Using multiple sources/detectors for high-throughput X-ray topography measurement

    公开(公告)号:US09726624B2

    公开(公告)日:2017-08-08

    申请号:US14735168

    申请日:2015-06-10

    Abstract: An apparatus for X-ray topography includes a source assembly, a detector assembly, a scanning assembly and a processor. The source assembly is configured to direct multiple X-ray beams so as to irradiate multiple respective regions on a sample, wherein the regions partially overlap one another along a first axis of the sample and are offset relative to one another along a second axis of the sample that is orthogonal to the first axis. The detector assembly is configured to detect the X-ray beams diffracted from the sample and to produce respective electrical signals in response to the detected X-ray beams. The scanning assembly is configured to move the sample relative to the source assembly and the detector assembly along the second axis. The processor is configured to identify defects in the sample by processing the electrical signals, which are produced by the detector assembly while the sample is moved.

    Estimation of XRF intensity from an array of micro-bumps
    2.
    发明授权
    Estimation of XRF intensity from an array of micro-bumps 有权
    从微阵列阵列估计XRF强度

    公开(公告)号:US09389192B2

    公开(公告)日:2016-07-12

    申请号:US14222635

    申请日:2014-03-23

    CPC classification number: G01N23/223 G01N2223/076

    Abstract: A method for inspection includes capturing an optical image of one or more features on a surface of a sample and irradiating an area of the sample containing at least one of the features with an X-ray beam. An intensity of X-ray fluorescence emitted from the sample in response to the irradiating X-ray beam is measured. The optical image is processed so as to extract geometrical parameters of the at least one of the features and to compute a correction factor responsively to the geometrical parameters. The correction factor is applied to the measured intensity in order to derive a property of the at least one of the features.

    Abstract translation: 检查方法包括:在样品的表面上捕获一个或多个特征的光学图像,并用X射线束照射含有至少一个特征的样品的区域。 测量响应于照射X射线束从样品发射的X射线荧光的强度。 处理光学图像以便提取至少一个特征的几何参数并且计算响应于几何参数的校正因子。 校正因子被应用于测量的强度,以便导出至少一个特征的属性。

    X-ray scatterometry apparatus
    3.
    发明授权

    公开(公告)号:US09606073B2

    公开(公告)日:2017-03-28

    申请号:US14735162

    申请日:2015-06-10

    CPC classification number: G01N23/201 G01N2223/6116

    Abstract: Apparatus, including a sample-support that retains a sample in a plane having an axis, the plane defining first and second regions separated by the plane. A source-mount in the first region rotates about the axis, and an X-ray source on the source-mount directs first and second incident beams of X-rays to impinge on the sample at first and second angles along beam axes that are orthogonal to the axis. A detector-mount in the second region moves in a plane orthogonal to the axis and an X-ray detector on the detector-mount receives first and second diffracted beams of X-rays transmitted through the sample in response to the first and second incident beams, and outputs first and second signals, respectively, in response to the received first and second diffracted beams. A processor analyzes the first and the second signals so as to determine a profile of a surface of the sample.

    X-RAY SCATTEROMETRY APPARATUS
    4.
    发明申请
    X-RAY SCATTEROMETRY APPARATUS 有权
    X射线扫描仪

    公开(公告)号:US20150369759A1

    公开(公告)日:2015-12-24

    申请号:US14735162

    申请日:2015-06-10

    CPC classification number: G01N23/201 G01N2223/6116

    Abstract: Apparatus, including a sample-support that retains a sample in a plane having an axis, the plane defining first and second regions separated by the plane. A source-mount in the first region rotates about the axis, and an X-ray source on the source-mount directs first and second incident beams of X-rays to impinge on the sample at first and second angles along beam axes that are orthogonal to the axis. A detector-mount in the second region moves in a plane orthogonal to the axis and an X-ray detector on the detector-mount receives first and second diffracted beams of X-rays transmitted through the sample in response to the first and second incident beams, and outputs first and second signals, respectively, in response to the received first and second diffracted beams. A processor analyzes the first and the second signals so as to determine a profile of a surface of the sample.

    Abstract translation: 一种装置,包括将样品保持在具有轴的平面中的样品支撑体,所述平面限定由平面分隔的第一和第二区域。 第一区域中的源极安装围绕轴线旋转,源极安装座上的X射线源引导X射线的第一和第二入射光束沿着正交的束轴以第一和第二角度以第一和第二角度撞击在样品上 到轴。 第二区域中的检测器安装件在与轴线正交的平面中移动,并且检测器安装座上的X射线检测器响应于第一和第二入射光束接收通过样品传输的第一和第二衍射光束的X射线 并且响应于接收到的第一和第二衍射光束分别输出第一和第二信号。 处理器分析第一和第二信号,以便确定样品表面的轮廓。

    ESTIMATION OF XRF INTENSITY FROM AN ARRAY OF MICRO-BUMPS
    5.
    发明申请
    ESTIMATION OF XRF INTENSITY FROM AN ARRAY OF MICRO-BUMPS 有权
    从微阵列的XRF强度的估计

    公开(公告)号:US20140286473A1

    公开(公告)日:2014-09-25

    申请号:US14222635

    申请日:2014-03-23

    CPC classification number: G01N23/223 G01N2223/076

    Abstract: A method for inspection includes capturing an optical image of one or more features on a surface of a sample and irradiating an area of the sample containing at least one of the features with an X-ray beam. An intensity of X-ray fluorescence emitted from the sample in response to the irradiating X-ray beam is measured. The optical image is processed so as to extract geometrical parameters of the at least one of the features and to compute a correction factor responsively to the geometrical parameters. The correction factor is applied to the measured intensity in order to derive a property of the at least one of the features.

    Abstract translation: 检查方法包括:在样品的表面上捕获一个或多个特征的光学图像,并用X射线束照射含有至少一个特征的样品的区域。 测量响应于照射X射线束从样品发射的X射线荧光的强度。 处理光学图像以便提取至少一个特征的几何参数并且计算响应于几何参数的校正因子。 校正因子被应用于测量的强度,以便导出至少一个特征的属性。

    Measurement of small features using XRF

    公开(公告)号:US09829448B2

    公开(公告)日:2017-11-28

    申请号:US14922220

    申请日:2015-10-26

    CPC classification number: G01N23/223 G01B15/02 G01N2223/303

    Abstract: A method for X-ray measurement includes, in a calibration phase, scanning a first X-ray beam, having a first beam profile, across a feature of interest on a calibration sample and measuring first X-ray fluorescence (XRF) emitted from the feature and from background areas of the calibration sample surrounding the feature. Responsively to the first XRF and the first beam profile, a relative emission factor is computed. In a test phase, a second X-ray beam, having a second beam profile, different from the first beam profile, is directed to impinge on the feature of interest on a test sample and second XRF emitted from the test sample is measured in response to the second X-ray beam. A property of the feature of interest on the test sample is computed by applying the relative emission factor together with the second beam profile to the measured second XRF.

    MEASUREMENT OF SMALL FEATURES USING XRF
    7.
    发明申请
    MEASUREMENT OF SMALL FEATURES USING XRF 有权
    使用XRF测量小特征

    公开(公告)号:US20160123909A1

    公开(公告)日:2016-05-05

    申请号:US14922220

    申请日:2015-10-26

    CPC classification number: G01N23/223 G01B15/02 G01N2223/303

    Abstract: A method for X-ray measurement includes, in a calibration phase, scanning a first X-ray beam, having a first beam profile, across a feature of interest on a calibration sample and measuring first X-ray fluorescence (XRF) emitted from the feature and from background areas of the calibration sample surrounding the feature. Responsively to the first XRF and the first beam profile, a relative emission factor is computed. In a test phase, a second X-ray beam, having a second beam profile, different from the first beam profile, is directed to impinge on the feature of interest on a test sample and second XRF emitted from the test sample is measured in response to the second X-ray beam. A property of the feature of interest on the test sample is computed by applying the relative emission factor together with the second beam profile to the measured second XRF.

    Abstract translation: 一种用于X射线测量的方法包括:在校准阶段,扫描具有第一光束轮廓的第一X射线束跨越校准样本上的感兴趣特征,并测量从第二射线谱发射的第一X射线荧光(XRF) 特征和来自该特征周围的校准样本的背景区域。 响应于第一XRF和第一光束轮廓,计算相对排放因子。 在测试阶段,具有不同于第一光束轮廓的第二光束轮廓的第二X射线束被引导以撞击测试样本上的感兴趣特征,并且响应地测量从测试样品发射的第二X射线 到第二个X射线束。 通过将相对放射因子与第二光束轮廓应用于测量的第二XRF来计算测试样品上的感兴趣特征的特性。

    X-RAY SOURCE ASSEMBLY
    8.
    发明申请
    X-RAY SOURCE ASSEMBLY 有权
    X射线源组件

    公开(公告)号:US20150243469A1

    公开(公告)日:2015-08-27

    申请号:US14565474

    申请日:2014-12-10

    CPC classification number: G21K1/06 H01J35/14 H05G1/52

    Abstract: An apparatus includes an X-ray tube, X-ray optics, one or more coils and control circuitry. The X-ray tube is configured to direct an electron beam onto an anode so as to emit an X-ray beam. The X-ray optics which configured to receive the X-ray beam emitted from the X-ray tube and to direct the X-ray beam onto a target. The coils are configured to steer the electron beam in the X-ray tube using electrical currents flowing through the coils. The control circuitry is configured to compensate for misalignment between the X-ray tube and the X-ray optics by analyzing the X-ray beam output by the X-ray optics, and setting the electrical currents based on the analyzed X-ray beam.

    Abstract translation: 一种装置包括X射线管,X射线光学器件,一个或多个线圈和控制电路。 X射线管被配置为将电子束引导到阳极上以发射X射线束。 X射线光学元件,被配置为接收从X射线管发射的X射线束并将X射线束引导到目标上。 线圈构造成使用流过线圈的电流来引导X射线管中的电子束。 控制电路被配置为通过分析由X射线光学器件输出的X射线束并且基于所分析的X射线束来设定电流来补偿X射线管与X射线光学元件之间的未对准。

    X-ray source assembly
    9.
    发明授权

    公开(公告)号:US09666322B2

    公开(公告)日:2017-05-30

    申请号:US14565474

    申请日:2014-12-10

    CPC classification number: G21K1/06 H01J35/14 H05G1/52

    Abstract: An apparatus includes an X-ray tube, X-ray optics, one or more coils and control circuitry. The X-ray tube is configured to direct an electron beam onto an anode so as to emit an X-ray beam. The X-ray optics which configured to receive the X-ray beam emitted from the X-ray tube and to direct the X-ray beam onto a target. The coils are configured to steer the electron beam in the X-ray tube using electrical currents flowing through the coils. The control circuitry is configured to compensate for misalignment between the X-ray tube and the X-ray optics by analyzing the X-ray beam output by the X-ray optics, and setting the electrical currents based on the analyzed X-ray beam.

    X-ray inspection of bumps on a semiconductor substrate

    公开(公告)号:US09390984B2

    公开(公告)日:2016-07-12

    申请号:US13647408

    申请日:2012-10-09

    CPC classification number: H01L22/12

    Abstract: A method for inspection includes irradiating, with a focused beam, a feature formed on a semiconductor wafer, the feature including a volume containing a first material and a cap made of a second material, different from the first material, that is formed over the volume. One or more detectors positioned at different angles relative to the feature are used to detect X-ray fluorescent photons that are emitted by the first material in response to the irradiating beam and pass through the cap before striking the detectors. Signals output by the one or more detectors at the different angles in response to the detected photons are processed in order to assess a quality of the cap.

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