公开(公告)号：US20200075531A1

公开(公告)日：2020-03-05

申请号：US16550357

申请日：2019-08-26

Applicant: JTEKT CORPORATION

Inventor： Yoshinori IMOTO ,  Koichi SHIIBA ,  Koichiro MATSUHISA

IPC: H01L23/00 ,  H01L21/02 ,  H01L21/67

Abstract: Provided are a welding apparatus having a reduced size. A welding apparatus includes a support base having a placement surface, and a restriction member. A substrate with a semiconductor element disposed thereon is placed on the placement surface such that a surface electrode of the semiconductor element faces upward. A wiring member is placed on the surface electrode. The restriction member restricts movement of the surface electrode and the wiring member in the directions away from each other, by holding the substrate with the semiconductor element disposed thereon and the wiring member, between the placement surface and the restriction member. The welding apparatus further includes a laser device. The laser device locally heats a welding interface between the surface electrode and the wiring member by irradiating a laser beam onto the surface of the wiring member through a hole in the restriction member.

公开(公告)号：US20190275614A1

公开(公告)日：2019-09-12

申请号：US16293720

申请日：2019-03-06

Applicant: JTEKT CORPORATION

Inventor： Yoshinori IMOTO ,  Koichi SHIIBA

IPC: B23K26/354 ,  B33Y10/00 ,  B33Y30/00 ,  B23K26/34

Abstract: A shaping method using an additively shaping device is a shaping method of additively shaping a shaped article by melting metal powder through irradiation of a shaping optical beam and then solidifying the melted metal powder. The shaping method includes: a first step of preparing, in an irradiation area on a baseplate, a first layer of the shaped article having on an upper surface of the first layer a trough portion that is formed in a recessed manner along a predetermined axis; a second step of feeding the metal powder to the trough portion; and a third step of, after the process of the second step, applying the shaping optical beam to the metal powder fed to the trough portion to melt the metal powder.

公开(公告)号：US20190143407A1

公开(公告)日：2019-05-16

申请号：US16185486

申请日：2018-11-09

Applicant: JTEKT CORPORATION

Inventor： Yoshinori IMOTO ,  Koichi SHIIBA ,  Takaya NAGAHAMA

IPC: B22F3/10 ,  B22F3/105 ,  B33Y10/00 ,  B33Y30/00

Abstract: To provide an additive manufacturing apparatus of a shaped article capable of suppressing evaporation of metal and scattering of spatters. An additive manufacturing apparatus of the shaped article includes a temporary heating device heating metal powder arranged in layers at a temperature equal to or lower than a fusing point of the metal powder to allow the metal powder to be diffusion bonded and a main heating device heating the metal powder at a temperature equal to or higher than the fusing point of the metal powder by irradiating the diffusion-bonded metal powder with a light beam to thereby form a shaped article. The temporary heating device heats a range wider than an irradiation range with the light beam by the main heating device.

公开(公告)号：US20200176414A1

公开(公告)日：2020-06-04

申请号：US16693476

申请日：2019-11-25

Applicant: JTEKT CORPORATION

Inventor： Koichiro MATSUHISA ,  Yoshinori IMOTO

IPC: H01L23/00

Abstract: A joint device includes a regulation device, a heating device, and a transparent portion. The regulation device includes a support base that includes a placement surface, and a regulation member. The heating device applies heat for causing solid phase diffusion at a joint interface between the two metal members by radiating an electromagnetic beam to a beam irradiated region via the regulation member. The beam irradiated region is set on a surface of one of the two metal members that is farther from the placement surface while the regulation device regulates motion of the two metal members. The transparent portion is provided at least at a portion corresponding to the beam irradiated region of the metal member to which the electromagnetic beam is irradiated, to transmit the electromagnetic beam.

公开(公告)号：US20170291259A1

公开(公告)日：2017-10-12

申请号：US15481050

申请日：2017-04-06

Applicant: JTEKT CORPORATION

Inventor： Yoshinori IMOTO ,  Takaya NAGAHAMA ,  Koichi SHIIBA

IPC: B23K26/211 ,  B23K26/323 ,  H01L21/48 ,  B23K26/70 ,  C23C26/00 ,  B23K26/34 ,  B23K26/06

Abstract: A bonding method includes: an oxide-film forming step, on an irradiated surface, an oxide film having a film thickness corresponding to a first output and an irradiation time of an oxide-film-forming laser beam; a first reflected-laser-beam detection step of detecting a second output; a first absorptance computing step of computing a first absorptance for the oxide-film-forming laser beam; laser-beam switching step of switching the oxide-film-forming laser beam radiated onto the irradiated surface to a heat-bonding laser beam; and a heat bonding step of heating a first bonding surface until the temperature thereof reaches a predetermined bonding temperature, and bonding the first bonding surface to a second bonding surface.

公开(公告)号：US20170110435A1

公开(公告)日：2017-04-20

申请号：US15292598

申请日：2016-10-13

Applicant: JTEKT Corporation

Inventor： Takaya NAGAHAMA ,  Koichi SHIIBA ,  Yoshinori IMOTO

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/66 ,  H01L21/48

CPC classification number: H01L24/85 ,  B23K26/032 ,  B23K26/034 ,  B23K26/0622 ,  B23K26/20 ,  B23K2101/35 ,  B23K2101/42 ,  B23K2103/08 ,  B23K2103/18 ,  B23K2103/56 ,  H01L21/4885 ,  H01L21/67115 ,  H01L22/10 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/37147 ,  H01L2224/40151 ,  H01L2224/485 ,  H01L2224/84214 ,  H01L2924/01029 ,  H01L2924/00014

Abstract: A heating method includes an oxide film forming step and a heating step. The thickness of an oxide film is set in a first range that includes a first maximal thickness and a second maximal thickness and that is smaller than a second minimal thickness in the relationship with the laser absorption having a periodic profile. The first maximal thickness corresponds to a first maximal value a of the laser absorption. The second maximal thickness corresponds to a second maximal value of the laser absorption. The second minimal thickness corresponds to a second minimal value of the laser absorption, namely the minimal value of the laser absorption that appears between the second maximal value and a third maximal value, or the maximal value of the laser absorption that appears subsequent to the second maximal value.