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    Board having buried patterns and manufacturing method thereof
    1.
    发明申请
    Board having buried patterns and manufacturing method thereof 审中-公开
    具有掩埋图案的板及其制造方法

    公开(公告)号：US20090008143A1

    公开(公告)日：2009-01-08

    申请号：US12155838

    申请日：2008-06-10

    申请人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    发明人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    IPC分类号： H01K3/22 ,  H01R12/04

    CPC分类号： H05K3/107 ,  H05K3/205 ,  H05K3/465 ,  H05K3/4658 ,  H05K2201/0191 ,  H05K2201/0376 ,  Y10T29/49158

    摘要： A board having buried patterns is disclosed. The board may include an insulation panel, a first pattern buried in one side of the insulation panel, a second pattern buried in the other side of the insulation panel with a predetermined insulating thickness between the first pattern and the second pattern, and a via which electrically connects the first pattern and the second pattern. The board having buried patterns according to certain embodiments of the invention can have greater rigidity compared to a board having exposed patterns, for the same insulating thickness. Also, a carrier-insulation set having a particular amount of thickness can be utilized to satisfy the thickness requirement in employing an existing roller apparatus intended for thicker boards.

    摘要翻译： 公开了具有掩埋图案的板。 板可以包括绝缘板，埋在绝缘板的一侧中的第一图案，在第一图案和第二图案之间以预定的绝缘厚度掩埋在绝缘板的另一侧中的第二图案，以及通孔， 电连接第一图案和第二图案。 对于相同的绝缘厚度，具有根据本发明的某些实施例的埋设图案的板可以具有比具有暴露图案的板更大的刚性。 此外，可以利用具有特定厚度的载体绝缘组件来满足使用用于较厚板的现有辊装置的厚度要求。

    Mounting substrate and manufacturing method thereof
    3.
    发明授权
    Mounting substrate and manufacturing method thereof 有权
    安装基板及其制造方法

    公开(公告)号：US08022553B2

    公开(公告)日：2011-09-20

    申请号：US12155555

    申请日：2008-06-05

    申请人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    发明人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    IPC分类号： H01L23/48

    CPC分类号： H05K1/113 ,  H01L23/13 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/20 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09472 ,  H01L2224/0401

    摘要： A mounting substrate and a method of manufacturing the mounting substrate. The mounting substrate can include an insulation layer, a bonding pad buried in one side of the insulation layer in correspondence with a mounting position of a chip, and a circuit pattern electrically connected to the bonding pad. By utilizing certain embodiments of the invention, the process for stacking a solder resist layer can be omitted, as the bonding pads can be implemented in a form recessed from the surface of the insulation layer. In this way, the manufacturing process can be simplified and manufacturing costs can be reduced. Since the surface of the mounting-substrate on which to mount a chip can be kept flat without any protuberances, the occurrence of voids in the underfill can be minimized. This is correlated to obtaining a high degree of reliability, and leads to a greater likelihood of successful mounting.

    摘要翻译： 一种安装基板及其制造方法。 安装基板可以包括绝缘层，与绝缘层的一侧相对应于芯片的安装位置的接合焊盘以及电连接到焊盘的电路图案。 通过利用本发明的某些实施例，可以省略堆叠阻焊层的工艺，因为焊盘可以以从绝缘层的表面凹陷的形式来实施。 以这种方式，可以简化制造过程，并且可以降低制造成本。 由于安装芯片的安装基板的表面可以保持平坦而没有任何突起，所以可以使底部填充物中的空隙的发生最小化。 这与获得高可靠性相关，并且导致成功安装的可能性更大。

    Mounting substrate and manufacturing method thereof
    4.
    发明申请
    Mounting substrate and manufacturing method thereof 有权
    安装基板及其制造方法

    公开(公告)号：US20080315431A1

    公开(公告)日：2008-12-25

    申请号：US12155555

    申请日：2008-06-05

    申请人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    发明人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    IPC分类号： H01L23/48 ,  H01L21/44

    CPC分类号： H05K1/113 ,  H01L23/13 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/20 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09472 ,  H01L2224/0401

    摘要： A mounting substrate and a method of manufacturing the mounting substrate. The mounting substrate can include an insulation layer, a bonding pad buried in one side of the insulation layer in correspondence with a mounting position of a chip, and a circuit pattern electrically connected to the bonding pad. By utilizing certain embodiments of the invention, the process for stacking a solder resist layer can be omitted, as the bonding pads can be implemented in a form recessed from the surface of the insulation layer. In this way, the manufacturing process can be simplified and manufacturing costs can be reduced. Since the surface of the mounting-substrate on which to mount a chip can be kept flat without any protuberances, the occurrence of voids in the underfill can be minimized. This is correlated to obtaining a high degree of reliability, and leads to a greater likelihood of successful mounting.

    摘要翻译： 一种安装基板及其制造方法。 安装基板可以包括绝缘层，与绝缘层的一侧相对应于芯片的安装位置的接合焊盘以及电连接到焊盘的电路图案。 通过利用本发明的某些实施例，可以省略堆叠阻焊层的工艺，因为焊盘可以以从绝缘层的表面凹陷的形式来实施。 以这种方式，可以简化制造过程，并且可以降低制造成本。 由于安装芯片的安装基板的表面可以保持平坦而没有任何突起，所以可以使底部填充物中的空隙的发生最小化。 这与获得高可靠性相关，并且导致成功安装的可能性更大。