公开(公告)号：US20230197565A1

公开(公告)日：2023-06-22

申请号：US18090420

申请日：2022-12-28

申请人： Jerrod P. Peterson ,  Kyle J. Arrington ,  Ellann Cohen ,  Mark A. MacDonald ,  Christopher Michael Moore ,  Akhilesh P. Rallabandi

发明人： Jerrod P. Peterson ,  Kyle J. Arrington ,  Ellann Cohen ,  Mark A. MacDonald ,  Christopher Michael Moore ,  Akhilesh P. Rallabandi

IPC分类号： H01L23/427 ,  H01L23/00 ,  H05K7/20 ,  H05K1/18

CPC分类号： H01L23/427 ,  H01L24/29 ,  H01L24/32 ,  H05K7/20336 ,  H05K7/20154 ,  H05K1/18 ,  H01L2224/32245 ,  H01L2224/2929 ,  H01L2924/0665 ,  H01L2224/29291 ,  H01L2924/0715 ,  H01L2224/29347 ,  H01L2224/29339 ,  H01L2224/29324 ,  H01L2224/29393 ,  H01L2224/29387 ,  H01L2924/0503 ,  H01L2224/29317 ,  H01L2924/01033 ,  H01L2924/01327 ,  H01L2924/05032 ,  H01L2924/05432 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2924/0133 ,  H01L2224/29313 ,  H01L2924/014 ,  H05K2201/066

摘要： A thermal management solution in a mobile computing system is bonded to an integrated circuit component by a thermal interface material layer (TIM layer) that does not require the application of a permanent force to ensure a reliable thermally conductive connection. A leaf spring or other loading mechanism that can apply a permanent force to a TIM layer can be secured to a printed circuit board by fasteners that extend through holes in the board in the vicinity of the integrated circuit component. These holes consume area that could otherwise be used for signal routing. In devices that use a TIM layer that does not require the application of a permanent force, the thermal management solution can be attached to a printed circuit board or chassis at a location remote to the integrated circuit component, where the attachment mechanism does not or minimally interferes with integrated circuit component signal routing.

公开(公告)号：US20150187115A1

公开(公告)日：2015-07-02

申请号：US14142579

申请日：2013-12-27

申请人： Mark A. MacDonald ,  David W. Browning

发明人： Mark A. MacDonald ,  David W. Browning

IPC分类号： G06T15/00 ,  G02B27/01 ,  G06F3/01

CPC分类号： G02B27/0172 ,  G02B2027/0134 ,  G02B2027/0178 ,  G02B2027/0185 ,  G06F1/163 ,  G06F3/011 ,  G06F3/013 ,  G09G2320/0261 ,  H04N13/128 ,  H04N13/337 ,  H04N13/341 ,  H04N13/344 ,  H04N13/383 ,  H04N13/398 ,  H04N2213/008

摘要： Embodiments are generally directed to dynamically adjustable three-dimensional (3D) goggles. An embodiment of an apparatus includes a frame; a display for 3D images; and a dynamically adjustable lens assembly including one or more lenses for viewing the 3D images; wherein a focal length of the lens assembly is dynamically adjustable in response to received focal distance data.

摘要翻译： 实施例通常涉及动态调节的三维（3D）护目镜。 装置的实施例包括框架; 3D图像显示; 以及包括用于观看3D图像的一个或多个透镜的动态可调透镜组件; 其中所述透镜组件的焦距响应于接收到的焦距数据而动态地调节。

公开(公告)号：US20230125348A1

公开(公告)日：2023-04-27

申请号：US18066271

申请日：2022-12-14

申请人： Shantanu D. Kulkarni ,  Ruander Cardenas ,  Jeff Ku ,  Mark A. MacDonald ,  Samarth Alva ,  Vipin Ghanshamrao Bokade ,  Srinivasarao Konakalla ,  Arnab Sen

发明人： Shantanu D. Kulkarni ,  Ruander Cardenas ,  Jeff Ku ,  Mark A. MacDonald ,  Samarth Alva ,  Vipin Ghanshamrao Bokade ,  Srinivasarao Konakalla ,  Arnab Sen

IPC分类号： F04D29/40 ,  F03G7/06 ,  F04D29/02

摘要： Dynamically modifiable air movers can be modified during operation of a computing system to allow the performance of the fan (air flow, air flow split between exhausts) to be adjusted based on a workload being performed by the system. The physical modifications that an air mover can undergo are physical in nature and include adjusting the placement of one or more cutwaters, expanding or contracting an expandable portion of the fan housing, covering or uncovering an exhaust to provide or remove cooling to memory components, and moving a slidable strip to extend or withdraw from an exhaust. Causing one or more of these physical modifications to be made can be performed in response to the system determining that a temperature, rate of temperature change, power consumption level, rate of power consumption level change of the system or system components exceeds or has dropped below a threshold level.

公开(公告)号：US20090154113A1

公开(公告)日：2009-06-18

申请号：US11954678

申请日：2007-12-12

申请人： Mark A. MacDonald

发明人： Mark A. MacDonald

IPC分类号： H05K7/20 ,  H05K3/00

CPC分类号： H05K7/20518 ,  Y10T29/49124

摘要： In some embodiments, a device includes power source circuitry, a circuit board supporting electrical components to receive electrical power from the power source circuitry. The device further includes a housing forming a cavity including the circuit board, and thermal energy storage material held in the cavity, wherein the thermal energy storage material is distributed throughout various places in the cavity. Additional embodiments are described.

摘要翻译： 在一些实施例中，设备包括电源电路，支持电子部件以从电源电路接收电力的电路板。 该装置还包括形成包括电路板的空腔的壳体和保持在空腔中的热能储存材料，其中热能储存材料分布在空腔中的各个位置。 描述其他实施例。