Read sensor with confined sense current
    2.
    发明申请
    Read sensor with confined sense current 有权
    用传感电流读取传感器

    公开(公告)号:US20050122633A1

    公开(公告)日:2005-06-09

    申请号:US10728406

    申请日:2003-12-05

    IPC分类号: G11B5/127 G11B5/33 G11B5/39

    摘要: A magnetoresistive (MR) sensor having a decreased electrical profile due to a confining of the device sense current within a conductive nanoconstriction. The MR sensor includes a giant magnetoresistive (GMR) stack and a layer of high resistivity material within the GMR stack. The layer of high resistivity material includes a nanoconstriction precursor. When a punch current is applied at the nanoconstriction precursor, a conductive nanoconstriction is formed through the layer of high resistivity material at the nanoconstriction precursor.

    摘要翻译: 由于在传导性纳米收集过程中限制了器件感应电流,所以具有降低的电气剖面的磁阻(MR)传感器。 MR传感器包括巨磁阻(GMR)堆叠和GMR堆叠内的高电阻率材料层。 高电阻率材料层包括纳米收集前体。 当在纳米收集前体施加冲击电流时,在纳米收集前体处通过高电阻率材料层形成导电纳米收缩。

    Magnetic Device Definition with Uniform Biasing Control
    4.
    发明申请
    Magnetic Device Definition with Uniform Biasing Control 有权
    具有均匀偏置控制的磁性装置定义

    公开(公告)号:US20110006033A1

    公开(公告)日:2011-01-13

    申请号:US12502180

    申请日:2009-07-13

    IPC分类号: B44C1/22

    摘要: A method of fabricating a magnetic device is described. A mask removing layer is formed on a layered sensing stack and a hard mask layer is formed on the mask removing layer. A first reactive ion etch is performed with a non-oxygen-based chemistry to define the hard mask layer using an imaged layer formed on the hard mask layer as a mask. A second reactive ion etch is performed with an oxygen-based chemistry to define the mask removing stop layer using the defined hard mask layer as a mask. A third reactive ion etch is performed to define the layered sensing stack using the hard mask layer as a mask. The third reactive ion etch includes an etching chemistry that performs at a lower etching rate on the hard mask layer than on the layered sensing stack.

    摘要翻译: 描述制造磁性装置的方法。 在层叠感测堆叠上形成掩模移除层,并且在掩模移除层上形成硬掩模层。 使用非氧基化学法进行第一反应离子蚀刻,以使用形成在硬掩模层上的成像层作为掩模来限定硬掩模层。 使用氧基化学法进行第二反应离子蚀刻,以使用限定的硬掩模层作为掩模来限定掩模去除停止层。 执行第三反应离子蚀刻以使用硬掩模层作为掩模来定义分层感测堆叠。 第三反应离子蚀刻包括蚀刻化学品,其在硬掩模层上的蚀刻速率低于分层感测叠层。