Nonvolatile memory devices with trenched side-wall transistors and method of fabricating the same
    1.
    发明授权
    Nonvolatile memory devices with trenched side-wall transistors and method of fabricating the same 有权
    具有沟槽侧壁晶体管的非易失性存储器件及其制造方法

    公开(公告)号:US07391071B2

    公开(公告)日:2008-06-24

    申请号:US11233857

    申请日:2005-09-23

    IPC分类号: H01L29/76 H01L21/336

    摘要: A nonvolatile memory device includes a semiconductor substrate, a device isolation layer, a tunnel insulation layer, a floating gate, a buried floating gate, and a control gate. A trench is in the substrate that defines an active region of the substrate adjacent to the trench. A device isolation layer is on the substrate along the trench. A tunnel insulation layer is on the active region of the substrate. A floating gate is on the tunnel insulation layer opposite to the active region of the substrate. A buried floating gate is on the device isolation layer in the trench. An intergate dielectric layer is on and extends across the floating gate and the buried floating gate. A control gate is on the intergate dielectric layer and extends across the floating gate and the buried floating gate.

    摘要翻译: 非易失性存储器件包括半导体衬底,器件隔离层,隧道绝缘层,浮置栅极,埋入浮栅和控制栅极。 衬底中的沟槽限定邻近沟槽的衬底的有源区。 器件隔离层沿着沟槽在衬底上。 隧道绝缘层位于衬底的有源区上。 浮动栅极位于与衬底的有源区相对的隧道绝缘层上。 埋置的浮动栅极位于沟槽中的器件隔离层上。 隔间电介质层在浮栅和埋入浮栅之间并且延伸。 控制栅极位于隔间电介质层上,并跨越浮置栅极和埋入浮栅。

    NAND flash memory devices and methods of fabricating the same
    2.
    发明授权
    NAND flash memory devices and methods of fabricating the same 失效
    NAND闪存器件及其制造方法

    公开(公告)号:US07608507B2

    公开(公告)日:2009-10-27

    申请号:US12216393

    申请日:2008-07-03

    IPC分类号: H01L21/336

    摘要: A NAND includes a device isolation pattern disposed in a region of a substrate defining a plurality of active regions. Memory transistors having memory gate patterns, constituting a cell string, cross the plurality of active regions. Select transistors are disposed over the memory transistors, and lower plugs are disposed on each side of the cell string to electrically connect the plurality of active regions on both sides of the cell string and the select transistors.

    摘要翻译: NAND包括设置在限定多个有源区的衬底的区域中的器件隔离图案。 具有构成单元串的存储器栅极图案的存储晶体管跨过多个有源区。 选择晶体管设置在存储晶体管的上方,并且下部插头设置在单元串的每一侧,以电连接单元串和选择晶体管的两侧上的多个有源区。

    Nand flash memory devices and methods of fabricating the same
    3.
    发明申请
    Nand flash memory devices and methods of fabricating the same 失效
    Nand闪存器件及其制造方法

    公开(公告)号:US20070048922A1

    公开(公告)日:2007-03-01

    申请号:US11509007

    申请日:2006-08-24

    IPC分类号: H01L21/8238

    摘要: A NAND includes a device isolation pattern disposed in a region of a substrate defining a plurality of active regions. Memory transistors having memory gate patterns, constituting a cell string, cross the plurality of active regions. Select transistors are disposed over the memory transistors, and lower plugs are disposed on each side of the cell string to electrically connect the plurality of active regions on both sides of the cell string and the select transistors.

    摘要翻译: NAND包括设置在限定多个有源区的衬底的区域中的器件隔离图案。 具有构成单元串的存储器栅极图案的存储晶体管跨过多个有源区。 选择晶体管设置在存储晶体管的上方,并且下部插头设置在单元串的每一侧,以电连接单元串和选择晶体管的两侧上的多个有源区。

    NAND flash memory devices and methods of fabricating the same
    4.
    发明申请
    NAND flash memory devices and methods of fabricating the same 失效
    NAND闪存器件及其制造方法

    公开(公告)号:US20080268595A1

    公开(公告)日:2008-10-30

    申请号:US12216393

    申请日:2008-07-03

    IPC分类号: H01L21/8247

    摘要: A NAND includes a device isolation pattern disposed in a region of a substrate defining a plurality of active regions. Memory transistors having memory gate patterns, constituting a cell string, cross the plurality of active regions. Select transistors are disposed over the memory transistors, and lower plugs are disposed on each side of the cell string to electrically connect the plurality of active regions on both sides of the cell string and the select transistors.

    摘要翻译: NAND包括设置在限定多个有源区的衬底的区域中的器件隔离图案。 具有构成单元串的存储器栅极图案的存储晶体管跨过多个有源区。 选择晶体管设置在存储晶体管的上方,并且下部插头设置在单元串的每一侧,以电连接单元串和选择晶体管的两侧上的多个有源区。

    Nand flash memory devices and methods of fabricating the same
    5.
    发明授权
    Nand flash memory devices and methods of fabricating the same 失效
    Nand闪存器件及其制造方法

    公开(公告)号:US07411239B2

    公开(公告)日:2008-08-12

    申请号:US11509007

    申请日:2006-08-24

    IPC分类号: H01L27/108

    摘要: A NAND includes a device isolation pattern disposed in a region of a substrate defining a plurality of active regions. Memory transistors having memory gate patterns, constituting a cell string, cross the plurality of active regions. Select transistors are disposed over the memory transistors, and lower plugs are disposed on each side of the cell string to electrically connect the plurality of active regions on both sides of the cell string and the select transistors.

    摘要翻译: NAND包括设置在限定多个有源区的衬底的区域中的器件隔离图案。 具有构成单元串的存储器栅极图案的存储晶体管跨过多个有源区。 选择晶体管设置在存储晶体管的上方,并且下部插头设置在单元串的每一侧,以电连接单元串和选择晶体管的两侧上的多个有源区。

    Nonvolatile memory devices with trenched side-wall transistors and method of fabricating the same
    8.
    发明申请
    Nonvolatile memory devices with trenched side-wall transistors and method of fabricating the same 有权
    具有沟槽侧壁晶体管的非易失性存储器件及其制造方法

    公开(公告)号:US20060063331A1

    公开(公告)日:2006-03-23

    申请号:US11233857

    申请日:2005-09-23

    IPC分类号: H01L21/336 H01L21/3205

    摘要: A nonvolatile memory device includes a semiconductor substrate, a device isolation layer, a tunnel insulation layer, a floating gate, a buried floating gate, and a control gate. A trench is in the substrate that defines an active region of the substrate adjacent to the trench. A device isolation layer is on the substrate along the trench. A tunnel insulation layer is on the active region of the substrate. A floating gate is on the tunnel insulation layer opposite to the active region of the substrate. A buried floating gate is on the device isolation layer in the trench. An intergate dielectric layer is on and extends across the floating gate and the buried floating gate. A control gate is on the intergate dielectric layer and extends across the floating gate and the buried floating gate.

    摘要翻译: 非易失性存储器件包括半导体衬底,器件隔离层,隧道绝缘层,浮置栅极,埋入浮栅和控制栅极。 衬底中的沟槽限定邻近沟槽的衬底的有源区。 器件隔离层沿着沟槽在衬底上。 隧道绝缘层位于衬底的有源区上。 浮动栅极位于与衬底的有源区相对的隧道绝缘层上。 埋置的浮动栅极位于沟槽中的器件隔离层上。 隔间电介质层在浮栅和埋入浮栅之间并且延伸。 控制栅极位于隔间电介质层上,并跨越浮置栅极和埋入浮栅。

    NAND-type flash memory devices and methods of fabricating the same
    9.
    发明申请
    NAND-type flash memory devices and methods of fabricating the same 有权
    NAND型闪存器件及其制造方法

    公开(公告)号:US20050023600A1

    公开(公告)日:2005-02-03

    申请号:US10921656

    申请日:2004-08-19

    摘要: NAND-type flash memory devices and methods of fabricating the same are provided. The NAND-type flash memory device includes a plurality of isolation layers running parallel with each other, which are formed at predetermined regions of a semiconductor substrate. This device also includes a string selection line pattern, a plurality of word line patterns and a ground selection line pattern which cross over the isolation layers and active regions between the isolation layers. Source regions are formed in the active regions adjacent to the ground selection line patterns and opposite the string selection line pattern. The source regions and the isolation layers between the source regions are covered with a common source line running parallel with the ground selection line pattern.

    摘要翻译: 提供了NAND​​型闪存器件及其制造方法。 NAND型闪速存储器件包括彼此平行延伸的多个隔离层,它们形成在半导体衬底的预定区域。 该装置还包括串联选择线图案,多个字线图案和跨越隔离层和隔离层之间的有源区域的接地选择线图案。 源极区域形成在与地选择线图案相邻的有源区域中并且与串选择线图案相反。 源极区域和源极区域之间的隔离层被与地选择线图案平行延伸的公共源极线覆盖。

    Non-volatile memory device and method for fabricating the same

    公开(公告)号:US06677639B2

    公开(公告)日:2004-01-13

    申请号:US10188389

    申请日:2002-07-01

    IPC分类号: H01L2976

    CPC分类号: H01L27/11568 H01L27/115

    摘要: A non-volatile memory device and fabrication method thereof are provided. A floating region is formed on an active region on a substrate. Trenches define the active region. The floating region is made of an ONO layer. A gate electrode is formed on the floating region. A mask is formed on the gate electrode. A thermal oxidation is performed to make a sidewall oxide and a trench oxide on the sidewall of the gate electrode and the trench, respectively. As a result, the widths of the gate electrode and the active region become less than the width of the floating region, thereby forming protrusions at ends of the floating region. Isolation regions are formed in the trenches and include the sidewall oxide and the trench oxide. The isolation regions surround the protrusions. As a result, electric field induced on the sidewall of the floating region is decreased. Moreover, the thermal oxidation cures any damage to the sidewalls of the floating region. Accordingly, leakage current can be substantially suppressed at the boundary region between the isolation region and the floating region.