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公开(公告)号：US06398043B1
公开(公告)日：2002-06-04
申请号：US09873834
申请日：2001-06-04
IPC分类号： A47G1908
CPC分类号： H05K13/0069 , Y10S269/90 , Y10S269/903 , Y10T29/49128
摘要： A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.
摘要翻译： 一种电路板载体及其使用方法。 载体允许在基于引线框架的半导体处理设备上处理电路板。 电路板载体包含用于将电路板固定到其上的结构，并且载体的尺寸和形状设置有标准化的分度孔，以允许对配置为基于引线框架的处理的处理设备上的电路板进行处理。
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公开(公告)号：US5988619A
公开(公告)日：1999-11-23
申请号：US54018
申请日：1998-04-02
CPC分类号： H05K13/0069 , Y10S269/90 , Y10S269/903 , Y10T29/49128
摘要： This invention relates to a circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.
摘要翻译： 本发明涉及一种电路板载体及其使用方法。 载体允许在基于引线框架的半导体处理设备上处理电路板。 电路板载体包含用于将电路板固定到其上的结构，并且载体的尺寸和形状设置有标准化的分度孔，以允许对配置为基于引线框架的处理的处理设备上的电路板进行处理。
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公开(公告)号：US5911329A
公开(公告)日：1999-06-15
申请号：US640147
申请日：1996-04-30
CPC分类号： H05K13/0069 , Y10S269/90 , Y10S269/903 , Y10T29/49128
摘要： A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.
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公开(公告)号：US06655535B2
公开(公告)日：2003-12-02
申请号：US10132480
申请日：2002-04-25
IPC分类号： A47G1908
CPC分类号： H05K13/0069 , Y10S269/90 , Y10S269/903 , Y10T29/49128
摘要： A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped and provided with standardized indexing holes to allow processing of circuit boards on processing equipment configured for lead frame-based processing.
摘要翻译： 一种电路板载体及其使用方法。 载体允许在基于引线框架的半导体处理设备上处理电路板。 电路板载体包含用于将电路板固定到其上的结构，并且载体的尺寸和形状设置有标准化的分度孔，以允许对配置为基于引线框架的处理的处理设备上的电路板进行处理。
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公开(公告)号：US06279758B1
公开(公告)日：2001-08-28
申请号：US09651489
申请日：2000-08-30
IPC分类号： A47G1908
CPC分类号： H05K13/0069 , Y10S269/90 , Y10S269/903 , Y10T29/49128
摘要： A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped and provided with standardized indexing holes to allow processing of circuit boards on processing equipment configured for lead frame-based processing.
摘要翻译： 一种电路板载体及其使用方法。 载体允许在基于引线框架的半导体处理设备上处理电路板。 电路板载体包含用于将电路板固定到其上的结构，并且载体的尺寸和形状设置有标准化的分度孔，以允许对配置为基于引线框架的处理的处理设备上的电路板进行处理。
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公开(公告)号：US6158595A
公开(公告)日：2000-12-12
申请号：US421164
申请日：1999-10-19
CPC分类号： H05K13/0069 , Y10S269/90 , Y10S269/903 , Y10T29/49128
摘要： A circuit board carrier and method of using the same. The circuit board carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the circuit board carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.
摘要翻译： 一种电路板载体及其使用方法。 电路板载体允许在基于引线框架的半导体处理设备上处理电路板。 电路板载体包含用于将电路板固定到其上的结构，并且电路板载体的尺寸和形状设置有标准化的分度孔，以允许对配置为基于引线框架的处理的处理设备上的电路板进行处理。
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公开(公告)号：US5992649A
公开(公告)日：1999-11-30
申请号：US225277
申请日：1999-01-05
CPC分类号： H05K13/0069 , Y10S269/90 , Y10S269/903 , Y10T29/49128
摘要： A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.
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公开(公告)号：US06966480B2
公开(公告)日：2005-11-22
申请号：US10624796
申请日：2003-07-22
IPC分类号： B23K20/00 , H01L21/603 , H01L21/607 , B23K37/00 , B23K31/00
CPC分类号： H01L24/85 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48824 , H01L2224/7825 , H01L2224/78301 , H01L2224/78302 , H01L2224/78306 , H01L2224/78307 , H01L2224/85043 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , Y10S228/904 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
摘要翻译： 一种用于将导线接合到半导体器件的接合焊盘和引线框架的引线上的改进的引线接合毛细管，所述引线框架的引线键合毛细管具有工作尖端，所述工作尖端具有工作表面，所述工作尖端包括环绕引线进给孔的平坦环形部分 毛细管和从其延伸到与从工作尖端的外部尖端直径延伸的半径的交点处的凹面。
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公开(公告)号：US06311890B1
公开(公告)日：2001-11-06
申请号：US09649209
申请日：2000-08-28
IPC分类号： B23K3700
CPC分类号： H01L24/85 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48824 , H01L2224/7825 , H01L2224/78301 , H01L2224/78302 , H01L2224/78306 , H01L2224/78307 , H01L2224/85043 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , Y10S228/904 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
摘要翻译： 一种用于将导线接合到半导体器件的接合焊盘和引线框架的引线上的改进的引线接合毛细管，所述引线框架的引线键合毛细管具有工作尖端，所述工作尖端具有工作表面，所述工作尖端包括环绕引线进给孔的平坦环形部分 毛细管和从其延伸到与从工作尖端的外部尖端直径延伸的半径的交点处的凹面。
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公开(公告)号：US06439450B1
公开(公告)日：2002-08-27
申请号：US09940203
申请日：2001-08-27
IPC分类号： B23K3700
CPC分类号： H01L24/85 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48824 , H01L2224/7825 , H01L2224/78301 , H01L2224/78302 , H01L2224/78306 , H01L2224/78307 , H01L2224/85043 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , Y10S228/904 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
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