利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

69 条记录 (耗时 0.023 秒)

    Board having buried patterns and manufacturing method thereof
    1.
    发明申请
    Board having buried patterns and manufacturing method thereof 审中-公开
    具有掩埋图案的板及其制造方法

    公开(公告)号：US20090008143A1

    公开(公告)日：2009-01-08

    申请号：US12155838

    申请日：2008-06-10

    申请人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    发明人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    IPC分类号： H01K3/22 ,  H01R12/04

    CPC分类号： H05K3/107 ,  H05K3/205 ,  H05K3/465 ,  H05K3/4658 ,  H05K2201/0191 ,  H05K2201/0376 ,  Y10T29/49158

    摘要： A board having buried patterns is disclosed. The board may include an insulation panel, a first pattern buried in one side of the insulation panel, a second pattern buried in the other side of the insulation panel with a predetermined insulating thickness between the first pattern and the second pattern, and a via which electrically connects the first pattern and the second pattern. The board having buried patterns according to certain embodiments of the invention can have greater rigidity compared to a board having exposed patterns, for the same insulating thickness. Also, a carrier-insulation set having a particular amount of thickness can be utilized to satisfy the thickness requirement in employing an existing roller apparatus intended for thicker boards.

    摘要翻译： 公开了具有掩埋图案的板。 板可以包括绝缘板，埋在绝缘板的一侧中的第一图案，在第一图案和第二图案之间以预定的绝缘厚度掩埋在绝缘板的另一侧中的第二图案，以及通孔， 电连接第一图案和第二图案。 对于相同的绝缘厚度，具有根据本发明的某些实施例的埋设图案的板可以具有比具有暴露图案的板更大的刚性。 此外，可以利用具有特定厚度的载体绝缘组件来满足使用用于较厚板的现有辊装置的厚度要求。

    Mounting substrate and manufacturing method thereof
    3.
    发明授权
    Mounting substrate and manufacturing method thereof 有权
    安装基板及其制造方法

    公开(公告)号：US08022553B2

    公开(公告)日：2011-09-20

    申请号：US12155555

    申请日：2008-06-05

    申请人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    发明人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    IPC分类号： H01L23/48

    CPC分类号： H05K1/113 ,  H01L23/13 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/20 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09472 ,  H01L2224/0401

    摘要： A mounting substrate and a method of manufacturing the mounting substrate. The mounting substrate can include an insulation layer, a bonding pad buried in one side of the insulation layer in correspondence with a mounting position of a chip, and a circuit pattern electrically connected to the bonding pad. By utilizing certain embodiments of the invention, the process for stacking a solder resist layer can be omitted, as the bonding pads can be implemented in a form recessed from the surface of the insulation layer. In this way, the manufacturing process can be simplified and manufacturing costs can be reduced. Since the surface of the mounting-substrate on which to mount a chip can be kept flat without any protuberances, the occurrence of voids in the underfill can be minimized. This is correlated to obtaining a high degree of reliability, and leads to a greater likelihood of successful mounting.

    摘要翻译： 一种安装基板及其制造方法。 安装基板可以包括绝缘层，与绝缘层的一侧相对应于芯片的安装位置的接合焊盘以及电连接到焊盘的电路图案。 通过利用本发明的某些实施例，可以省略堆叠阻焊层的工艺，因为焊盘可以以从绝缘层的表面凹陷的形式来实施。 以这种方式，可以简化制造过程，并且可以降低制造成本。 由于安装芯片的安装基板的表面可以保持平坦而没有任何突起，所以可以使底部填充物中的空隙的发生最小化。 这与获得高可靠性相关，并且导致成功安装的可能性更大。

    Mounting substrate and manufacturing method thereof
    4.
    发明申请
    Mounting substrate and manufacturing method thereof 有权
    安装基板及其制造方法

    公开(公告)号：US20080315431A1

    公开(公告)日：2008-12-25

    申请号：US12155555

    申请日：2008-06-05

    申请人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    发明人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    IPC分类号： H01L23/48 ,  H01L21/44

    CPC分类号： H05K1/113 ,  H01L23/13 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/20 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09472 ,  H01L2224/0401

    摘要： A mounting substrate and a method of manufacturing the mounting substrate. The mounting substrate can include an insulation layer, a bonding pad buried in one side of the insulation layer in correspondence with a mounting position of a chip, and a circuit pattern electrically connected to the bonding pad. By utilizing certain embodiments of the invention, the process for stacking a solder resist layer can be omitted, as the bonding pads can be implemented in a form recessed from the surface of the insulation layer. In this way, the manufacturing process can be simplified and manufacturing costs can be reduced. Since the surface of the mounting-substrate on which to mount a chip can be kept flat without any protuberances, the occurrence of voids in the underfill can be minimized. This is correlated to obtaining a high degree of reliability, and leads to a greater likelihood of successful mounting.

    摘要翻译： 一种安装基板及其制造方法。 安装基板可以包括绝缘层，与绝缘层的一侧相对应于芯片的安装位置的接合焊盘以及电连接到焊盘的电路图案。 通过利用本发明的某些实施例，可以省略堆叠阻焊层的工艺，因为焊盘可以以从绝缘层的表面凹陷的形式来实施。 以这种方式，可以简化制造过程，并且可以降低制造成本。 由于安装芯片的安装基板的表面可以保持平坦而没有任何突起，所以可以使底部填充物中的空隙的发生最小化。 这与获得高可靠性相关，并且导致成功安装的可能性更大。

    Printed circuit board with weak magnetic field sensor
    6.
    发明授权
    Printed circuit board with weak magnetic field sensor 有权
    具有弱磁场传感器的印刷电路板

    公开(公告)号：US07394249B2

    公开(公告)日：2008-07-01

    申请号：US10965613

    申请日：2004-10-14

    申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

    发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

    IPC分类号： G01R33/04

    CPC分类号： G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

    摘要： Disclosed is a printed circuit board with a weak magnetic field sensor according to the present invention, which includes a substrate having first excitation circuits and first detection circuits formed on both sides thereof. First laminates are layered on both sides of the substrate, and have soft magnetic cores with a predetermined shape formed thereon. Second laminates are layered on the first laminates, and have second excitation circuits and second detection circuits, connected through via holes to the first excitation circuits and first detection circuits, respectively, so that the first and second excitation circuits and first and second detection circuits are wound around the soft magnetic cores, formed thereon. The soft magnetic cores each include a magnetic core and non-magnetic metal layers formed on both sides of the magnetic core.

    摘要翻译： 公开了根据本发明的具有弱磁场传感器的印刷电路板，其包括具有形成在其两侧上的第一激励电路和第一检测电路的基板。 第一层压体层叠在基板的两侧，并且具有形成在其上的预定形状的软磁芯。 第二层叠体层叠在第一层叠体上，并具有分别通过通孔与第一激励电路和第一检测电路连接的第二激励电路和第二检测电路，使得第一和第二激励电路以及第一和第二检测电路 缠绕在其上形成的软磁芯上。 软磁芯各自包括形成在磁芯两侧的磁芯和非磁性金属层。

    Printed circuit board having weak magnetic field sensor and method of manufacturing the same
    7.
    发明申请
    Printed circuit board having weak magnetic field sensor and method of manufacturing the same 有权
    具有弱磁场传感器的印刷电路板及其制造方法

    公开(公告)号：US20060017435A1

    公开(公告)日：2006-01-26

    申请号：US10975736

    申请日：2004-10-28

    申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

    发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

    IPC分类号： G01R33/02

    CPC分类号： G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

    摘要： A Printed Circuit Board (PCB) having a weak magnetic field sensor of the present invention includes a base plate on which a first excitation circuit and a first detection circuit are formed on each of the sides thereof, soft magnetic core bodies laminated on the top and bottom of the base plate, respectively, and formed of a plurality of soft magnetic cores, and outer layers that are laminated on the soft magnetic core bodies, respectively, and on which a second excitation circuit and a second detection circuit connected to the first excitation circuit and the first detection circuit through via holes are formed so as to surround the soft magnetic cores, respectively. The present invention is characterized in that the soft magnetic cores, the excitation circuit and the detection circuit formed on one side of the base plate are perpendicular to the soft magnetic cores, the excitation circuit and the detection circuit formed on the other side of the base plate.

    摘要翻译： 本发明的具有弱磁场传感器的印刷电路板（PCB）包括：基板，其基板在其基板上形成有第一激励电路和第一检测电路，软磁芯体层叠在顶板上， 底板分别由多个软磁芯和层叠在软磁体上的外层构成，第二激励电路和第二检测电路分别连接到第一激励 电路和通过通孔的第一检测电路分别形成为围绕软磁芯。 本发明的特征在于，形成在基板的一侧上的软磁芯，激励电路和检测电路垂直于软磁芯，激励电路和检测电路形成在基座的另一侧 盘子。

    Actuator employing a bobbin incorporating a winding coil and a manufacturing method thereof
    9.
    发明申请
    Actuator employing a bobbin incorporating a winding coil and a manufacturing method thereof 失效
    采用卷绕线圈的筒管的致动器及其制造方法

    公开(公告)号：US20050060732A1

    公开(公告)日：2005-03-17

    申请号：US10704811

    申请日：2003-11-12

    申请人： Myung-Sam Kang ,  Kyung-Sik Shin ,  Won-Cheol Bae ,  Chang-Sup Ryu

    发明人： Myung-Sam Kang ,  Kyung-Sik Shin ,  Won-Cheol Bae ,  Chang-Sup Ryu

    IPC分类号： G11B7/09 ,  G11B7/08 ,  G11B7/085 ,  G11B7/22 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00

    CPC分类号： H05K1/165 ,  G11B7/08582 ,  G11B7/0933 ,  G11B7/0935 ,  H05K1/115 ,  H05K2201/097 ,  H05K2201/10121

    摘要： An optical pickup actuator and a method thereof includes a bobbin having a lens to scan a laser beam on a track of a disc, a winding coil moving the bobbin on the track in focusing and tracking directions, and an integrated circuit board used as the bobbin using a printed circuit board manufacturing technology and integrally formed with the winding coil in a monolithic body. The bobbin used with the optical pickup actuator includes the printed circuit board, a plurality of tracking circuit patterns formed on both surfaces of the PCB, a plurality of focusing circuit patterns formed on the both surfaces of the PCB, a plurality of via holes formed on the PCB to electrically connect the tracking circuit patterns and the focusing circuit patterns, an objective lens mounting unit formed on the PCB, and a connecting pad through which a power is supplied to the tracking and focusing circuit patterns.

    摘要翻译： 一种光学拾取器致动器及其方法包括：具有用于扫描光盘轨道上的激光束的透镜的绕线管，在聚焦和跟踪方向上将线轴移动到轨道上的绕组线圈，以及用作线轴的集成电路板 使用印刷电路板制造技术，并且与卷绕线圈整体形成在一体的单体中。 与光拾取器致动器一起使用的筒管包括印刷电路板，形成在PCB的两个表面上的多个跟踪电路图案，形成在PCB的两个表面上的多个聚焦电路图案，多个通孔形成在 所述PCB用于电连接所述跟踪电路图案和所述聚焦电路图案，形成在所述PCB上的物镜安装单元和连接焊盘，通过所述连接焊盘向所述跟踪和聚焦电路图案供电。