摘要:
In an embodiment, a polycrystalline diamond compact (“PDC”) includes a substrate and a pre-sintered polycrystalline diamond (“PCD”) table bonded to the substrate. The pre-sintered PCD table includes an upper surface, a back surface bonded to the substrate, and at least one lateral surface extending between the upper surface and the back surface. The pre-sintered PCD table includes a region including at least a residual amount of at least one interstitial constituent disposed in at least a portion of the interstitial regions thereof, and a bonding region. The at least one interstitial constituent includes at least one metal carbonate and/or at least one metal oxide. The region extends inwardly from the upper surface and the at least one lateral surface.
摘要:
In an embodiment, a polycrystalline diamond compact (“PDC”) includes a substrate and a pre-sintered polycrystalline diamond (“PCD”) table bonded to the substrate. The pre-sintered PCD table includes an upper surface, a back surface bonded to the substrate, and at least one lateral surface extending between the upper surface and the back surface. The pre-sintered PCD table includes a region including at least a residual amount of at least one interstitial constituent disposed in at least a portion of the interstitial regions thereof, and a bonding region. The at least one interstitial constituent includes at least one metal carbonate and/or at least one metal oxide. The region extends inwardly from the upper surface and the at least one lateral surface.
摘要:
In an embodiment, a polycrystalline diamond compact includes a substrate and a preformed polycrystalline diamond table bonded to the substrate. The table includes bonded diamond grains defining interstitial regions. The table includes an upper surface, a back surface bonded to the substrate, and at least one lateral surface extending therebetween. The table includes a first region extending inwardly from the upper surface and the lateral surface. The first region exhibits a first interstitial region concentration and includes at least one interstitial constituent disposed therein, which may be present in at least a residual amount and includes at least one metal carbonate and/or at least one metal oxide. The table includes a second bonding region adjacent to the substrate that extends inwardly from the back surface. The second bonding region exhibits a second interstitial region concentration that is greater than the first interstitial region concentration and includes a metallic infiltrant therein.
摘要:
Some embodiments relate to cutting element assemblies including a superabrasive cutting element that may be axially compressed to enhance the damage tolerance thereof, enclosed in an enclosure that exposes the superabrasive cutting element therethrough, enclosed in an enclosure that restricts rotation of the superabrasive cutting element, or combinations of the foregoing. Additionally, some embodiments relate to cutting element assemblies in which a superabrasive cutting element is mechanically fastened to a base, such as a substrate or directly to a bit body of a rotary drill bit. Some embodiments also relate to cutting element assemblies including one or more superabrasive cutting elements that are rotatable about a longitudinal axis of the cutting element assembly, that may be axially compressed to enhance the damage tolerance thereof, that may be enclosed in an enclosure that exposes the superabrasive cutting element therethrough, or combinations thereof.
摘要:
Polycrystalline diamond (“PCD”) anvils and associated ultra-high pressure apparatuses employing such anvils. The PCD anvils include an anvil body defining an anvil face. The anvil body comprises a plurality of diamond grains defining a plurality of interstitial regions, with a metal-solvent catalyst occupying at least a portion of the plurality of interstitial regions. The plurality and diamond grains and the metal-solvent catalyst of the PCD collectively exhibit a coercivity of about 115 Oe or more and a specific magnetic saturation of about 15 G·cm3/g or less.
摘要:
Embodiments of the present invention relate to diamond-silicon carbide composites, superabrasive compacts including such diamond-silicon carbide composites, and methods of fabricating such diamond-silicon carbide composites and superabrasive compacts. In one embodiment, a superabrasive compact includes a substrate and a superabrasive table bonded to the substrate. The superabrasive table comprises diamond-silicon carbide composite including a matrix comprising nanometer-sized silicon carbide grains and micrometer-sized diamond grains dispersed through the matrix. In another embodiment, a method of fabricating a superabrasive compact is disclosed. An assembly comprising a mixture including diamond particles and silicon is formed. The silicon comprises amorphous silicon, crystalline silicon crystallized from amorphous silicon formed by a milling process, or combinations thereof. A substrate is positioned in proximity to the mixture. The assembly is subjected to heat and pressure to form a superabrasive compact comprising a superabrasive table bonded to the substrate. The superabrasive table comprises diamond-silicon carbide composite including diamond grains dispersed through a matrix of silicon carbide grains.
摘要:
In an embodiment, a polycrystalline diamond compact includes a substrate and a preformed polycrystalline diamond table bonded to the substrate. The table includes bonded diamond grains defining interstitial regions. The table includes an upper surface, a back surface bonded to the substrate, and at least one lateral surface extending therebetween. The table includes a first region extending inwardly from the upper surface and the lateral surface. The first region exhibits a first interstitial region concentration and includes at least one interstitial constituent disposed therein, which may be present in at least a residual amount and includes at least one metal carbonate and/or at least one metal oxide. The table includes a second bonding region adjacent to the substrate that extends inwardly from the back surface. The second bonding region exhibits a second interstitial region concentration that is greater than the first interstitial region concentration and includes a metallic infiltrant therein.
摘要:
Embodiments relate to methods of fabricating PCD materials by subjecting a mixture that exhibits a broad diamond particle size distribution to an HPHT process, PCD materials so-formed, and PDCs including a polycrystalline diamond table comprising such PCD materials. In an embodiment, a PCD material includes a plurality of bonded diamond grains that exhibit a substantially unimodal diamond grain size distribution characterized, at least in part, by a parameter θ that is less than about 1.0. θ = x 6 · σ , where x is the average grain size of the substantially unimodal diamond grain size distribution, and σ is the standard deviation of the substantially unimodal diamond grain size distribution.
摘要翻译:实施方案涉及通过使表现出宽金刚石粒度分布的混合物经受HPHT方法,所形成的PCD材料和包括包含这种PCD材料的多晶金刚石台的PDC来制造PCD材料的方法。 在一个实施方案中,PCD材料包括多个结合的金刚石晶粒,其表现出基本上单峰金刚石晶粒尺寸分布,其至少部分地由参数和特征表征; 小于约1.0。 &thetas; = x 6·&sgr ,其中x是基本上单峰金刚石晶粒尺寸分布的平均晶粒尺寸, 是基本上单峰金刚石晶粒尺寸分布的标准偏差。
摘要:
Embodiments relate to rotary drill bits that employ superabrasive cutting elements including a diamond-silicon carbide composite table. In an embodiment, a rotary drill bit includes a bit body configured to engage a subterranean formation. The bit body includes a plurality of blades. The rotary drill bit further includes a plurality of superabrasive cutting elements. Each of the superabrasive cutting elements is attached to a corresponding one of the cutting blades. At least one of the superabrasive cutting elements includes a substrate and a superabrasive table bonded to the substrate. The superabrasive table comprises diamond-silicon carbide composite including a matrix comprising nanometer-sized silicon carbide grains and micrometer-sized diamond grains dispersed through the matrix.
摘要:
Embodiments of the present invention relate to diamond-silicon carbide composites, superabrasive compacts including such diamond-silicon carbide composites, and methods of fabricating such diamond-silicon carbide composites and superabrasive compacts. In one embodiment, a superabrasive compact includes a substrate and a superabrasive table bonded to the substrate. The superabrasive table comprises diamond-silicon carbide composite including a matrix comprising nanometer-sized silicon carbide grains and micrometer-sized diamond grains dispersed through the matrix. In another embodiment, a method of fabricating a superabrasive compact is disclosed. An assembly comprising a mixture including diamond particles and silicon is formed. The silicon comprises amorphous silicon, crystalline silicon crystallized from amorphous silicon formed by a milling process, or combinations thereof. A substrate is positioned in proximity to the mixture. The assembly is subjected to heat and pressure to form a superabrasive compact comprising a superabrasive table bonded to the substrate. The superabrasive table comprises diamond-silicon carbide composite including diamond grains dispersed through a matrix of silicon carbide grains.