Method and system for multi-layer printed circuit board pre-drill
processing
    2.
    发明授权
    Method and system for multi-layer printed circuit board pre-drill processing 失效
    多层印刷电路板预钻加工方法与系统

    公开(公告)号:US4790694A

    公开(公告)日:1988-12-13

    申请号:US916779

    申请日:1986-10-09

    摘要: A method and apparatus for optimizing the drilling position of a multi-layer printed circuit board prior to drilling. A template having precisely located target holes and fixture reference marks provides initial coordinate reference information for multi-layer printed circuit boards to be inspected by x radiation. Each board is processed by insertion into a holding fixture, examination of four quadrant target areas using x-ray sources and detectors, digitization of the target area images in each quadrant, and computaton of the optimum board position in a follow-on drilling apparatus. After optimization, three reference holes are punched along one edge of the board to provide accurate fiducial positioning marks when the board is placed in the drilling apparatus.

    摘要翻译: 一种用于在钻孔之前优化多层印刷电路板的钻孔位置的方法和装置。 具有精确定位的目标孔和夹具参考标记的模板提供了要被x辐射检查的多层印刷电路板的初始坐标参考信息。 每个板通过插入固定夹具进行处理,使用X射线源和检测器检查四个象限目标区域,在每个象限中对目标区域图像进行数字化,以及在后续钻孔设备中计算最佳板位置。 优化后,沿着板的一个边缘冲切三个参考孔,当板放置在钻孔装置中时,提供准确的基准定位标记。