公开(公告)号：US20210251206A1

公开(公告)日：2021-08-19

申请号：US17255543

申请日：2019-09-06

Applicant: Jin Su LEE

Inventor： Jin Su LEE

IPC: A01K89/012 ,  A01K89/00

Abstract: A dual-driving one-way rotational device includes: a body part; a clutch bearing part configured to guide the rotation of the body part in one direction; a knob part configured to be rotated in one direction in the state of being connected to an object to be rotated or to prevent the body part from being rotated together when the object to be rotated and the clutch bearing part are rotated in the same direction; a manual rotation lever installed on the body part; and a power transmission shaft coupled to the knob part, and configured to transfer the power of a power source. The knob part includes a rotation portion and a head portion. A spiral is formed on the inner circumferences of the rotation portion and the head portion. The power transmission shaft has the outer circumference on which a spiral is formed.

公开(公告)号：US20130037942A1

公开(公告)日：2013-02-14

申请号：US13564431

申请日：2012-08-01

Applicant: In Chul HWANG ,  Jae Myun KIM ,  Seung Jee KIM ,  Jin Su LEE

Inventor： In Chul HWANG ,  Jae Myun KIM ,  Seung Jee KIM ,  Jin Su LEE

IPC: H01L23/498 ,  H01L23/48 ,  H01L21/50

CPC classification number: H01L25/50 ,  H01L21/76898 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/80 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/08145 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/48227 ,  H01L2224/80006 ,  H01L2224/80896 ,  H01L2224/81191 ,  H01L2224/9202 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/80 ,  H01L2224/11 ,  H01L2224/81

Abstract: Dual-layered structural semiconductor chips are provided. The semiconductor chip includes a first semiconductor chip and a second semiconductor chip bonded to the first semiconductor chip. The first semiconductor chip includes a first substrate having a first bottom surface. The second semiconductor chip includes a second substrate having a second bottom surface. The first bottom surface directly contacts the second bottom surface. The related packages and the related methods are also provided.