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    Hermetically-sealed packages for electronic components having reduced unused areas
    3.
    发明授权
    Hermetically-sealed packages for electronic components having reduced unused areas 有权

    公开(公告)号：US08317562B2

    公开(公告)日：2012-11-27

    申请号：US13473171

    申请日：2012-05-16

    申请人： Kelvin Nguyen ,  Michelle Nicole Haase Pastel ,  Lu Zhang

    发明人： Kelvin Nguyen ,  Michelle Nicole Haase Pastel ,  Lu Zhang

    IPC分类号： H01J9/24

    CPC分类号： H01L21/67005 ,  H01L51/5246

    摘要： Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances Dfirst (32a) and Dsecond (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of Dfirst (32a) and Dsecond (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).

    HERMETICALLY-SEALED PACKAGES FOR ELECTRONIC COMPONENTS HAVING REDUCED UNUSED AREAS
    4.
    发明申请
    HERMETICALLY-SEALED PACKAGES FOR ELECTRONIC COMPONENTS HAVING REDUCED UNUSED AREAS 有权
    具有减少未使用领域的电子元件的密封封装

    公开(公告)号：US20120225506A1

    公开(公告)日：2012-09-06

    申请号：US13473171

    申请日：2012-05-16

    申请人： Kelvin Nguyen ,  Michelle Nicole Haase Pastel ,  Lu Zhang

    发明人： Kelvin Nguyen ,  Michelle Nicole Haase Pastel ,  Lu Zhang

    IPC分类号： H01L51/56

    CPC分类号： H01L21/67005 ,  H01L51/5246

    摘要： Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances Dfirst (32a) and Dsecond (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of Dfirst (32a) and Dsecond (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).

    摘要翻译： 提供用于电子部件（例如OLED）的密封封装。 封装具有第一玻璃基板（12），第二玻璃基板（16）和分隔第一和第二基板（12,16）并密封基板之间的电子部件（18）的壁（14） 12,16）。 包装具有减小的外部未使用区域，其特征在于距离Dfirst（32a）和D second（32b），其中至少一个，并且在某些实施例中，它们都小于200微米，例如Dfirst（32a ）和Dsecond（32b）约为100微米。 未使用面积的减少可用于通过使用更宽的烧结玻璃料壁（14）来增加观察面积，改善电气引线设计和/或增加封装强度。

    Hermetically-sealed packages for electronic components having reduced unused areas
    5.
    发明申请
    Hermetically-sealed packages for electronic components having reduced unused areas 有权
    用于电子元件的密封封装，减少了未使用的面积

    公开(公告)号：US20090218253A1

    公开(公告)日：2009-09-03

    申请号：US12072792

    申请日：2008-02-28

    申请人： Kelvin Nguyen ,  Michelle Nicole Haase Pastel ,  Lu Zhang

    发明人： Kelvin Nguyen ,  Michelle Nicole Haase Pastel ,  Lu Zhang

    IPC分类号： B65D85/00

    CPC分类号： H01L21/67005 ,  H01L51/5246

    摘要： Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances Dfirst (32a) and Dsecond (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of Dfirst (32a) and Dsecond (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).

    摘要翻译： 提供用于电子部件（例如OLED）的密封封装。 封装具有第一玻璃基板（12），第二玻璃基板（16）和分隔第一和第二基板（12,16）并密封基板之间的电子部件（18）的壁（14） 12,16）。 包装具有减小的外部未使用区域，其特征在于距离Dfirst（32a）和D second（32b），其中至少一个，并且在某些实施例中，它们都小于200微米，例如Dfirst（32a） ）和Dsecond（32b）约为100微米。 未使用面积的减少可用于通过使用更宽的烧结玻璃料壁（14）来增加观察面积，改善电气引线设计和/或增加封装强度。

    Method for forming an organic light emitting diode device
    7.
    发明授权
    Method for forming an organic light emitting diode device 有权
    用于形成有机发光二极管器件的方法

    公开(公告)号：US08440479B2

    公开(公告)日：2013-05-14

    申请号：US12749637

    申请日：2010-03-30

    申请人： Kelvin Nguyen ,  Butchi R. Vaddi ,  Lu Zhang

    发明人： Kelvin Nguyen ,  Butchi R. Vaddi ,  Lu Zhang

    IPC分类号： H01L51/50 ,  H01L21/312 ,  H01J1/62 ,  B23B17/00

    CPC分类号： H01L51/448 ,  H01L27/322 ,  H01L51/5246 ,  H01L51/56 ,  H05B33/04 ,  H05B33/10 ,  Y02E10/549

    摘要： A method for sealing an organic light emitting diode (OLED) device is disclosed wherein the OLED device comprises a color filter. A color filter is deposited on a first glass plate or substrate and a glass-based frit is then deposited in a loop around the color filter, The deposited fit loop is then heated by electromagnetic energy to evaporate organic constituents and to sinter the fit in a pre-sintering step. An OLED device may then be assembled by positioning a second glass plate comprising an organic light emitting material deposited thereon in overlying registration with the first glass plate, with the color filer and the organic light emitting material positioned between the plates. The fit is then heated with a laser to form a hermetic seal between the first and second glass plates.

    摘要翻译： 公开了一种用于密封有机发光二极管（OLED）器件的方法，其中OLED器件包括滤色器。 滤色器沉积在第一玻璃板或基板上，然后将玻璃基玻璃料围绕滤色器沉积在环中。然后通过电磁能量加热沉积的配合环以蒸发有机成分并将其熔合在 预烧结步骤。 然后可以通过将包含沉积在其上的有机发光材料的第二玻璃板与第一玻璃板重叠对准来组装OLED器件，其中彩色滤光片和有机发光材料位于板之间。 然后用激光加热配合，以在第一和第二玻璃板之间形成气密密封。

    Hermetically-sealed packages for electronic components having reduced unused areas
    8.
    发明授权
    Hermetically-sealed packages for electronic components having reduced unused areas 有权
    用于电子元件的密封封装，减少了未使用的面积

    公开(公告)号：US08198807B2

    公开(公告)日：2012-06-12

    申请号：US12072792

    申请日：2008-02-28

    申请人： Kelvin Nguyen ,  Michelle Nicole Haase Pastel ,  Lu Zhang

    发明人： Kelvin Nguyen ,  Michelle Nicole Haase Pastel ,  Lu Zhang

    IPC分类号： H01L51/50

    CPC分类号： H01L21/67005 ,  H01L51/5246

    摘要： Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances Dfirst (32a) and Dsecond (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of Dfirst (32a) and Dsecond (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).

    摘要翻译： 提供用于电子部件（例如OLED）的密封封装。 封装具有第一玻璃基板（12），第二玻璃基板（16）和分隔第一和第二基板（12,16）并密封基板之间的电子部件（18）的壁（14） 12,16）。 包装具有减小的外部未使用区域，其特征在于距离Dfirst（32a）和D second（32b），其中至少一个，并且在某些实施例中，它们都小于200微米，例如Dfirst（32a） ）和Dsecond（32b）约为100微米。 未使用面积的减少可用于通过使用更宽的烧结玻璃料壁（14）来增加观察面积，改善电气引线设计和/或增加封装强度。