  C09K2200/0655 ,  H01G4/224 ,  H01G9/10 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： It is provided that a polyester composition for electrical/electronic part-sealing material having melt fluidity, initial peel strength, and initial dielectric breakdown strength that are required for electrical/electronic part-sealing material while also having excellent heat resistance, resistance to thermal aging, and durability with respect to hot-cold cycling.A polyester resin composition for electrical/electronic part-sealing material, comprising, as a main component, a copolymer polyester elastomer containing 50 weight % or more and 70 weight % or lower of an aliphatic polycarbonate segment and having 6 equivalents/106 g or more and 50 equivalents/106 g or lower of terminal vinyl groups.

摘要翻译： 提供一种电气/电子部件密封材料的聚酯组合物，其具有电气/电子部件密封材料所需的熔体流动性，初始剥离强度和初始介电击穿强度，同时具有优异的耐热性，耐热老化性 ，以及相对于冷热循环的耐久性。 一种电气/电子部件密封材料用聚酯树脂组合物，其包含作为主要成分的含有50重量％以上且70重量％以下的脂肪族聚碳酸酯部分并且具有6当量/ 106g以上的共聚物聚酯弹性体 和50当量/ 106g或更低的末端乙烯基。

公开(公告)号：US20060217495A1

公开(公告)日：2006-09-28

申请号：US11447246

申请日：2006-06-06

申请人： Kenji Shiga ,  Akira Nishimoto ,  Osamu Iritani ,  Kazunori Komatsu ,  Mitsuo Nishida

发明人： Kenji Shiga ,  Akira Nishimoto ,  Osamu Iritani ,  Kazunori Komatsu ,  Mitsuo Nishida

IPC分类号： C08L67/00

CPC分类号： C08L67/02 ,  C08G63/199 ,  C08G63/672 ,  C08G63/916 ,  C08K5/0083 ,  C08K5/29 ,  C08L23/02 ,  C08L25/14 ,  C08L63/04 ,  C08L67/00 ,  C08L2666/02 ,  C08L2666/06 ,  C08L2666/18

摘要： A polyester resin composition for profile extrusion molding comprising an amorphous polyester, at least one component selected from the group consisting of a crystalline polyester and a nucleating agent, and optionally a reactive compound; a polyester resin composition for profile extrusion molding comprising a polyester resin, and a reactive compound having a weight average molecular weight of 200 to 500,000; and a profile shape comprising a resin having a reduced viscosity ratio of 1.01 to 3.00, a reduced viscosity ratio being a ratio of a reduced viscosity of a resin after molding to that of a resin before molding. They do not suffer from sagging in the molding process, they improve the shape accuracy at corners and edges of profile shapes from a die to a sizing step and also resistance to whitening on bending in transparent products, and can provide profile shapes having good solvent resistance and detergent resistance.

公开(公告)号：US09139729B2

公开(公告)日：2015-09-22

申请号：US14000943

申请日：2012-02-21

申请人： Daiki Funaoka ,  Kenji Shiga

发明人： Daiki Funaoka ,  Kenji Shiga

IPC分类号： C08L67/03 ,  C08L23/08 ,  C08L23/06 ,  C08L65/04 ,  C08L71/08 ,  C08L23/02 ,  C08L67/00 ,  H01L23/29 ,  C09K3/10

CPC分类号： C08L67/03 ,  C08L23/02 ,  C08L23/06 ,  C08L23/08 ,  C08L23/0815 ,  C08L65/04 ,  C08L67/00 ,  C08L71/08 ,  C09K3/10 ,  C09K2200/0617 ,  C09K2200/0655 ,  C09K2200/0672 ,  H01L23/293 ,  H01L2924/0002 ,  C08L61/18 ,  C08L61/06 ,  H01L2924/00

摘要： It is provided that a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high temperature conditions, and which are excellent in initial bond strength to an aluminum material, and which exhibits superior durability under a cooling and heating cycle load and the like. It is also provided that a sealed electrical electronic component with the resin composition for sealing electrical electronic components. A resin composition for sealing electrical electronic components, containing a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenol resin (B2), and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3000 dPa·s or less when dried to a water content of 0.1% or less, heated to 220° C., subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm.

摘要翻译： 本发明提供一种用于密封电子电子部件的树脂组合物，即使在高温条件下停滞时也不易凝胶化，并且与铝材料的初始结合强度优异，并且在冷却和加热循环下表现出优异的耐久性 负载等。 还提供了具有用于密封电子电子部件的树脂组合物的密封电子电子部件。 含有结晶性聚酯类弹性体（A），苯酚改性二甲苯树脂（B1）和/或酚醛树脂（B2）和聚烯烃树脂（C）的电子电子部件密封用树脂组合物，具有 当干燥至含水量为0.1％以下时的熔融粘度为5dPa·s以上且3000dPa·s以下，加热至220℃，进行1MPa的压力，并通过模具挤出 孔直径为1.0mm，厚度为10mm。

公开(公告)号：US20140221578A1

公开(公告)日：2014-08-07

申请号：US14241662

申请日：2012-08-22

申请人： Daiki Funaoka ,  Kenji Shiga

发明人： Daiki Funaoka ,  Kenji Shiga

IPC分类号： H01B3/40 ,  H01B3/42

CPC分类号： H01B3/40 ,  C08G59/226 ,  C08G59/308 ,  C08L61/06 ,  C08L61/34 ,  C08L67/025 ,  H01B3/427 ,  H01L23/293 ,  H01L2924/0002 ,  C08L23/00 ,  C08L63/00 ,  H01L2924/00

摘要： It is provided that a resin composition for sealing electrical and electronic parts that can provide a flame-retardant sealed electrical and electronic part having no bleed out of a flame resistor while maintaining filling properties of a sealant in the practical level and adhesion between the sealant and an electrical and electronic part. A resin composition for sealing electrical and electronic parts, comprising a copolymer polyester elastomer (X), a brominated epoxy resin (B1), a non-brominated epoxy resin (B2) and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3.0×103 dPa·s or less when dried to a water content of 0.1% or less, heated to 220° C., subjected to a pressure of 1 MPa, and then extruded from a die having a hole diameter of 1.0 mm and a thickness of 10 mm, a sealed electrical and electronic part using the resin composition for sealing electrical and electronic part, and a method for producing the sealed electrical and electronic parts.

摘要翻译： 提供一种用于密封电气和电子部件的树脂组合物，其可以提供阻燃密封的电气和电子部件，其不会在阻燃剂阻挡物的渗出的同时保持密封剂在实用水平中的填充性能，并且密封剂和 电气和电子部件。 一种用于密封电子和电子部件的树脂组合物，其包含共聚物聚酯弹性体（X），溴化环氧树脂（B1），非溴化环氧树脂（B2）和聚烯烃树脂（C），并且具有 干燥至含水量为0.1％以下时为5dPa·s以上且3.0×10 3 dPa·s以下，加热至220℃，进行1MPa的压力，然后从具有 孔直径为1.0mm，厚度为10mm，使用密封电气和电子部件的树脂组合物的密封电气和电子部件，以及密封电气和电子部件的制造方法。

公开(公告)号：US20130338318A1

公开(公告)日：2013-12-19

申请号：US14003061

申请日：2012-02-21

申请人： Junko Sakai ,  Kenji Shiga

发明人： Junko Sakai ,  Kenji Shiga

IPC分类号： C09K3/10

CPC分类号： C09K3/1006 ,  B29C39/006 ,  B29K2075/00 ,  B29K2105/122 ,  C08G63/64 ,  C08L69/005 ,  C09K3/10 ,  C09K2200/0655 ,  H01G4/224 ,  H01G9/10 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： It is provided that a polyester composition for electrical/electronic part-sealing material having melt fluidity, initial peel strength, and initial dielectric breakdown strength that are required for electrical/electronic part-sealing material while also having excellent heat resistance, resistance to thermal aging, and durability with respect to hot-cold cycling.A polyester resin composition for electrical/electronic part-sealing material, comprising, as a main component, a copolymer polyester elastomer containing 50 weight % or more and 70 weight % or lower of an aliphatic polycarbonate segment and having 6 equivalents/106 g or more and 50 equivalents/106 g or lower of terminal vinyl groups.

摘要翻译： 提供一种电气/电子部件密封材料的聚酯组合物，其具有电气/电子部件密封材料所需的熔体流动性，初始剥离强度和初始介电击穿强度，同时具有优异的耐热性，耐热老化性 ，以及相对于冷热循环的耐久性。 一种电气/电子部件密封材料用聚酯树脂组合物，其包含作为主要成分的含有50重量％以上且70重量％以下的脂肪族聚碳酸酯部分并且具有6当量/ 106g以上的共聚物聚酯弹性体 和50当量/ 106g或更低的末端乙烯基。

公开(公告)号：US07989556B2

公开(公告)日：2011-08-02

申请号：US10594031

申请日：2004-12-01

申请人： Kenji Shiga ,  Mitsuo Nishida

发明人： Kenji Shiga ,  Mitsuo Nishida

IPC分类号： C08G59/00

CPC分类号： C08L67/02 ,  C08L101/025 ,  C08L101/06 ,  C08L2666/02

摘要： An object of the present invention is to provide a modifier which improves moldability in melt molding, particularly, injection molding, extrusion molding, profile molding, direct blow molding, or calendar processing molding using a polyester resin and, furthermore, which can improve mechanical physical property while maintaining transparency, and a polyester molded article using the modifier. The present invention relates to a modifier for a polyester resin, comprising an amorphous polyester resin (I), and a reactive compound (II) containing two or more glycidyl groups and/or isocyanate groups per one molecule and having a weight average molecular weight of not less than 200 and not more than 500 thousands.

摘要翻译： 本发明的目的是提供一种改进剂，其改进了熔融模塑中的成型性，特别是注射成型，挤出成型，轮廓成型，直接吹塑成型或使用聚酯树脂的日历加工成型，此外，其可以改善机械物理 同时保持透明性，以及使用该改性剂的聚酯模制品。 本发明涉及一种聚酯树脂改性剂，其包含无定形聚酯树脂（I）和每分子含有两个或更多个缩水甘油基基团和/或异氰酸酯基团的反应性化合物（II），其重均分子量为 不低于200，不超过500,000。