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公开(公告)号：US20100025256A1
公开(公告)日：2010-02-04
申请号：US12504768
申请日：2009-07-17
申请人： JONG-YI SU , CHENG-SHIN CHEN , REN-NING WANG , BIN LIU
发明人： JONG-YI SU , CHENG-SHIN CHEN , REN-NING WANG , BIN LIU
摘要： A surface treatment method for housings comprising: providing a metal housing and pre-treating it to be cleaned; electroplating the housing to form a hexavalent chromium coating on the surface of the housing; and electroplating the housing to form a trivalent chromium coating on the hexavalent chromium coating.
摘要翻译： 一种用于壳体的表面处理方法，包括：提供金属壳体并对其进行预处理; 电镀外壳以在壳体的表面上形成六价铬涂层; 并电镀该外壳以在六价铬涂层上形成三价铬涂层。
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公开(公告)号：US20090321267A1
公开(公告)日：2009-12-31
申请号：US12333435
申请日：2008-12-12
申请人： JONG-YI SU , CHENG-SHIN CHEN , REN-NING WANG , YUN-CHEN MAO , ZHI-FENG LIN
发明人： JONG-YI SU , CHENG-SHIN CHEN , REN-NING WANG , YUN-CHEN MAO , ZHI-FENG LIN
IPC分类号： C25D5/56
CPC分类号： C25D5/10 , C23C18/1653 , C23C18/2086 , C23C18/24 , C23C18/30 , C25D5/12 , C25D5/48 , C25D9/08
摘要： A method for surface treating plastic products is provided. The method includes the steps of providing a plastic substrate, the plastic substrate being made of electroplatable material; forming at least one electroconductive coating on the plastic substrate surface by electro-less plating; forming a copper layer on the electroconductive coating by electroplating; partially etching the surface of the copper layer using a laser to form a rough area; and forming a top coating on the copper layer by electroplating. Both shiny appearance and dusky appearance of the plastic substrate can be present by this method.
摘要翻译： 提供了一种表面处理塑料制品的方法。 该方法包括提供塑料基板的步骤，塑料基板由可电镀材料制成; 通过无电镀在塑料基板表面上形成至少一个导电涂层; 通过电镀在导电涂层上形成铜层; 使用激光部分蚀刻铜层的表面以形成粗糙区域; 并通过电镀在铜层上形成顶涂层。 通过这种方法可以存在塑料基材的光泽外观和暗淡的外观。
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公开(公告)号：US20100068465A1
公开(公告)日：2010-03-18
申请号：US12539693
申请日：2009-08-12
申请人： JONG-YI SU , CHENG-SHIN CHEN , REN-NING WANG , YUAN-ZHU ZHOU
发明人： JONG-YI SU , CHENG-SHIN CHEN , REN-NING WANG , YUAN-ZHU ZHOU
CPC分类号： C25D5/02 , C25D5/56 , Y10T428/24562
摘要： A housing, comprising: a substrate; a paint coating formed on the substrate, the paint coating defining a plurality of through grooves therein; and a metal coating, the metal coating being formed in the through grooves. A method for making housing, comprising: providing a substrate; applying a paint coating on the substrate by spray painting; forming a plurality of through grooves on the paint coating by etching; and forming a metal coating in the through grooves by electroplating.
摘要翻译： 一种壳体，包括：基板; 涂料涂层，形成在基材上，涂料涂层在其中限定多个通孔; 和金属涂层，金属涂层形成在通孔中。 一种制造壳体的方法，包括：提供衬底; 通过喷漆在基材上涂上涂料; 通过蚀刻在涂料涂层上形成多个通孔; 以及通过电镀在通孔中形成金属涂层。
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公开(公告)号：US20100025255A1
公开(公告)日：2010-02-04
申请号：US12498455
申请日：2009-07-07
申请人： JONG-YI SU , CHENG-SHIN CHEN , REN-NING WANG , HONG-JUN QU
发明人： JONG-YI SU , CHENG-SHIN CHEN , REN-NING WANG , HONG-JUN QU
IPC分类号： C25D5/10
CPC分类号： C23C18/36 , C23C18/1653 , C23C18/1844 , C25D3/06 , C25D3/12 , C25D3/38 , C25D5/14 , C25D5/42 , C25D5/48
摘要： An electroplating method for magnesium and magnesium alloys, comprising: providing a magnesium or magnesium alloy substrate and pre-treating it to be cleaned; roughening the surface of the substrate; activating the surface of the substrate; chemically plating the substrate to form a nickel coating on its surface; and electroplating the substrate to form, in order, a first nickel coating, a copper coating, a second nickel coating, and a chromium coating on the chemically produced nickel coating.
摘要翻译： 一种用于镁和镁合金的电镀方法，包括：提供镁或镁合金基底并预处理待清洁; 粗糙化基材的表面; 激活基板的表面; 化学镀基板以在其表面上形成镍涂层; 以及对该基板进行电镀，以依次形成化学生产的镍涂层上的第一镍涂层，铜涂层，第二镍涂层和铬涂层。
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公开(公告)号：US20090255824A1
公开(公告)日：2009-10-15
申请号：US12416248
申请日：2009-04-01
申请人： JONG-YI SU , CHENG-SHIN CHEN , YUEH-FENG LEE , CHUAN-LONG CHEN , REN-NING WANG , RUN-YI CHEN
发明人： JONG-YI SU , CHENG-SHIN CHEN , YUEH-FENG LEE , CHUAN-LONG CHEN , REN-NING WANG , RUN-YI CHEN
IPC分类号： C25D5/10
摘要： A method for surface treating a substrate includes following steps. Firstly, a substrate including a metallic surface capable of being electroplated with a metal coating is provided. Secondly, a first metal coating is electroplated onto the metallic surface of the substrate. Thirdly, an oxidized metal film is formed to cover the first metal coating. The first metal coating of substrate is blasted using quartz sand. The oxidized metal film is removed from the first metal coating. The second metal coating is electroplated onto the first metal coating.
摘要翻译： 用于表面处理基材的方法包括以下步骤。 首先，提供一种包括能够用金属涂层电镀的金属表面的基板。 其次，将第一金属涂层电镀到基底的金属表面上。 第三，形成氧化金属膜以覆盖第一金属涂层。 使用石英砂对基材的第一金属涂层进行喷砂处理。 从第一金属涂层去除氧化金属膜。 将第二金属涂层电镀到第一金属涂层上。
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公开(公告)号：US20090255823A1
公开(公告)日：2009-10-15
申请号：US12416246
申请日：2009-04-01
申请人： JONG-YI SU , CHENG-SHIN CHEN , REN-NING WANG
发明人： JONG-YI SU , CHENG-SHIN CHEN , REN-NING WANG
IPC分类号： C25D5/14
CPC分类号： C25D5/14 , C23C28/023 , C25D3/04 , C25D3/10 , C25D5/56
摘要： A method for electroplating a plastic substrate includes the following steps, a plastic substrate is firstly provided. The plastic substrate is then pretreated to form a noble metal coating. The noble metal coating is coated with a copper coating. A first chrome coating is electroplated onto the copper coating using a first electrolyte including a chromic component. A second chrome coating is electroplated onto the first chrome coating using a second electrolyte including a chromyl component.
摘要翻译： 一种电镀塑料基板的方法包括以下步骤：首先提供塑料基板。 然后将塑料基材预处理以形成贵金属涂层。 贵金属涂层涂覆有铜涂层。 使用包括铬组分的第一电解质将第一镀铬层电镀到铜涂层上。 使用包含染色体组分的第二电解质将第二镀铬层电镀到第一镀铬层上。
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