摘要:
A substrate with a multi-domain vertical alignment pixel structure is provided. The substrate is opposite to a counter substrate with a common electrode, and a liquid crystal layer is disposed between the substrate and the counter substrate. The substrate includes a scan line and a data line, an active device, first and second patterned pixel electrodes and a voltage drop layer. Wherein, the first patterned pixel electrode provides a first electrical field to the liquid crystal layer, and the second patterned pixel electrode provides a second electrical field to the liquid crystal layer. The voltage drop layer makes the first electrical field smaller than the second electrical field.
摘要:
In one embodiment of an invention concerning liquid crystal display devices, a first pixel electrode of a thin film transistor (TFT) array substrate may overlap a slit of a second pixel electrode of the TFT array substrate but not overlap another slit of the second pixel electrode. This may help induce a multi-domain electric field without having to precisely position a common electrode of a color filter substrate and the TFT array substrate. This may prevent position errors, enhance display quality, produce a wider viewing angle, and lower color shift sometimes associated with conventional liquid crystal display devices and methods.
摘要:
In one embodiment of an invention concerning liquid crystal display devices, a first pixel electrode of a thin film transistor (TFT) array substrate may overlap a slit of a second pixel electrode of the TFT array substrate but not overlap another slit of the second pixel electrode. This may help induce a multi-domain electric field without having to precisely position a common electrode of a color filter substrate and the TFT array substrate. This may prevent position errors, enhance display quality, produce a wider viewing angle, and lower color shift sometimes associated with conventional liquid crystal display devices and methods.
摘要:
A liquid crystal display (LCD) structure is provided. A first alignment layer and a first electrode layer are disposed on a liquid crystal layer. A second electrode layer and a second alignment layer disposed under the liquid crystal layer. The first alignment layer and the second alignment layer respectively have a plurality of alignment areas with different aligning directions. At least one of the first electrode layer and the second electrode layer includes a substrate material and a plurality of openings, and at least includes a plurality of electrode areas. The boundaries of the electrode areas correspond to the boundaries of the alignment areas. The directions of the openings in the electrode areas are between the aligning directions of the corresponding alignment areas of the first alignment layer and the second alignment layer.
摘要:
A liquid crystal (LC) display panel including a lower substrate with pixel structures, an upper substrate, and an LC layer is provided. Each of the pixel structures includes a transistor and a pixel electrode. The pixel electrode includes first and second pixel electrodes insulated from each other, respectively including a first pattern and a second pattern that different and complementary to each other. Each of the first pixel electrode and the second pixel electrode has at least a trunk with a width smaller than or equal to 10 microns and a plurality of branches. The LC layer is positioned between the upper and the lower substrates and includes a plurality of LC molecules and a plurality of polymers, which are formed on surfaces of at least one of the upper and the lower substrates to cause the plurality of LC molecules to have a pretilt angle.
摘要:
A liquid crystal (LC) display panel including a lower substrate with pixel structures, an upper substrate, and an LC layer is provided. Each of the pixel structures includes a transistor and a pixel electrode. The pixel electrode includes first and second pixel electrodes insulated from each other, respectively including a first pattern and a second pattern that different and complementary to each other. Each of the first pixel electrode and the second pixel electrode has at least a trunk with a width smaller than or equal to 10 microns and a plurality of branches. The LC layer is positioned between the upper and the lower substrates and includes a plurality of LC molecules and a plurality of polymers, which are formed on surfaces of at least one of the upper and the lower substrates to cause the plurality of LC molecules to have a pretilt angle.
摘要:
The semiconductor device package includes a conformal shield layer applied to the exterior surface of the encapsulant, and an internal fence or separation structure embedded in the encapsulant. The fence separates the package into various compartments, with each compartment containing at least one die. The fence thus suppresses EMI between adjacent packages. The package further includes a ground path connected to the internal fence and conformal shield.
摘要:
A photo alignment process and a liquid crystal display using the same are provided. The photo alignment process includes the following steps. A photo alignment material layer is formed on a substrate. The photo alignment material layer is irradiated by a linearly polarized light. A surface of the photo alignment material layer is a first plane. A wave vector of the linearly polarized light is a K vector. A second plane is constructed from a normal vector of the first plane and the K vector. A polarization direction of the linearly polarized light is neither perpendicular nor parallel to the second plane.
摘要:
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a grounding element disposed adjacent to a periphery of a substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit. The grounding element includes an indented portion that is disposed adjacent to a lateral surface of the substrate unit. The semiconductor device package also includes an EMI shield that is electrically connected to the grounding element and is inwardly recessed adjacent to the indented portion of the grounding element.
摘要:
A flip chip packaging process uses an underfill as an encapsultant to reduce the possibility of delamination from occurring due to differential coefficients of thermal expansion, and thus the reliability of a flip chip package structure can be increased. Furthermore, the flooding of the encapsulant over the cutting line need not be taken into consideration for cutting the substrate. Therefore, the usage area of the substrate usage is increased, i.e., more chips can be mounted per unit area of the substrate.