Abstract:
A system and method for programming and erasing a semiconductor memory is disclosed. More particularly, the present invention uses the bit lines of a volatile memory portion of semiconductor memory so as to program and erase the non-volatile portion of the semiconductor memory.
Abstract:
A system and method for resetting semiconductor memory is disclosed. The present invention uses an array reset circuit to independently drive the bit lines of a volatile memory cell high or low so as to reset either a single memory cell or all memory cells in an array with all 0's or all 1's.
Abstract:
A system and method for disturbing an erased memory location structure in a non-volatile portion of a semiconductor memory is disclosed. The present invention applies a voltage to a first memory location of a non-volatile portion of the semiconductor memory that is in a programmed state and a second memory location of a non-volatile portion of the semiconductor memory that is in an erased state so as to keep the first memory location programmed and to transition the second memory location from a programmed state to an erased state.
Abstract:
A system and method for programming both sides of the non-volatile portion in a semiconductor memory is disclosed. The present invention erases and then programs the memory stacks in the non-volatile portion of an nvSRAM.
Abstract:
A system and method for programming both sides of the non-volatile portion in a semiconductor memory is disclosed. The present invention erases and then programs the memory stacks in the non-volatile portion of an nvSRAM.
Abstract:
A system and method for programming and erasing a semiconductor memory is disclosed. More particularly, the present invention uses the bit lines of a volatile memory portion of semiconductor memory so as to program and erase the non-volatile portion of the semiconductor memory.
Abstract:
A system and method for resetting semiconductor memory is disclosed. The present invention uses an array reset circuit to independently drive the bit lines of a volatile memory cell high or low so as to reset either a single memory cell or all memory cells in an array with all 0's or all 1's.
Abstract:
A system and method for disturbing an erased memory location structure in a non-volatile portion of a semiconductor memory is disclosed. The present invention applies a voltage to a first memory location of a non-volatile portion of the semiconductor memory that is in a programmed state and a second memory location of a non-volatile portion of the semiconductor memory that is in an erased state so as to keep the first memory location programmed and to transition the second memory location from a programmed state to an erased state.
Abstract:
In a DRAM, current surges during sense and restore operations are compensated. Peak current through sense amplifiers is stabilized through initiation of the sense and restore operations during the chip active period and completion of the sense and restore operation during the chip precharge period. The delay between first and second sensing signals is controlled to be longer for those temperature and power supply conditions under which the chip is operating fastest. Correspondingly, the delay between first and second sensing signals is made shorter for those temperature and power supply conditions under which the chip is operating slowest. Overall peak current is limited to that drawn through small transistors used to begin turning on the sense amplifier. The duration of the second sensing signal is responsive to the temperature and power supply variation so it endures for an acceptable period in which to complete the sense and restore function. The second sensing signal timing is not determined by the first sensing signal.
Abstract:
An asynchronous memory device includes parallel test circuitry configured to provide a measure of a slowest bit access time for the device. The parallel test circuitry may include first circuitry configured to receive logic signals from a plurality of cells of the device and to provide first output signals indicative of logic states of the plurality of cells. The parallel test circuitry may also include second circuitry configured to receive the first output signals and to produce second output signals indicative of logic states of the first output signals therefrom. The parallel test circuitry may be the same circuitry used in the read path of the memory device, and may be configured such that the second output signals are produced at the slowest bit access time. The plurality of cells tested may include a redundant cell of the device. Such redundancy is transparent to the test circuitry. In a further embodiment, a plurality of cells of an asynchronous memory device may be read in parallel and an output signal indicative of a logical combination of logic states of the plurality of cells and a test signal at the speed of the slowest cell access time produced thereby.