摘要:
Multi-port devices having multiple electrical ports are described, as are related methods. Some of the multi-port devices may have two input ports and two output ports, and may be driven differentially, in a single-ended mode, in a single-ended to differential mode, or in a differential to single-ended mode. The multi-port devices may include one or more transducers coupled to the electrical ports.
摘要:
Multi-port devices having multiple electrical ports are described, as are related methods. Some of the multi-port devices may have two input ports and two output ports, and may be driven differentially, in a single-ended mode, in a single-ended to differential mode, or in a differential to single-ended mode. The multi-port devices may include one or more transducers coupled to the electrical ports.
摘要:
Apparatus and methods of connecting mechanical resonating structures to a body are described. Multi-element anchors may include a flexible portion that flexes when the mechanical resonating structure vibrates. The flexible portion may have a length related to the resonance frequency of the mechanical resonating structures. Some of the multi-element anchors include elements that are oriented perpendicularly to each other. MEMS incorporating such structures are also described.
摘要:
Timing oscillators as well as related methods and devices are described. A timing oscillator may include a mechanical resonating structure with major elements and minor elements coupled to the major element. The timing oscillator can generate stable signals with low phase noise at very high frequencies which allows a timing oscillator to be used effectively in a number of devices including computers and mobile phones for time and data synchronization purposes. The signal generated by the timing oscillator can be tuned using a driver circuit and a compensation circuit.
摘要:
Apparatus and methods of connecting mechanical resonating structures to a body are described. Multi-element anchors may include a flexible portion that flexes when the mechanical resonating structure vibrates. The flexible portion may have a length related to the resonance frequency of the mechanical resonating structures. Some of the multi-element anchors include elements that are oriented perpendicularly to each other. MEMS incorporating such structures are also described.
摘要:
Timing oscillators as well as related methods and devices are described. A timing oscillator may include a mechanical resonating structure with major elements and minor elements coupled to the major element. The timing oscillator can generate stable signals with low phase noise at very high frequencies which allows a timing oscillator to be used effectively in a number of devices including computers and mobile phones for time and data synchronization purposes. The signal generated by the timing oscillator can be tuned using a driver circuit and a compensation circuit.
摘要:
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
摘要:
Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations. The compensating structure may have multiple layers, one of which may have a stiffness that increases with increasing temperature and one of which may have a stiffness that decreases with increases in temperature.
摘要:
Mechanical resonating structures and related methods are described. The mechanical resonating structures may provide improved efficiency over conventional resonating structures. Some of the structures have lengths and widths and are designed to vibrate in a direction approximately parallel to either the length or width. They may have boundaries bounding the length and width dimensions, which may substantially align with nodes or anti-nodes of vibration.
摘要:
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.