公开(公告)号：US20140263584A1

公开(公告)日：2014-09-18

申请号：US13794836

申请日：2013-03-12

申请人： Jia Lin Yap ,  Yin Kheng Au ,  Poh Leng Eu ,  Hung Yang Leong ,  Mohd Rusli Ibrahim ,  Navas Khan Oratti Kalandar ,  Mohd Faizal Zul-Kifli

发明人： Jia Lin Yap ,  Yin Kheng Au ,  Poh Leng Eu ,  Hung Yang Leong ,  Mohd Rusli Ibrahim ,  Navas Khan Oratti Kalandar ,  Mohd Faizal Zul-Kifli

IPC分类号： H01L23/00

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78611 ,  H01L2224/8501 ,  H01L2224/85012 ,  H01L2224/85045 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01049 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/43848 ,  H01L2924/01012

摘要： A method of making an electrical connection includes passing a bond wire through a wire bonding system having a wire polisher and a wire bonding tool. The wire polisher removes contamination from a first portion of the bond wire. A first bond is then formed by bonding the first portion of the bond wire to a first contact such that the bond wire and the first device are electrically connected. A second bond is then formed by bonding a second portion of the bond wire to a second contact such that the first contact and the second contact are electrically connected.

摘要翻译： 制造电连接的方法包括使接合线通过具有线材抛光机和引线接合工具的引线接合系统。 丝线抛光机从接合线的第一部分去除污染物。 然后通过将接合线的第一部分接合到第一接触件来形成第一接合，使得接合线和第一器件电连接。 然后通过将接合线的第二部分接合到第二接触件来形成第二接合，使得第一接触和第二接触电连接。