公开(公告)号：US20160279900A1

公开(公告)日：2016-09-29

申请号：US15036066

申请日：2014-11-12

Applicant: JNC CORPORATION ,  JNC PETROCHEMICAL CORPORATION

Inventor： TAKESHI FUJIWARA ,  YUKITO YADA

IPC: B32B7/12 ,  B32B27/30 ,  B32B15/18 ,  B32B15/20 ,  B32B9/00 ,  B32B15/08

CPC classification number: B32B7/12 ,  B32B9/007 ,  B32B9/045 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B27/30 ,  B32B2307/302 ,  C09J129/14 ,  H01L23/373 ,  H01L23/3735 ,  H01L23/552 ,  H01L2924/0002 ,  H05K9/0083 ,  H05K9/0084 ,  H05K9/0088 ,  H01L2924/00

Abstract: A problem is to provide an electromagnetic wave-absorbing and heat-dissipating sheet having high thermal conductivity and a complex function of absorbing electromagnetic waves, and to provide electronic equipment.A solution is an electromagnetic wave-absorbing and heat-dissipating sheet, including at least one electromagnetic wave-absorbing layer including an electromagnetic wave absorbing material, at least one graphite layer formed of a graphite sheet, and at least one metal layer, wherein the graphite layer and other layers are adhered using an adhesive layer composed of a composition a containing polyvinyl acetal resin.

Abstract translation: 解决方案是一种电磁波吸收和散热片，其包括至少一个包括电磁波吸收材料的电磁波吸收层，至少一个由石墨片形成的石墨层和至少一个金属层，其中， 使用由含有聚乙烯醇缩醛树脂的组合物构成的粘合剂层粘合石墨层等层。

公开(公告)号：US20180251639A1

公开(公告)日：2018-09-06

申请号：US15756986

申请日：2016-09-01

Applicant: JNC CORPORATION

Inventor： MASAKO HINATSU ,  TAKESHI FUJIWARA

IPC: C09D5/00 ,  C09K5/14 ,  C09D151/08 ,  C09D7/61

CPC classification number: C09D5/00 ,  B32B15/082 ,  B32B27/20 ,  B32B27/30 ,  C08G18/6225 ,  C08G18/73 ,  C08G18/76 ,  C08G18/778 ,  C08J5/18 ,  C08K3/013 ,  C08K3/04 ,  C08K3/28 ,  C08K3/34 ,  C08K3/38 ,  C08K5/0025 ,  C08K2003/2296 ,  C08K2003/282 ,  C08K2003/385 ,  C09D7/40 ,  C09D7/61 ,  C09D7/65 ,  C09D7/70 ,  C09D133/00 ,  C09D133/14 ,  C09D151/085 ,  C09D151/10 ,  C09D175/04 ,  C09K5/14 ,  C08L33/08

Abstract: Provided is a heat-dissipating coating composition having capability of forming a coating film having a high heat-dissipating effect, and having capability of forming the coating film also excellent in heat resistance and UV resistance. The heat-dissipating coating composition of the present application contains a filler of an orthorhombic silicate mineral; and an acrylic resin and a curing agent. Either the acrylic resin or the curing agent is silicone-modified.

公开(公告)号：US20190055444A1

公开(公告)日：2019-02-21

申请号：US16081425

申请日：2017-02-28

Applicant: JNC CORPORATION ,  OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： TAKESHI FUJIWARA ,  JYUNICHI INAGAKI ,  YASUYUKI AGARI ,  HIROSHI HIRANO ,  JOJI KADOTA ,  AKINORI OKADA

IPC: C09K5/14 ,  C08G83/00 ,  C08K3/38

Abstract: The present invention provides: a composition for low thermal expansion members, which is capable of forming a low thermal expansion member that has a thermal expansion coefficient close to those of the members within a semiconductor element, while having high heat resistance and high heat conductivity; and a low thermal expansion member. A composition for low thermal expansion members according to the present invention is characterized by containing: a heat conductive first inorganic filler that is bonded to one end of a first coupling agent; and a heat conductive second inorganic filler that is bonded to one end of a second coupling agent. This composition for low thermal expansion members is also characterized in that the first inorganic filler and the second inorganic filler are bonded to each other via the first coupling agent and the second coupling agent by means of a curing treatment.

公开(公告)号：US20170323780A1

公开(公告)日：2017-11-09

申请号：US15524269

申请日：2015-11-04

Applicant: JNC CORPORATION

Inventor： SHIN KOGA ,  TAKESHI FUJIWARA ,  YASUHIRO SHIRAISHI

IPC: H01L21/02 ,  C09D131/04 ,  B32B9/00 ,  C08F16/12 ,  C08F16/06 ,  C08F20/04

CPC classification number: H01L21/02118 ,  B32B3/04 ,  B32B3/18 ,  B32B7/12 ,  B32B9/00 ,  B32B9/007 ,  B32B9/041 ,  B32B15/20 ,  B32B2250/40 ,  B32B2307/302 ,  B32B2307/748 ,  B32B2457/00 ,  B32B2457/10 ,  B32B2457/20 ,  C08F16/06 ,  C08F16/12 ,  C08F20/04 ,  C09D131/04 ,  C09J129/14 ,  C09J133/08 ,  H01L23/36 ,  H01L23/373 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00 ,  C08F216/38 ,  C08F216/06 ,  C08F218/08 ,  C08F220/06

Abstract: A thermally conductive sheet includes: a first graphite sheet; a second graphite sheet that is any of a second graphite sheet disposed to entirely overlap the first graphite sheet, a second graphite sheet disposed to partially overlap and to be shifted from the first graphite sheet, and a second graphite sheet disposed such that there is an interval of less than 5 mm between the second graphite sheet and the first graphite sheet; a first adhesive layer configured to adhere facing surfaces of the first graphite sheet and the second graphite sheet which are disposed; metal layers stacked to sandwich the first graphite sheet and the second graphite sheet which are disposed from the top and bottom; and second adhesive layers configured to adhere facing surfaces of the first graphite sheet, the second graphite sheet, and the metal layers which are disposed.

公开(公告)号：US20170306207A1

公开(公告)日：2017-10-26

申请号：US15506252

申请日：2015-08-26

Applicant: JNC CORPORATION ,  OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE

Inventor： TAKESHI FUJIWARA ,  JYUNICHI INAGAKI ,  MASAKO HINATSU ,  AKINORI OKADA ,  YASUYUKI AGARI ,  HIROSHI HIRANO ,  JOJI KADOTA

IPC: C09K5/14 ,  C08K3/38 ,  C08K9/06 ,  H01L23/373 ,  H01L21/48

CPC classification number: C09K5/14 ,  C08G59/00 ,  C08G65/18 ,  C08K3/38 ,  C08K9/06 ,  C08K2003/385 ,  C08L101/00 ,  H01L21/4871 ,  H01L23/373 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.

公开(公告)号：US20170137561A1

公开(公告)日：2017-05-18

申请号：US15309793

申请日：2015-05-08

Applicant: JNC CORPORATION ,  Osaka Municipal Technical Research Institute

Inventor： TAKESHI FUJIWARA ,  JYUNICHI INAGAKI ,  YUKITO YADA ,  AKINORI OKADA ,  YASUYUKI AGARI ,  HIROSHI HIRANO ,  JOJI KADOTA

IPC: C08G59/24 ,  C09K5/14 ,  C08K9/06 ,  C08G59/50 ,  H01L23/373 ,  C08K3/38

CPC classification number: C08G59/245 ,  C08G59/20 ,  C08G59/5033 ,  C08K3/38 ,  C08K9/06 ,  C08K2003/385 ,  C09K5/14 ,  H01L23/3737

Abstract: A composition capable of forming a heat-dissipation member having high thermal conductivity, and a heat-dissipation member. The composition for the heat-dissipation member of the present application contains a polymerizable liquid crystal compound having, at both terminals, a structure including an oxiranyl group or an oxetanyl group; a curing agent that cures the polymerizable liquid crystal compound; and an inorganic filler formed of nitride. A curing temperature of the composition for the heat-dissipation member is within or higher than the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and within or lower than the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. The heat-dissipation member formed of such a composition can have excellent thermal conductivity owing to a synergistic effect between alignment of the liquid crystal compound and the inorganic filler formed of nitride.

公开(公告)号：US20160324031A1

公开(公告)日：2016-11-03

申请号：US15035484

申请日：2014-11-10

Applicant: JNC CORPORATION

Inventor： TAKESHI FUJIWARA

IPC: H05K7/20

CPC classification number: H05K7/2039 ,  B32B9/007 ,  B32B9/045 ,  B32B15/082 ,  B32B2307/302 ,  B32B2307/54 ,  B32B2457/00 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/373 ,  H01L23/42 ,  H01L23/552 ,  H01L24/33 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink, including a base section in contact with a heating unit, and a heat-dissipating section for dissipating heat received from the heating unit by the base section, in which the base section includes at least one metal layer, and the heat-dissipating section includes a laminate prepared by laminating a metal layer and a graphite layer through an adhesive layer formed by using a composition containing a polyvinyl acetal resin, or a heat sink for dissipating heat from a heating unit, in which the heat sink includes a laminate prepared by laminating a metal layer and a graphite layer through an adhesive layer formed by using a composition containing a polyvinyl acetal resin, and is arranged so as to cover the heating unit.

Abstract translation: 一种散热器，包括与加热单元接触的基部，以及散热部，用于通过所述基部散热从所述加热单元接收的热，所述基部包括至少一个金属层， 散热部分包括通过使用含有聚乙烯醇缩醛树脂的组合物形成的粘合剂层或金属层和石墨层的散热片，或者散热片包括层压体 通过使用含有聚乙烯醇缩醛树脂的组合物形成的粘合剂层层压金属层和石墨层，并且被布置成覆盖加热单元。