公开(公告)号：US20170306207A1

公开(公告)日：2017-10-26

申请号：US15506252

申请日：2015-08-26

Applicant: JNC CORPORATION ,  OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE

Inventor： TAKESHI FUJIWARA ,  JYUNICHI INAGAKI ,  MASAKO HINATSU ,  AKINORI OKADA ,  YASUYUKI AGARI ,  HIROSHI HIRANO ,  JOJI KADOTA

IPC: C09K5/14 ,  C08K3/38 ,  C08K9/06 ,  H01L23/373 ,  H01L21/48

CPC classification number: C09K5/14 ,  C08G59/00 ,  C08G65/18 ,  C08K3/38 ,  C08K9/06 ,  C08K2003/385 ,  C08L101/00 ,  H01L21/4871 ,  H01L23/373 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.

公开(公告)号：US20180251639A1

公开(公告)日：2018-09-06

申请号：US15756986

申请日：2016-09-01

Applicant: JNC CORPORATION

Inventor： MASAKO HINATSU ,  TAKESHI FUJIWARA

IPC: C09D5/00 ,  C09K5/14 ,  C09D151/08 ,  C09D7/61

CPC classification number: C09D5/00 ,  B32B15/082 ,  B32B27/20 ,  B32B27/30 ,  C08G18/6225 ,  C08G18/73 ,  C08G18/76 ,  C08G18/778 ,  C08J5/18 ,  C08K3/013 ,  C08K3/04 ,  C08K3/28 ,  C08K3/34 ,  C08K3/38 ,  C08K5/0025 ,  C08K2003/2296 ,  C08K2003/282 ,  C08K2003/385 ,  C09D7/40 ,  C09D7/61 ,  C09D7/65 ,  C09D7/70 ,  C09D133/00 ,  C09D133/14 ,  C09D151/085 ,  C09D151/10 ,  C09D175/04 ,  C09K5/14 ,  C08L33/08

Abstract: Provided is a heat-dissipating coating composition having capability of forming a coating film having a high heat-dissipating effect, and having capability of forming the coating film also excellent in heat resistance and UV resistance. The heat-dissipating coating composition of the present application contains a filler of an orthorhombic silicate mineral; and an acrylic resin and a curing agent. Either the acrylic resin or the curing agent is silicone-modified.