公开(公告)号：US08900886B2

公开(公告)日：2014-12-02

申请号：US13486270

申请日：2012-06-01

申请人： Kun-Ei Chen ,  Jen-Yi Chen ,  Yi-Chung Lin ,  Chen-Chieh Chiang ,  Ling-Sung Wang

发明人： Kun-Ei Chen ,  Jen-Yi Chen ,  Yi-Chung Lin ,  Chen-Chieh Chiang ,  Ling-Sung Wang

IPC分类号： H01L21/66

CPC分类号： C23C16/52 ,  C23C16/14 ,  C23C16/45527 ,  H01J37/32981

摘要： A method of semiconductor processing comprises providing a semiconductor wafer in a processing chamber; feeding at least one tungsten-containing precursor in a gas state into the processing chamber for atomic layer deposition (ALD) of tungsten; feeding at least one reducing chemical in a gas state into the processing chamber; and monitoring a concentration of at least one gaseous byproduct in the chamber; and providing a signal indicating concentration of the at least one gaseous byproduct in the chamber. The byproduct is produced by a reaction between the at least one tungsten-containing precursor and the at least one reducing chemical during the ALD.

摘要翻译： 一种半导体处理方法包括在处理室中设置半导体晶片; 将至少一种以气体状态的含钨前体进料到用于钨的原子层沉积（ALD）的处理室中; 将至少一种气体状态的还原化学品进料到所述处理室中; 以及监测所述室中的至少一种气态副产物的浓度; 以及提供指示所述室中所述至少一种气态副产物的浓度的信号。 在ALD期间，副产物通过至少一种含钨前体与至少一种还原化学物质之间的反应产生。

公开(公告)号：US08586486B2

公开(公告)日：2013-11-19

申请号：US13327947

申请日：2011-12-16

申请人： Jen-Yi Chen ,  Kun-Ei Chen ,  Ling-Sung Wang ,  Chen-Chieh Chiang

发明人： Jen-Yi Chen ,  Kun-Ei Chen ,  Ling-Sung Wang ,  Chen-Chieh Chiang

IPC分类号： H01L21/31

CPC分类号： H01L21/76802 ,  H01L21/0271 ,  H01L21/3105 ,  H01L21/31144 ,  H01L21/76826

摘要： A method of patterning a material layer of a semiconductor device is disclosed, the method including treating a material layer above a semiconductor substrate with plasma oxygen; depositing a layer of photoresist over a first surface of the material layer after the treating of the material layer; patterning the layer of photoresist, thereby forming a patterned photoresist, exposing portions of the material layer; etching the exposed portions of at least the material layer to form at least one contact via in the material layer extending to a source or drain region of a device at a surface of the substrate; and removing the patterned photoresist from the first surface of the material layer.

摘要翻译： 公开了一种图案化半导体器件的材料层的方法，该方法包括用等离子体氧处理半导体衬底之上的材料层; 在处理材料层之后，在材料层的第一表面上沉积光致抗蚀剂层; 图案化光致抗蚀剂层，从而形成图案化的光致抗蚀剂，暴露材料层的部分; 蚀刻至少材料层的暴露部分以在材料层中形成至少一个接触通孔，延伸到衬底的表面处的器件的源极或漏极区域; 以及从所述材料层的第一表面去除所述图案化的光致抗蚀剂。

公开(公告)号：US20070154040A1

公开(公告)日：2007-07-05

申请号：US11541632

申请日：2006-10-03

申请人： Jen-Yi Chen

发明人： Jen-Yi Chen

IPC分类号： H04R25/00

CPC分类号： H04R19/04 ,  Y10T29/435 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908

摘要： A capacitive microphone and method for making the same are provided. A backplate with a plurality of holes is formed on a substrate with at least one cavity, and a diaphragm is formed above the backplate. There is an air gap between the backplate and the diaphragm. The air gap and the cavity communicate with each other by each hole. The diaphragm and the backplate are separated by a first distance and a second distance which is smaller than the first distance, such that the difference is formed on the diaphragm. The second distance area is fastened through surface stiction produced by mist or other fluids.

摘要翻译： 提供一种电容麦克风及其制造方法。 在具有至少一个空腔的基板上形成具有多个孔的背板，并且在背板上形成隔膜。 背板和隔膜之间有气隙。 气隙和空腔通过每个孔相互连通。 隔膜和背板分隔第一距离和小于第一距离的第二距离，使得差异形成在隔膜上。 第二距离区域通过由雾或其他流体产生的表面粘性固定。

公开(公告)号：US07912235B2

公开(公告)日：2011-03-22

申请号：US11541632

申请日：2006-10-03

申请人： Jen-Yi Chen

发明人： Jen-Yi Chen

IPC分类号： H04R25/00

CPC分类号： H04R19/04 ,  Y10T29/435 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908

摘要： A capacitive microphone and method for making the same are provided. A backplate with a plurality of holes is formed on a substrate with at least one cavity, and a diaphragm is formed above the backplate. There is an air gap between the backplate and the diaphragm. The air gap and the cavity communicate with each other by each hole. The diaphragm and the backplate are separated by a first distance and a second distance which is smaller than the first distance, such that the difference is formed on the diaphragm. The second distance area is fastened through surface stiction produced by mist or other fluids.

摘要翻译： 提供一种电容麦克风及其制造方法。 在具有至少一个空腔的基板上形成具有多个孔的背板，并且在背板上形成隔膜。 背板和隔膜之间有气隙。 气隙和空腔通过每个孔相互连通。 隔膜和背板分隔第一距离和小于第一距离的第二距离，使得差异形成在隔膜上。 第二距离区域通过由雾或其他流体产生的表面粘性固定。

公开(公告)号：US20060001114A1

公开(公告)日：2006-01-05

申请号：US10927066

申请日：2004-08-27

申请人： Jen-Yi Chen ,  Jing-Hung Chiou ,  Kai-Hsiang Yen

发明人： Jen-Yi Chen ,  Jing-Hung Chiou ,  Kai-Hsiang Yen

IPC分类号： H01L29/82

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C1/00896 ,  B81C2201/053 ,  H01L21/50 ,  H01L23/04 ,  H01L23/055 ,  H01L23/24 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/16235 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An apparatus of wafer level package for the micro elements and methods of fabricating the same is disclosed. The apparatus is utilized to provide a lid substrate for bonding the lid substrate to a substrate having several micro elements and therefore form a cavity capable of being operated for the micro elements. The openings of the cavity are used to make the micro elements capable of being contacted with the atmosphere and therefore form an apparatus of wafer level package for the micro elements.

摘要翻译： 公开了一种用于微元件的晶片级封装的装置及其制造方法。 该装置用于提供用于将盖基板接合到具有几个微元件的基板的盖基板，因此形成能够对微元件进行操作的空腔。 空腔的开口用于使微元件能够与大气接触，并且因此形成用于微元件的晶片级封装的装置。

公开(公告)号：US20170064458A1

公开(公告)日：2017-03-02

申请号：US14840365

申请日：2015-08-31

申请人： Jen-Yi Chen ,  Chao-Sen Chang ,  Chun-Chieh Wang ,  Yong-Shiang Chang

发明人： Jen-Yi Chen ,  Chao-Sen Chang ,  Chun-Chieh Wang ,  Yong-Shiang Chang

IPC分类号： H04R19/04 ,  H04R19/00

CPC分类号： H04R19/04 ,  B81B3/0021 ,  B81B7/0064 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00333 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/086 ,  H04R19/005 ,  H04R23/00 ,  H04R31/00 ,  H04R2201/003 ,  H01L2924/00014

摘要： A MEMS microphone package structure having a non-planar substrate is provided. It includes a non-planar substrate, a lid and a transducer. The non-planar substrate includes a bearing base and a peripheral wall connecting to the bearing base. The lid is covered and connected to the non-planar substrate to form a cavity, and at least one solder pad is disposed on an outer surface of the lid or the non-planar substrate. The transducer is disposed in the cavity. A sound hole is provided to correspond to the transducer, and the sound hole is disposed at the non-planar substrate or the lid.

摘要翻译： 提供具有非平面基板的MEMS麦克风封装结构。 它包括非平面基板，盖子和换能器。 非平面基板包括轴承座和连接到轴承座的周壁。 盖被覆盖并连接到非平面基板以形成空腔，并且至少一个焊盘设置在盖或非平面基板的外表面上。 传感器设置在空腔中。 提供了与换能器对应的声孔，并且声孔设置在非平面基板或盖上。

公开(公告)号：US08039910B2

公开(公告)日：2011-10-18

申请号：US11964995

申请日：2007-12-27

申请人： Kai-Hsiang Yen ,  Jen-Yi Chen ,  Po-Hsun Sung

发明人： Kai-Hsiang Yen ,  Jen-Yi Chen ,  Po-Hsun Sung

IPC分类号： H01L29/84

CPC分类号： B81C1/0023 ,  B81B2201/0257 ,  B81B2207/012 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R19/005 ,  H04R31/00 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electro-acoustic sensing device including a sensing chip, a carrier chip and a sealing element is provided. The sensing chip is for electro-acoustic transuding and thereby outputting an electrical signal. The carrier chip disposed below the sensing chip has at least one second connecting point, at least one electrical channel and at least one channel connecting point. The second connecting point is electrically contacted with the first connecting point. The second connecting point and the channel connecting point are located at different surfaces of the carrier chip. The electrical channel passes through the carrier chip and electrically connects the second connecting point and the channel connecting point. The electrical signal is transmitted to the channel connecting point via the first and the second connecting points and the electrical channel. The sealing element is disposed between the sensing chip and the carrier chip for air-tight coupling the two chips.

摘要翻译： 提供了包括感测芯片，载体芯片和密封元件的电声感测装置。 感测芯片用于电声输出，从而输出电信号。 布置在感测芯片下方的载体芯片具有至少一个第二连接点，至少一个电通道和至少一个通道连接点。 第二连接点与第一连接点电接触。 第二连接点和通道连接点位于载体芯片的不同表面。 电气通道穿过载体芯片并电连接第二连接点和通道连接点。 电信号通过第一和第二连接点和电通道传输到通道连接点。 密封元件设置在感测芯片和载体芯片之间，用于气密地耦合两个芯片。

公开(公告)号：US20110131794A1

公开(公告)日：2011-06-09

申请号：US13027457

申请日：2011-02-15

申请人： Jen-Yi Chen

发明人： Jen-Yi Chen

IPC分类号： H04R31/00

CPC分类号： H04R19/04 ,  Y10T29/435 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908

摘要： A capacitive microphone and method for making the same are provided. A backplate with a plurality of holes is formed on a substrate with at least one cavity, and a diaphragm is formed above the backplate. There is an air gap between the backplate and the diaphragm. The air gap and the cavity communicate with each other by each hole. The diaphragm and the backplate are separated by a first distance and a second distance which is smaller than the first distance, such that the difference is formed on the diaphragm. The second distance area is fastened through surface stiction produced by mist or other fluids.

摘要翻译： 提供一种电容麦克风及其制造方法。 在具有至少一个空腔的基板上形成具有多个孔的背板，并且在背板上形成隔膜。 背板和隔膜之间有气隙。 气隙和空腔通过每个孔相互连通。 隔膜和背板分隔第一距离和小于第一距离的第二距离，使得差异形成在隔膜上。 第二距离区域通过由雾或其他流体产生的表面粘性固定。

公开(公告)号：US20060146215A1

公开(公告)日：2006-07-06

申请号：US10906710

申请日：2005-03-03

申请人： Wei-Kai Huang ,  Jen-Yi Chen ,  Chen-Shun Tsai ,  Chiung-Pin Wang

发明人： Wei-Kai Huang ,  Jen-Yi Chen ,  Chen-Shun Tsai ,  Chiung-Pin Wang

IPC分类号： G02F1/136

CPC分类号： G02F1/136259 ,  G02F1/1343 ,  G02F1/136213

摘要： A thin film transistor array substrate and a repairing method thereof are provided. The thin film transistor array substrate comprises a substrate, plural scan lines, plural data lines, plural common lines, and plural pixels. The scan lines and the data lines are disposed over the substrate and define plural pixel areas. Each pixel is disposed in one of the pixel areas corresponding thereto. Each pixel comprises a thin film transistor, a pixel electrode, a top electrode, and a conductive line. In each pixel, the thin film transistor is coupled to the corresponding scan line and the corresponding data line, and the pixel electrode is disposed over the corresponding common line. Furthermore, the top electrode is disposed between the corresponding pixel electrode and common line, and the conductive line is disposed out of the corresponding common line and coupled between the corresponding top electrode and pixel electrode.

摘要翻译： 提供薄膜晶体管阵列基板及其修复方法。 薄膜晶体管阵列基板包括基板，多条扫描线，多条数据线，多条公共线和多个像素。 扫描线和数据线设置在衬底上并限定多个像素区域。 每个像素被布置在与其对应的像素区域之一中。 每个像素包括薄膜晶体管，像素电极，顶部电极和导电线。 在每个像素中，薄膜晶体管耦合到对应的扫描线和对应的数据线，并且像素电极设置在相应的公共线上。 此外，顶部电极设置在相应的像素电极和公共线之间，并且导线布置在相应的公共线之外并且耦合在相应的顶部电极和像素电极之间。

公开(公告)号：US08144899B2

公开(公告)日：2012-03-27

申请号：US12184191

申请日：2008-07-31

申请人： Po-Hsun Song ,  Jen-Yi Chen ,  Kai-Hsiang Yen

发明人： Po-Hsun Song ,  Jen-Yi Chen ,  Kai-Hsiang Yen

IPC分类号： H04R25/00 ,  H04R11/02

CPC分类号： H04R19/04

摘要： An acoustic transducer comprises a substrate, a membrane configured to move relative to the substrate, a number of supports configured to suspend the membrane over the substrate, a first group of projections extending from the membrane, and a second group of projections extending from the substrate, the second group of projections being interweaved with and movable relative to the first group of projections, wherein each projection of one group of the first group of projections and the second group of projections is composed of a first conductive layer, a second conductive layer and a dielectric layer between the first conductive layer and the second conductive layer, and each projection of the other one group of the first group of projections and the second group of projections is composed of a third conductive layer.

摘要翻译： 声换能器包括基底，被配置为相对于基底移动的膜，多个支撑件，其构造成将膜悬挂在基底上，从该膜延伸的第一组突起，以及从基底延伸的第二组突起 所述第二组突起相对于所述第一组突起交织并可移动，其中所述第一组突起和所述第二组突起中的一组的每个突起由第一导电层，第二导电层和 第一导电层和第二导电层之间的介电层，第一组突起的另一组和第二组突起的每个突起由第三导电层组成。