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180 条记录 (耗时 0.039 秒)

    Cache move-in bypass
    1.
    发明授权
    Cache move-in bypass 失效
    缓存移入旁路

    公开(公告)号：US4851993A

    公开(公告)日：1989-07-25

    申请号：US41046

    申请日：1987-04-20

    申请人： Jack Chen ,  Jeffrey A. Thomas ,  Joseph A. Petolino, Jr. ,  Michael J. Begley ,  Ajay Shah ,  Michael D. Taylor ,  Richard J. Tobias

    发明人： Jack Chen ,  Jeffrey A. Thomas ,  Joseph A. Petolino, Jr. ,  Michael J. Begley ,  Ajay Shah ,  Michael D. Taylor ,  Richard J. Tobias

    IPC分类号： G06F9/38 ,  G06F12/08

    CPC分类号： G06F12/0855 ,  G06F12/0888 ,  G06F9/3826

    摘要： Bypassing of data from a main storage unit to an instruction and operand processing unit around an intermediate storage unit improves performance in a data processing system. The instruction and operand processing unit supplies requests for operands to the intermediate storage unit or cache. If the line is missing from the cache, the request operand is retrieved from the main storage unit. A bypass data path is connected between the main storage unit, prior to error detecting means in the cache, and the instruction and operand processing unit for transferring requested operands to the instruction and operand processing unit directly. Control, coupled to receive requests for operands and to the instruction and operand processing unit, signals the instruction and operand processing unit to receive the requested operands from the bypass data path when the data includes a requested operand.

    摘要翻译： 将数据从主存储单元旁路到中间存储单元周围的指令和操作数处理单元，提高了数据处理系统的性能。 指令和操作数处理单元向中间存储单元或高速缓存提供对操作数的请求。 如果从缓存中缺少该行，则从主存储单元检索请求操作数。 旁路数据路径连接在主存储单元之前，在高速缓存中的错误检测装置之前，以及用于将请求的操作数直接传送到指令和操作数处理单元的指令和操作数处理单元。 控制，耦合以接收对操作数的请求以及指令和操作数处理单元的信号，指示和操作数处理单元在数据包括请求的操作数时从旁路数据路径接收所请求的操作数。

    Human powered watercraft or land vehicle
    2.
    发明授权
    Human powered watercraft or land vehicle 有权

    公开(公告)号：US10442514B2

    公开(公告)日：2019-10-15

    申请号：US16164718

    申请日：2018-10-18

    申请人： Jack Chen

    发明人： Jack Chen

    IPC分类号： B63H16/18 ,  B60F3/00 ,  B63H23/04 ,  B63H23/02

    摘要： A human powered watercraft or land vehicle is described herein. A watercraft or land vehicle may have two pedals that reciprocated are in a linear or slightly curved trajectory but not a circular motion. As the two pedals are reciprocated, an output shaft is rotated in either a clockwise or counterclockwise direction when the left pedal is pushed forward or when the right pedal is pushed forward. The output shaft may be connected to a propeller of a watercraft or a land vehicle so as to propel the watercraft or land vehicle forward. The output shaft may receive rotational input through two gears mounted to the output shaft with one-way bearings that enable the output shaft to rotate in the same direction regardless of whether the left pedal or the right pedal is being pushed forward.

    Methods and systems to perform a computer task in a reduced power consumption state
    4.
    发明授权
    Methods and systems to perform a computer task in a reduced power consumption state 有权
    在降低功耗状态下执行计算机任务的方法和系统

    公开(公告)号：US08910169B2

    公开(公告)日：2014-12-09

    申请号：US12241849

    申请日：2008-09-30

    申请人： Jing W. Wang ,  Ming Kuang ,  Michael A. Rothman ,  Vincent J. Zimmer ,  Jack Chen ,  Yebin Andy Zhao

    发明人： Jing W. Wang ,  Ming Kuang ,  Michael A. Rothman ,  Vincent J. Zimmer ,  Jack Chen ,  Yebin Andy Zhao

    IPC分类号： G06F1/32

    CPC分类号： G06F1/3203

    摘要： Methods and systems to perform a computer task in a reduced power consumption state, including to virtualize physical resources with respect to an operating environment and service environment, to exit the operating environment and enter the service environment, to place a first set of one or more of the physical resources in a reduced power consumption state, and to perform a task in the service environment utilizing a processor and a second set of one or more of the physical resources. A physical resource may be assigned to an operating environment upon an initialization of the operating environment, and re-assigned to the service environment to be utilized by the service environment while other physical resources are placed in a reduced power consumption state.

    摘要翻译： 在降低的功耗状态下执行计算机任务的方法和系统，包括虚拟化相对于操作环境和服务环境的物理资源，以退出操作环境并进入服务环境，以放置第一组一个或多个 的物理资源，并且使用处理器和一个或多个物理资源的第二组在服务环境中执行任务。 物理资源可以在操作环境的初始化时被分配给操作环境，并且被重新分配给要由服务环境利用的服务环境，而其他物理资源被置于降低的功耗状态。

    Tent
    5.
    发明授权
    Tent 失效
    帐篷

    公开(公告)号：US08555909B2

    公开(公告)日：2013-10-15

    申请号：US13242015

    申请日：2011-09-23

    申请人： Jack Chen

    发明人： Jack Chen

    IPC分类号： E04H15/44

    CPC分类号： E04H15/38 ,  E04H6/005 ,  E04H6/04

    摘要： A tent having two joints, multiple frames and a fly. The frames are mounted on the joints and are classified into a stationary frame, a supporting frame and at least one pivoting frame. The frames cooperate to define a parking space for receiving a cycle when unfolding. The fly covers the frames and the parking space. The frames are capable of folding and overlapping one another to facilitate carrying and storage of the tent.

    摘要翻译： 一个帐篷有两个关节，多个框架和飞行。 框架安装在接头上，并分为固定框架，支撑框架和至少一个枢转框架。 这些框架协作以定义用于在展开时接收周期的停车空间。 苍蝇覆盖框架和停车位。 这些框架能够彼此折叠和重叠，以便于帐篷的搬运和储存。

    Offset correction techniques for positioning substrates within a processing chamber
    6.
    发明授权
    Offset correction techniques for positioning substrates within a processing chamber 有权
    用于将衬底定位在处理室内的偏移校正技术

    公开(公告)号：US08135485B2

    公开(公告)日：2012-03-13

    申请号：US12237155

    申请日：2008-09-24

    申请人： Jack Chen ,  Andrew D. Bailey, III ,  Ben Mooring ,  Stephen J Cain

    发明人： Jack Chen ,  Andrew D. Bailey, III ,  Ben Mooring ,  Stephen J Cain

    IPC分类号： H01L21/00 ,  G06F19/00 ,  G05B19/418 ,  G05B15/00 ,  B44C1/22 ,  G06K9/00

    CPC分类号： H01L21/681 ,  H01L21/68

    摘要： A method for aligning a substrate to a process center of a support mechanism is provided. The method includes determining substrate thickness after substrate processing at a plurality of orientations and at a plurality of radial distances from a geometric center of the substrate. The method also includes deriving a set of process rate values from substrate thickness and process duration. The method further includes creating for a process rate an off-centered plot, which represents a substantially concentric circle whose points are a circumference of the off-centered plot having substantially the first process rate. The method yet also includes applying a curve-fitting equation to the off-centered plot to determine a set of parameters. The method yet further includes teaching a set of robot arms the set of parameters, thereby enabling the set of robot arms to align another substrate that is supported by the support mechanism with the process center.

    摘要翻译： 提供了一种将基板对准支撑机构的处理中心的方法。 该方法包括在基板处理之后确定基板厚度，该基板在多个取向并且距离基板的几何中心的多个径向距离处。 该方法还包括从衬底厚度和工艺持续时间导出一组工艺速率值。 该方法还包括为处理速率创建偏心图，其表示基本上同心的圆，其点是具有基本上第一处理速率的偏心图的圆周。 该方法还包括将曲线拟合方程应用于偏心图以确定一组参数。 该方法还包括向一组机器人手臂提供一组参数，从而使得该组机器人臂将由支撑机构支撑的另一个基板与处理中心对准。

    Wafer level led package structure for increasing light-emitting efficiency and method for making the same
    9.
    发明申请
    Wafer level led package structure for increasing light-emitting efficiency and method for making the same 审中-公开
    用于提高发光效率的晶片级LED封装结构和制造它的方法

    公开(公告)号：US20100127292A1

    公开(公告)日：2010-05-27

    申请号：US12461742

    申请日：2009-08-24

    申请人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    发明人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    IPC分类号： H01L33/00 ,  H01L21/30

    CPC分类号： H01L33/38 ,  H01L33/508 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A wafer level LED package structure for increasing light-emitting efficiency includes: a light-emitting unit, an insulating unit, two first conductive units and two second conductive units. The light-emitting unit has a light-emitting body, a positive conductive layer, a negative conductive layer, and a reflecting insulating layer formed between the positive conductive layer and the negative conductive layer. The light-emitting body has a bottom material layer and a top material layer. The insulating unit is formed around an outer area of a top surface of the bottom material layer and formed on a top surface of the reflecting insulating layer. One first conductive unit is formed on one part of the positive conductive layer and the insulating unit, and another first conductive unit is formed on one part of the negative conductive layer and the insulating unit. The two second conductive units are respectively formed on the two first conductive units.

    摘要翻译： 用于提高发光效率的晶片级LED封装结构包括：发光单元，绝缘单元，两个第一导电单元和两个第二导电单元。 发光单元具有形成在正导电层和负导电层之间的发光体，正导电层，负导电层和反射绝缘层。 发光体具有底部材料层和顶部材料层。 绝缘单元形成在底部材料层的顶表面的外部区域周围，并形成在反射绝缘层的顶表面上。 一个第一导电单元形成在正导电层和绝缘单元的一部分上，另一个第一导电单元形成在负导电层和绝缘单元的一部分上。 两个第二导电单元分别形成在两个第一导电单元上。

    WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING CONDUCTIVE AREA AND HEAT-DISSIPATING AREA AND METHOD FOR MAKING THE SAME
    10.
    发明申请
    WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING CONDUCTIVE AREA AND HEAT-DISSIPATING AREA AND METHOD FOR MAKING THE SAME 有权
    用于增加导电区域和散热区域的WAFER LEVEL LED封装结构及其制造方法

    公开(公告)号：US20100032706A1

    公开(公告)日：2010-02-11

    申请号：US12346329

    申请日：2008-12-30

    申请人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    发明人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    IPC分类号： H01L33/00 ,  H01L21/02

    CPC分类号： H01L33/38 ,  H01L33/44 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0016 ,  H01L2924/00014

    摘要： A wafer level LED package structure includes a light-emitting unit, a first conductive unit, a second conductive unit and an insulative unit. The light-emitting unit has a light-emitting body, a positive conductive layer and a negative conductive layer formed on the light-emitting body, and a first insulative layer formed between the positive conductive layer and the negative conductive layer. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive layer formed on the first positive conductive layer and a second negative conductive layer formed on the first negative conductive layer. The insulative unit has a second insulative layer formed on the first insulative layer and disposed between the second positive conductive layer and the second negative conductive layer.

    摘要翻译： 晶圆级LED封装结构包括发光单元，第一导电单元，第二导电单元和绝缘单元。 发光单元具有形成在发光体上的发光体，正导电层和负导电层，以及形成在正导电层和负导电层之间的第一绝缘层。 第一导电单元具有形成在正导电层上的第一正导电层和形成在负导电层上的第一负导电层。 第二导电单元具有形成在第一正导电层上的第二正导电层和形成在第一负导电层上的第二负导电层。 绝缘单元具有形成在第一绝缘层上并设置在第二正导电层和第二负导电层之间的第二绝缘层。