Abstract:
According to example embodiments, a semiconductor device includes a substrate, a device isolation layer over the substrate that defines an active region of the substrate, a gate electrode crossing over the active region in between a source region and a drain region of the active region. The gate electrode defines at least one gate opening. The at least one gate opening may expose a portion of a boundary between the active region and the device isolation layer.
Abstract:
The image scanning apparatus includes a light source including at least one light emitting diode (LED) to irradiate light to a document which is a scan target, a light source control unit to control a lighting-up point of time of the light source, an image sensor to transform an image formed by light reflected from the document into an electric signal according to a result of controlling the lighting-up point of time, and an output unit to output image data corresponding to the transformed electric signal.
Abstract:
The image scanning apparatus includes a light source including at least one light emitting diode (LED) to irradiate light to a document which is a scan target, a light source control unit to control a lighting-up point of time of the light source, an image sensor to transform an image formed by light reflected from the document into an electric signal according to a result of controlling the lighting-up point of time, and an output unit to output image data corresponding to the transformed electric signal.
Abstract:
A host apparatus includes a display unit configured to display a user interface (UI) window for an image scanning apparatus, a control unit configured to elevate and determine an optical scanning resolution of the image scanning apparatus according to Moire-related information when a scanning resolution is input and a Moire removing function is selected, in the UI window, and control the image scanning apparatus to perform a scanning operation according to the determined optical scanning resolution, a communication interface unit configured to receive a scanned image scanned with the optical scanning resolution in the image scanning apparatus, a filtering unit configured to remove a halftoning screen pattern from the received scanned image, and a sampling unit configured to down-sample the filtered scanned image with the input scanning resolution.
Abstract:
A semiconductor device for reducing junction leakage current and mitigating the narrow width effect, and a fabrication method thereof, are provided. The semiconductor device includes a semiconductor substrate in which an active region and an isolation region including a trench are formed, a spacer which is formed on both sidewalls of the trench, a channel stop impurity region which is self-aligned by the spacer and locally formed only at the lower portion of the isolation region, an isolation insulating layer in which the trench is buried, and a gate pattern which is formed on the isolation insulating layer and the active region. When the channel stop impurity region is formed only at the lower portion of the isolation region, isolation characteristics between unit cells can be improved, and also, a junction leakage current can be reduced. Further, the present invention can reduce a narrow width effect, in which a threshold voltage rapidly decreases as a channel width becomes narrower, owing to the formation of the channel stop impurity region on the edges of the active region.
Abstract:
An integrated circuit (IC) device may include a single substrate that includes a single chip, and a plurality of memory cells spaced apart from one another on the substrate and having different structures. Manufacturing the IC device may include forming a plurality of first word lines in a first region of the substrate, and forming a plurality of second word lines in or on a second region of the substrate. Capacitors may be formed on the first word lines. Source lines may be formed on the second word lines. An insulation layer that covers the plurality of capacitors and the plurality of source lines may be formed in the first region and the second region. A variable resistance structure may be formed at a location spaced apart from an upper surface of the substrate by a first vertical distance, in the second region.
Abstract:
A semiconductor device for reducing junction leakage current and mitigating the narrow width effect, and a fabrication method thereof, are provided. The semiconductor device includes a semiconductor substrate in which an active region and an isolation region including a trench are formed, a spacer which is formed on both sidewalls of the trench, a channel stop impurity region which is self-aligned by the spacer and locally formed only at the lower portion of the isolation region, an isolation insulating layer in which the trench is buried, and a gate pattern which is formed on the isolation insulating layer and the active region. When the channel stop impurity region is formed only at the lower portion of the isolation region, isolation characteristics between unit cells can be improved, and also, a junction leakage current can be reduced. Further, the present invention can reduce a narrow width effect, in which a threshold voltage rapidly decreases as a channel width becomes narrower, owing to the formation of the channel stop impurity region on the edges of the active region.