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    Methods for Coating and Filling High Aspect Ratio Recessed Features
    1.
    发明申请
    Methods for Coating and Filling High Aspect Ratio Recessed Features 有权
    涂层和填充高宽比凹槽特征的方法

    公开(公告)号：US20070141779A1

    公开(公告)日：2007-06-21

    申请号：US11554748

    申请日：2006-10-31

    申请人： John Abelson ,  Sreenivas Jayaraman ,  Gregory Girolami ,  Yu Yang ,  Do Young Kim

    发明人： John Abelson ,  Sreenivas Jayaraman ,  Gregory Girolami ,  Yu Yang ,  Do Young Kim

    IPC分类号： H01L21/8242

    CPC分类号： C23C16/045 ,  H01L21/314

    摘要： The present invention provides methods for conformally or superconformally coating and/or uniformly filling structures with a continuous, conformal layer or superconformal layer. Methods of the present invention improve conformal or superconformal coverage of surfaces and improve fill in recessed features compared to conventional physical deposition and chemical deposition methods, thereby minimizing formation of voids or gaps in a deposited conformal or superconformal layer. The present methods are capable of coating or filling features useful for the fabrication of a broad class of electronic, electrical and electromechanical devices.

    摘要翻译： 本发明提供了用连续的保形层或超常形层进行保形或超分形涂布和/或均匀填充结构的方法。 与常规物理沉积和化学沉积方法相比，本发明的方法改进了表面的适形或超常规覆盖，并且改善了凹入特征的填充，从而最小化沉积的保形或超常形层中的空隙或间隙的形成。 本方法能够涂覆或填充用于制造广泛类型的电子，电气和机电装置的特征。