公开(公告)号：US20100181868A1

公开(公告)日：2010-07-22

申请号：US12639260

申请日：2009-12-16

申请人： Alexei Gaidarzhy ,  Jan H. Kuypers ,  David M. Chen ,  Guiti Zolfagharkhani ,  Pritiraj Mohanty ,  Reimund Rebel ,  Klaus Juergen Schoepf

发明人： Alexei Gaidarzhy ,  Jan H. Kuypers ,  David M. Chen ,  Guiti Zolfagharkhani ,  Pritiraj Mohanty ,  Reimund Rebel ,  Klaus Juergen Schoepf

IPC分类号： H01L41/047

CPC分类号： H03H9/0095 ,  H03H9/02102 ,  H03H9/02228

摘要： Multi-port devices having multiple electrical ports are described, as are related methods. Some of the multi-port devices may have two input ports and two output ports, and may be driven differentially, in a single-ended mode, in a single-ended to differential mode, or in a differential to single-ended mode. The multi-port devices may include one or more transducers coupled to the electrical ports.

摘要翻译： 具有多个电端口的多端口设备也被描述为相关方法。 一些多端口设备可以具有两个输入端口和两个输出端口，并且可以以单端模式，单端到差分模式或差分到单端模式在差分地驱动。 多端口设备可以包括耦合到电端口的一个或多个换能器。

公开(公告)号：US08686614B2

公开(公告)日：2014-04-01

申请号：US12639260

申请日：2009-12-16

申请人： Jan H. Kuypers ,  Reimund Rebel ,  Alexei Gaidarzhy ,  David M. Chen ,  Guiti Zolfagharkhani ,  Klaus Juergen Schoepf

发明人： Jan H. Kuypers ,  Reimund Rebel ,  Alexei Gaidarzhy ,  David M. Chen ,  Guiti Zolfagharkhani ,  Klaus Juergen Schoepf

IPC分类号： H01L41/08

CPC分类号： H03H9/0095 ,  H03H9/02102 ,  H03H9/02228

摘要： Multi-port devices having multiple electrical ports are described, as are related methods. Some of the multi-port devices may have two input ports and two output ports, and may be driven differentially, in a single-ended mode, in a single-ended to differential mode, or in a differential to single-ended mode. The multi-port devices may include one or more transducers coupled to the electrical ports.

摘要翻译： 具有多个电端口的多端口设备也被描述为相关方法。 一些多端口设备可以具有两个输入端口和两个输出端口，并且可以以单端模式，单端到差分模式或差分到单端模式在差分地驱动。 多端口设备可以包括耦合到电端口的一个或多个换能器。

公开(公告)号：US08698376B2

公开(公告)日：2014-04-15

申请号：US13681904

申请日：2012-11-20

申请人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

发明人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

IPC分类号： H01L41/04

CPC分类号： H01L41/053 ,  B81B3/0018 ,  H01L2224/11 ,  H01L2224/48091 ,  H02N1/006 ,  H03H3/007 ,  H03H9/02007 ,  H03H9/02244 ,  H03H9/02535 ,  H03H2009/241

摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

摘要翻译： 描述了具有与基板一体化的压电材料结构的装置。 还描述了用于形成这种装置的制造技术。 该制造可以包括将压电材料晶片结合到不同材料的衬底。 然后可以由压电材料晶片形成诸如谐振器的结构。

公开(公告)号：US20130140958A1

公开(公告)日：2013-06-06

申请号：US13681873

申请日：2012-11-20

申请人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

发明人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

IPC分类号： H01L41/053

CPC分类号： H01L41/053 ,  B81B3/0018 ,  H01L2224/11 ,  H01L2224/48091 ,  H02N1/006 ,  H03H3/007 ,  H03H9/02007 ,  H03H9/02244 ,  H03H9/02535 ,  H03H2009/241

摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

摘要翻译： 描述了具有与基板一体化的压电材料结构的装置。 还描述了用于形成这种装置的制造技术。 该制造可以包括将压电材料晶片结合到不同材料的衬底。 然后可以由压电材料晶片形成诸如谐振器的结构。

公开(公告)号：US20130140651A1

公开(公告)日：2013-06-06

申请号：US13681893

申请日：2012-11-20

申请人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

发明人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

IPC分类号： B81B3/00

CPC分类号： H01L41/053 ,  B81B3/0018 ,  H01L2224/11 ,  H01L2224/48091 ,  H02N1/006 ,  H03H3/007 ,  H03H9/02007 ,  H03H9/02244 ,  H03H9/02535 ,  H03H2009/241

摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

公开(公告)号：US08587183B2

公开(公告)日：2013-11-19

申请号：US13681873

申请日：2012-11-20

申请人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

发明人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

IPC分类号： H03H9/25 ,  H01L41/053

CPC分类号： H01L41/053 ,  B81B3/0018 ,  H01L2224/11 ,  H01L2224/48091 ,  H02N1/006 ,  H03H3/007 ,  H03H9/02007 ,  H03H9/02244 ,  H03H9/02535 ,  H03H2009/241

摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

公开(公告)号：US20130140944A1

公开(公告)日：2013-06-06

申请号：US13681904

申请日：2012-11-20

申请人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

发明人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

IPC分类号： H02N1/00

CPC分类号： H01L41/053 ,  B81B3/0018 ,  H01L2224/11 ,  H01L2224/48091 ,  H02N1/006 ,  H03H3/007 ,  H03H9/02007 ,  H03H9/02244 ,  H03H9/02535 ,  H03H2009/241

摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

公开(公告)号：US20100314969A1

公开(公告)日：2010-12-16

申请号：US12732575

申请日：2010-03-26

申请人： Alexei Gaidarzhy ,  Jan H. Kuypers ,  David M. Chen ,  Guiti Zolfagharkhani ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Behraad Bahreyni

发明人： Alexei Gaidarzhy ,  Jan H. Kuypers ,  David M. Chen ,  Guiti Zolfagharkhani ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Behraad Bahreyni

IPC分类号： H01L41/04

CPC分类号： H03H9/02338 ,  H03H9/02433 ,  H03H2009/0244

摘要： Apparatus and methods of connecting mechanical resonating structures to a body are described. Multi-element anchors may include a flexible portion that flexes when the mechanical resonating structure vibrates. The flexible portion may have a length related to the resonance frequency of the mechanical resonating structures. Some of the multi-element anchors include elements that are oriented perpendicularly to each other. MEMS incorporating such structures are also described.

摘要翻译： 描述了将机械谐振结构连接到主体的装置和方法。 多元件锚可以包括当机械共振结构振动时弯曲的柔性部分。 柔性部分可以具有与机械谐振结构的谐振频率相关的长度。 一些多元件锚定件包括彼此垂直取向的元件。 还描述了结合这种结构的MEMS。

公开(公告)号：US20120280594A1

公开(公告)日：2012-11-08

申请号：US13466767

申请日：2012-05-08

申请人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

发明人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

IPC分类号： H01L41/053

CPC分类号： H01L41/053 ,  B81B3/0018 ,  H01L2224/11 ,  H01L2224/48091 ,  H02N1/006 ,  H03H3/007 ,  H03H9/02007 ,  H03H9/02244 ,  H03H9/02535 ,  H03H2009/241

摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

摘要翻译： 描述了具有与基板一体化的压电材料结构的装置。 还描述了用于形成这种装置的制造技术。 该制造可以包括将压电材料晶片结合到不同材料的衬底。 然后可以由压电材料晶片形成诸如谐振器的结构。

公开(公告)号：US09030080B2

公开(公告)日：2015-05-12

申请号：US13681893

申请日：2012-11-20

申请人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

发明人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

IPC分类号： H01L41/053 ,  H03H3/007 ,  H03H9/02 ,  B81B3/00 ,  H02N1/00 ,  H03H9/24

CPC分类号： H01L41/053 ,  B81B3/0018 ,  H01L2224/11 ,  H01L2224/48091 ,  H02N1/006 ,  H03H3/007 ,  H03H9/02007 ,  H03H9/02244 ,  H03H9/02535 ,  H03H2009/241

摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

摘要翻译： 描述了具有与基板一体化的压电材料结构的装置。 还描述了用于形成这种装置的制造技术。 该制造可以包括将压电材料晶片结合到不同材料的衬底。 然后可以由压电材料晶片形成诸如谐振器的结构。