公开(公告)号：US20210213565A1

公开(公告)日：2021-07-15

申请号：US17137551

申请日：2020-12-30

Applicant: JTEKT CORPORATION

Inventor： Makoto TANO ,  Takaya NAGAHAMA ,  Koichi SHIIBA ,  Takashi MIZOGUCHI ,  Kohei KATO ,  Sho HASEGAWA

IPC: B23K26/342 ,  B23K26/06 ,  B23K26/00 ,  B23K26/082 ,  B33Y30/00 ,  B33Y70/10 ,  B33Y50/02 ,  B22F12/41 ,  B22F10/85

Abstract: An additive manufacturing device includes: an inner light beam radiation device of radiating an inner light beam; an outer light beam radiation device of radiating an outer light beam; and a control device. when a molten pool is irradiated with the outer light beam, the control device controls a power density of the outer light beam representing an output per unit area such that a cooling rate of the molten pool representing a temperature drop per unit time is 540° C./s or less at a freezing point of a carbide binder included in the molten pool, the molten pool being formed by irradiating a material including a hard material and a carbide binder with the inner light beam to melt the material. According to the present disclosure, the additive manufacturing device can prevent cracking and additively manufacture a high-quality shaped object with a simple configuration.

公开(公告)号：US20240157479A1

公开(公告)日：2024-05-16

申请号：US18422912

申请日：2024-01-25

Applicant: JTEKT CORPORATION

Inventor： Makoto TANO ,  Takaya NAGAHAMA ,  Koichi SHIIBA ,  Takashi MIZOGUCHI ,  Kohei KATO ,  Sho HASEGAWA

IPC: B23K26/342 ,  B22F10/85 ,  B22F12/41 ,  B23K26/00 ,  B23K26/06 ,  B23K26/082 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y70/10

CPC classification number: B23K26/342 ,  B22F10/85 ,  B22F12/41 ,  B23K26/0006 ,  B23K26/0608 ,  B23K26/0613 ,  B23K26/0626 ,  B23K26/082 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y70/10 ,  B22F2301/15 ,  B23K26/0736

Abstract: An additive manufacturing device includes: an inner light beam radiation device of radiating an inner light beam; an outer light beam radiation device of radiating an outer light beam; and a control device. when a molten pool is irradiated with the outer light beam, the control device controls a power density of the outer light beam representing an output per unit area such that a cooling rate of the molten pool representing a temperature drop per unit time is 540° C./s or less at a freezing point of a carbide binder included in the molten pool, the molten pool being formed by irradiating a material including a hard material and a carbide binder with the inner light beam to melt the material. According to the present disclosure, the additive manufacturing device can prevent cracking and additively manufacture a high-quality shaped object with a simple configuration.

公开(公告)号：US20220023950A1

公开(公告)日：2022-01-27

申请号：US17311050

申请日：2019-12-06

Applicant: JTEKT CORPORATION

Inventor： Takaya NAGAHAMA ,  Makoto TANO ,  Koichi SHIIBA

IPC: B22F10/366 ,  B22F10/20 ,  B22F12/13 ,  B22F12/53 ,  B22F12/45 ,  B22F12/55 ,  B22F12/00 ,  B33Y40/10 ,  B33Y30/00

Abstract: An additive manufacturing device that forms a shaped object on a base by using one material of a powdery material and a linear material includes an additive material supply unit, a light irradiation unit, and a control unit that controls supply of the one material, irradiation with a light beam, and relative movement of the light beam. The light irradiation unit includes a central light beam irradiation part and an outer-side light beam irradiation part. The control unit separately controls an output condition of the central light beam irradiation part and an output condition of the outer-side light beam irradiation part, and the control unit increases a peak in a distribution shape of power density of the central light beam to be larger than a peak in a distribution shape of power density of the outer-side light beam to form the shaped object.

公开(公告)号：US20170291259A1

公开(公告)日：2017-10-12

申请号：US15481050

申请日：2017-04-06

Applicant: JTEKT CORPORATION

Inventor： Yoshinori IMOTO ,  Takaya NAGAHAMA ,  Koichi SHIIBA

IPC: B23K26/211 ,  B23K26/323 ,  H01L21/48 ,  B23K26/70 ,  C23C26/00 ,  B23K26/34 ,  B23K26/06

Abstract: A bonding method includes: an oxide-film forming step, on an irradiated surface, an oxide film having a film thickness corresponding to a first output and an irradiation time of an oxide-film-forming laser beam; a first reflected-laser-beam detection step of detecting a second output; a first absorptance computing step of computing a first absorptance for the oxide-film-forming laser beam; laser-beam switching step of switching the oxide-film-forming laser beam radiated onto the irradiated surface to a heat-bonding laser beam; and a heat bonding step of heating a first bonding surface until the temperature thereof reaches a predetermined bonding temperature, and bonding the first bonding surface to a second bonding surface.

公开(公告)号：US20170110435A1

公开(公告)日：2017-04-20

申请号：US15292598

申请日：2016-10-13

Applicant: JTEKT Corporation

Inventor： Takaya NAGAHAMA ,  Koichi SHIIBA ,  Yoshinori IMOTO

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/66 ,  H01L21/48

CPC classification number: H01L24/85 ,  B23K26/032 ,  B23K26/034 ,  B23K26/0622 ,  B23K26/20 ,  B23K2101/35 ,  B23K2101/42 ,  B23K2103/08 ,  B23K2103/18 ,  B23K2103/56 ,  H01L21/4885 ,  H01L21/67115 ,  H01L22/10 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/37147 ,  H01L2224/40151 ,  H01L2224/485 ,  H01L2224/84214 ,  H01L2924/01029 ,  H01L2924/00014

Abstract: A heating method includes an oxide film forming step and a heating step. The thickness of an oxide film is set in a first range that includes a first maximal thickness and a second maximal thickness and that is smaller than a second minimal thickness in the relationship with the laser absorption having a periodic profile. The first maximal thickness corresponds to a first maximal value a of the laser absorption. The second maximal thickness corresponds to a second maximal value of the laser absorption. The second minimal thickness corresponds to a second minimal value of the laser absorption, namely the minimal value of the laser absorption that appears between the second maximal value and a third maximal value, or the maximal value of the laser absorption that appears subsequent to the second maximal value.

公开(公告)号：US20240335877A1

公开(公告)日：2024-10-10

申请号：US18681657

申请日：2021-09-06

Applicant: JTEKT CORPORATION

Inventor： Makoto TANO ,  Takaya NAGAHAMA ,  Keisuke USUDA ,  Koichi SHIIBA ,  Kohei KATO ,  Masato ITO

IPC: B22F10/28 ,  B22F10/364 ,  B22F10/368 ,  B22F10/66 ,  B33Y30/00 ,  B33Y40/20

CPC classification number: B22F10/28 ,  B22F10/364 ,  B22F10/368 ,  B22F10/66 ,  B33Y30/00 ,  B33Y40/20 ,  B22F2203/11 ,  B22F2302/10

Abstract: A composite processing machine includes: a holding portion capable of holding a workpiece; a removal processing portion that performs removal processing on the workpiece held by the holding portion, the removal processing portion being capable of performing removal processing of a hard material; an additive manufacturing portion that applies the hard material to a surface of the workpiece held by the holding portion by melting the hard material while supplying the hard material to the surface; and a control unit that controls the composite processing machine. The control unit is configured to: control the additive manufacturing portion to form an additive portion made of the hard material on the surface of the workpiece held by the holding portion; and control the removal processing portion to perform the removal processing on the additive portion formed on the workpiece held by the holding portion.

公开(公告)号：US20200075531A1

公开(公告)日：2020-03-05

申请号：US16550357

申请日：2019-08-26

Applicant: JTEKT CORPORATION

Inventor： Yoshinori IMOTO ,  Koichi SHIIBA ,  Koichiro MATSUHISA

IPC: H01L23/00 ,  H01L21/02 ,  H01L21/67

Abstract: Provided are a welding apparatus having a reduced size. A welding apparatus includes a support base having a placement surface, and a restriction member. A substrate with a semiconductor element disposed thereon is placed on the placement surface such that a surface electrode of the semiconductor element faces upward. A wiring member is placed on the surface electrode. The restriction member restricts movement of the surface electrode and the wiring member in the directions away from each other, by holding the substrate with the semiconductor element disposed thereon and the wiring member, between the placement surface and the restriction member. The welding apparatus further includes a laser device. The laser device locally heats a welding interface between the surface electrode and the wiring member by irradiating a laser beam onto the surface of the wiring member through a hole in the restriction member.

公开(公告)号：US20190275614A1

公开(公告)日：2019-09-12

申请号：US16293720

申请日：2019-03-06

Applicant: JTEKT CORPORATION

Inventor： Yoshinori IMOTO ,  Koichi SHIIBA

IPC: B23K26/354 ,  B33Y10/00 ,  B33Y30/00 ,  B23K26/34

Abstract: A shaping method using an additively shaping device is a shaping method of additively shaping a shaped article by melting metal powder through irradiation of a shaping optical beam and then solidifying the melted metal powder. The shaping method includes: a first step of preparing, in an irradiation area on a baseplate, a first layer of the shaped article having on an upper surface of the first layer a trough portion that is formed in a recessed manner along a predetermined axis; a second step of feeding the metal powder to the trough portion; and a third step of, after the process of the second step, applying the shaping optical beam to the metal powder fed to the trough portion to melt the metal powder.

公开(公告)号：US20190143407A1

公开(公告)日：2019-05-16

申请号：US16185486

申请日：2018-11-09

Applicant: JTEKT CORPORATION

Inventor： Yoshinori IMOTO ,  Koichi SHIIBA ,  Takaya NAGAHAMA

IPC: B22F3/10 ,  B22F3/105 ,  B33Y10/00 ,  B33Y30/00

Abstract: To provide an additive manufacturing apparatus of a shaped article capable of suppressing evaporation of metal and scattering of spatters. An additive manufacturing apparatus of the shaped article includes a temporary heating device heating metal powder arranged in layers at a temperature equal to or lower than a fusing point of the metal powder to allow the metal powder to be diffusion bonded and a main heating device heating the metal powder at a temperature equal to or higher than the fusing point of the metal powder by irradiating the diffusion-bonded metal powder with a light beam to thereby form a shaped article. The temporary heating device heats a range wider than an irradiation range with the light beam by the main heating device.