公开(公告)号：US06399415B1

公开(公告)日：2002-06-04

申请号：US09528658

申请日：2000-03-20

申请人： Jaime Bayan ,  Peter Howard Spalding ,  Harry Cheng Hong Kam ,  Ah Lek Hu ,  Sharon Mei Wan Ko ,  Santhiran Nadarajah ,  Aik Seng Kang ,  Yin Yen Bong

发明人： Jaime Bayan ,  Peter Howard Spalding ,  Harry Cheng Hong Kam ,  Ah Lek Hu ,  Sharon Mei Wan Ko ,  Santhiran Nadarajah ,  Aik Seng Kang ,  Yin Yen Bong

IPC分类号： H01L2144

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/8547 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A variety of techniques for electrically debussing conductive substrate panels used in the formation of a matrix of leadless integrated circuit packages are described. Generally, after a matrix of leadless packages have been fabricated in panel form on a conductive substrate panel, tie bars that are used to support contacts and potentially other structures on the conductive substrate are removed after plastic caps have been molded over the matrix, but before separating the packaged devices. This serves to electrically isolate the contacts from one another while leaving sufficient portions of the molded substrate structure in tact to facilitate handling the structure in panel form. With the described arrangement, the packaged devices may be tested in panel form. After testing and any other desired panel based operations, the packaged devices may be separated using conventional techniques. The removal of the tie bars can be accomplished by any suitable technique including, for example, sawing or etching.

摘要翻译： 描述了用于形成无引线集成电路封装的矩阵的导电基板面板的各种技术。 通常，在导电基板面板上以面板形式制造无引线封装的矩阵之后，在塑料盖已经在基体上模塑之后，但是在导电基板上模制了用于支撑触点和导电基板上潜在的其它结构的连接杆 分离包装的设备。 这用于将触头彼此电隔离，同时留下模制基板结构的足够部分以便于以面板形式处理结构。 利用所述的布置，封装的装置可以以面板形式进行测试。 在测试和任何其它期望的基于面板的操作之后，可以使用常规技术来分离封装的装置。 拉杆的移除可以通过任何合适的技术来实现，包括例如锯切或蚀刻。

公开(公告)号：US06452255B1

公开(公告)日：2002-09-17

申请号：US09528662

申请日：2000-03-20

申请人： Jaime Bayan ,  Peter Howard Spalding ,  Harry Cheng Hong Kam ,  Ah Lek Hu ,  Sharon Mei Wan Ko ,  Santhiran Nadarajah ,  Aik Seng Kang ,  Yin Yen Bong

发明人： Jaime Bayan ,  Peter Howard Spalding ,  Harry Cheng Hong Kam ,  Ah Lek Hu ,  Sharon Mei Wan Ko ,  Santhiran Nadarajah ,  Aik Seng Kang ,  Yin Yen Bong

IPC分类号： H01L23495

CPC分类号： H01L24/32 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2224/92247 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/4554

摘要： A variety of leadless packaging arrangements and methods of packaging integrated circuits in leadless packages that are arranged to have relatively low inductance are disclosed. In one aspect, a leadless semiconductor package is described having an exposed die pad and a plurality of exposed contacts that are formed from a common substrate material. The die attach pad, however, is thinned relative to at least a portion of the contacts. A die is mounted on the thinned die attach pad and wire bonded to the contacts. Since the die attach pad is lower than the contact surface being wire bonded to, the length of the bonding wires can be relatively reduced, thereby reducing inductance of the device. A plastic cap is molded over the die and the contacts thereby encapsulating the bonding wires while leaving the bottom surface of the contacts exposed. In some embodiments, the die is arranged to overhangs beyond the die attach pad towards the contacts. In other embodiments, a portion of at least some of the contacts are thinned to a thickness substantially similar to the die attach pad to form contact shelves. The die is then mounted such that it bridges the die attach pad to the contact shelves. In some of the embodiments, reverse wire bonding is used to further shorten the bonding wires. The described devices are packaged in bulk on a conductive substrate panel.

摘要翻译： 公开了各种无引线封装结构和封装集成电路的无引线封装的方法，其被布置为具有相对低的电感。 一方面，描述了一种无引线半导体封装，其具有暴露的管芯焊盘和由公共衬底材料形成的多个暴露的触点。 然而，芯片附接垫相对于至少一部分触点变薄。 模具安装在减薄的芯片附着焊盘上，并且焊接到触点上。 由于管芯安装焊盘低于被接合的接触面，所以可以相对地减小接合线的长度，从而降低设备的电感。 在模具上模制塑料盖，并且触头由此封装接合线，同时使触点的底表面露出。 在一些实施例中，管芯被设置成超过管芯附接垫朝向接触件突出。 在其他实施例中，至少一些触头的一部分被薄化到基本上类似于管芯附接垫的厚度以形成接触架。 然后将模具安装成使得其将管芯附接垫桥接到接触架上。 在一些实施例中，使用反向引线接合来进一步缩短接合线。 所描述的器件在体积封装在导电衬底面板上。

公开(公告)号：US06686652B1

公开(公告)日：2004-02-03

申请号：US09616228

申请日：2000-07-14

申请人： Jaime Bayan ,  Peter H. Spalding ,  Harry Cheng-Hong Kam ,  Ah Lek Hu ,  Sharon Mei Wan Ko ,  Santhiran Nadarajah ,  Aik Seng Kang ,  Yin Yen Bong

发明人： Jaime Bayan ,  Peter H. Spalding ,  Harry Cheng-Hong Kam ,  Ah Lek Hu ,  Sharon Mei Wan Ko ,  Santhiran Nadarajah ,  Aik Seng Kang ,  Yin Yen Bong

IPC分类号： H01L2302

CPC分类号： H01L23/49548 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49503 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An assembly and method suitable for use in packaging integrated circuits including a support substrate for supporting an integrated circuit die embedded in a molded encapsulating cap. The substrate includes a conductive die attach pad adapted to be molded into the encapsulating cap. The pad includes an interior facing support surface and a spaced-apart exterior facing exposed surface defined by a peripheral edge. The support surface is adapted to support the embedded die, while the exposed surface is to be exposed from the encapsulating cap. The attach pad further includes a locking ledge portion extending outward peripherally beyond at least a portion of the exposed surface peripheral edge. This ledge is adapted to be subtended in the encapsulating cap in a manner substantially preventing a pull-out of the attach pad in a direction away from the encapsulating cap.

摘要翻译： 一种适用于封装集成电路的组件和方法，该集成电路包括用于支撑嵌入在模制封装盖中的集成电路芯片的支撑衬底。 衬底包括适于模制到封装盖中的导电管芯附接垫。 垫包括面向内部的支撑表面和由外围边缘限定的间隔开的面向外部的表面。 支撑表面适于支撑嵌入的模具，同时露出的表面将从封装盖露出。 附接垫还包括锁定凸缘部分，该凸缘部分在周边外延伸超出暴露的表面周边边缘的至少一部分。 该凸缘适于以基本上防止附着垫在远离密封盖的方向拉出的方式对着封装盖中。

公开(公告)号：US07462942B2

公开(公告)日：2008-12-09

申请号：US10682054

申请日：2003-10-09

申请人： Kim Hwee Tan ,  Ch'ng Han Shen ,  Rosemarie Tagapulot ,  Yin Yen Bong ,  Ma L. Nang Htoi ,  Lim Tiong Soon ,  Shikui Lui ,  Balasubramanian Sivagnanam

发明人： Kim Hwee Tan ,  Ch'ng Han Shen ,  Rosemarie Tagapulot ,  Yin Yen Bong ,  Ma L. Nang Htoi ,  Lim Tiong Soon ,  Shikui Lui ,  Balasubramanian Sivagnanam

IPC分类号： H01L29/40 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05556 ,  H01L2224/05568 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13655 ,  H01L2224/13671 ,  H01L2224/14051 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00

摘要： A die, comprising a substrate and one or more pillar structures formed over the substrate in a pattern and the method of forming the die.

摘要翻译： 一种模具，其包括基板和以图案形成在所述基板上的一个或多个支柱结构以及形成所述模具的方法。

公开(公告)号：US20060060937A1

公开(公告)日：2006-03-23

申请号：US10947910

申请日：2004-09-23

申请人： Eng Han Matthew Lim ,  Chuan Wei Ivan Wong ,  Kee Kwang Lau ,  Kim Hwee Tan ,  Yin Yen Bong

发明人： Eng Han Matthew Lim ,  Chuan Wei Ivan Wong ,  Kee Kwang Lau ,  Kim Hwee Tan ,  Yin Yen Bong

IPC分类号： H01L29/00

CPC分类号： H01C1/034 ,  H01C7/00 ,  H01F17/0006 ,  H01F27/34 ,  H01G2/065 ,  H01G2/10

摘要： As the functionality, speed and portability of consumer electronics increases, so does the need for more circuitry to be packed into smaller spaces. All this leads to the fact that the size of a device is now becoming more often a function of the circuit board or module size than anything else. In order to achieve size reduction of multi-featured products, passive components on the surface of the circuit need to be eliminated by burying them within the inner layers of the printed wiring board. Embedded passives are passive components placed between the interconnecting substrates of a printed wiring board. Implementation of embedded passives reduces space requirements and enables more silicon devices to be placed on the same sized substrate, thereby allowing functional potential of small electronic devices to increase. However, additional steps are conventionally required for embedding passive components within the interconnect layer between substrates. An embodiment of the invention discloses an embedded passive component comprising electrically conductive pillars formed on a substrate. One portion of the pillars functions as a passive structure and another portion of the pillars functions as inter-displacement means. As only pillars are used, steps for forming the embedded passive component are simplified and quantitatively reduced.

摘要翻译： 随着消费电子产品的功能，速度和便携性的增加，更多电路的需求也将增加到更小的空间。 所有这一切导致一个事实，即现在，设备的尺寸通常是电路板或模块尺寸的函数。 为了实现多功能产品的尺寸减小，需要通过将电路掩埋在印刷电路板的内层内来消除电路表面上的无源部件。 嵌入式无源器件是放置在印刷电路板的互连衬底之间的无源部件。 嵌入式无源器件的实现减少了空间需求，并使更多的硅器件放置在相同尺寸的衬底上，从而允许小型电子器件的功能增加。 然而，传统上需要在衬底之间的互连层内嵌入无源部件的附加步骤。 本发明的实施例公开了一种嵌入式无源部件，其包括形成在基板上的导电柱。 柱的一部分用作被动结构，并且柱的另一部分用作位移间装置。 由于仅使用支柱，因此简化并定量降低了形成嵌入式无源元件的步骤。