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公开(公告)号：US4556587A
公开(公告)日：1985-12-03
申请号：US563015
申请日：1983-12-19
申请人： Chris Tsiamis , John E. McCaskie
发明人： Chris Tsiamis , John E. McCaskie
摘要： A process for metal plating plastic or elastomeric materials which produces a coating of high conductivity which does not reduce over time is disclosed in this application to provide electro-magnetic interference shielding for said materials. This process uses either a particular special plating bath containing stabilizer additions with any surface preparation technique, or a certain specific surface preparation technique along with the use of a standard plating bath or the special stabilized plating bath to obtain metal coatings with the desired properties.
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公开(公告)号：US4520046A
公开(公告)日：1985-05-28
申请号：US510428
申请日：1983-06-30
申请人： John E. McCaskie , Chris Tsiamis
发明人： John E. McCaskie , Chris Tsiamis
摘要： A simple and highly effective process for preparing the surface and plating a plastic or elastomer material is disclosed by the present invention.A uniform, highly adherent metal layer is deposited by the claimed process. The surface of the materials to be plated is prepared by exposure to a gas etch atmosphere and activation of the etched surface by providing a metal colloid thereon. Another aspect relates to the use of a one-step or two-step conditioner treatment in the process for improved results.After the surface preparation and activation, a desired metal coating can be electroless metal plated in a conventional manner.
摘要翻译： 本发明公开了一种用于制备表面和镀覆塑料或弹性体材料的简单且高效的方法。 通过要求保护的方法沉积均匀的，高附着的金属层。 要镀覆的材料的表面通过暴露在气体蚀刻气氛中并通过在其上提供金属胶体来激活蚀刻表面来制备。 另一方面涉及在该方法中使用一步或两步调理剂处理以获得改进的结果。 在表面制备和活化之后，所需的金属涂层可以以常规方式进行无电金属镀覆。
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公开(公告)号：US4582729A
公开(公告)日：1986-04-15
申请号：US510377
申请日：1983-06-30
申请人： Chris Tsiamis , John E. McCaskie
发明人： Chris Tsiamis , John E. McCaskie
摘要： A process for metal plating plastic or elastomeric materials which produces a coating of high conductivity which does not reduce over time is disclosed in this application to provide electro-magnetic interference shielding for said materials. This process uses either a particular special plating bath containing stabilizer additions with any surface preparation technique, or a certain specific surface preparation technique along with the use of a standard plating bath or the special stabilized plating bath to obtain metal coatings with the desired properties.
摘要翻译： 在本申请中公开了一种用于金属电镀塑料或弹性体材料的方法，其产生不会随时间而减少的高导电性涂层，以为所述材料提供电磁干扰屏蔽。 该方法使用包含稳定剂添加剂的特定电镀浴，具有任何表面制备技术，或使用特定的表面处理技术以及使用标准电镀浴或特殊稳定化电镀浴以获得具有所需性质的金属涂层。
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公开(公告)号：US5543182A
公开(公告)日：1996-08-06
申请号：US389565
申请日：1995-02-16
申请人： Nayan Joshi , John E. McCaskie , Michael T. Boyle
发明人： Nayan Joshi , John E. McCaskie , Michael T. Boyle
IPC分类号： C25D5/34 , C23C18/04 , C23C18/16 , C23C26/00 , C25D5/54 , C25D5/56 , C25D7/00 , H01L21/288 , H05K3/10 , H05K3/22 , H05K3/24 , H05K3/38 , H05K3/42 , B05D1/18
摘要： A process for applying a metal coating to a non-conductive substrate without an electroless coating is disclosed. The process includes the step of: a. contacting said substrate with an activator comprising a noble metal/Group IVA metal sol to obtain a treated substrate; b. contacting said treated substrate with a self accelerating and replenishing immersion metal composition comprising a solution of (i) a soluble metal salt whose metal is more noble than said Group IVA metal, (ii) a Group IA metal hydroxide, (iii) a complexing agent comprising an organic material having a cumulative formation constant log K of from about 0.73 to about 21.95 for an ion of the metal of said metal salt. The Group IVA metal is employed in a stoichiometric excess compared to the noble metal, the excess Group IVA metal being in its lowest oxidation state. Self accelerating and replenishing non-formaldehyde immersion metal compositions are also disclosed. The composition is used in a two step process to electrolytically coat a nonconductive substrate. In the first step the conductivity of the substrate is increased by applying the composition to it. In the second step, the substrate treated with the composition is electrolytically coated with a metal.
摘要翻译： 公开了一种将金属涂层施加到不带无电涂层的非导电基底上的方法。 该过程包括以下步骤：a。 使所述衬底与包含贵金属/ IVA族金属溶胶的活化剂接触以获得经处理的衬底; b。 使所述经处理的基材与自加速和补充的浸入金属组合物接触，所述组合物包含（i）其金属比所述IVA族金属更贵的可溶性金属盐，（ii）IA族金属氢氧化物，（iii）络合剂 包括对于所述金属盐的金属的离子，累积形成常数log K为约0.73至约21.95的有机材料。 与贵金属相比，IVA族金属以化学计量过量使用，过量的IVA族金属处于其最低的氧化态。 还公开了自加速和补充非甲醛浸渍金属组合物。 该组合物用于电解涂覆非导电基材的两步法。 在第一步中，通过将组合物施加到基底上来增加基底的电导率。 在第二步骤中，用金属电解涂覆用组合物处理的基材。
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公开(公告)号：US4545868A
公开(公告)日：1985-10-08
申请号：US639401
申请日：1984-08-10
摘要： The invention relates to a method for high speed palladium electroplating by immersing the object to be plated in an ammoniacal solution of a palladium tetra-amino complex ion, palladium metal in a concentration of at least 10 g/l, and at least one carbonate or phosphate anion in a concentration of more than about 7.5 g/l and less than about 150 g/l. The solution has a pH of between about 7 and 9 and is free of quaternized pyridinium brightening agents. Palladium is plated into a substrate with high speed plating equipment which provides sufficient agitation, and current densities of 100 ASF and above to produce lustrous crack free deposits.
摘要翻译： 本发明涉及一种用于高速钯电镀的方法，该方法是通过将待镀物体浸渍在浓度为至少10g / l的四钯络合物钯金的氨溶液中，以及至少一种碳酸盐或 浓度超过约7.5g / l且小于约150g / l的磷酸盐阴离子。 该溶液具有约7至9的pH，并且不含季铵化的吡啶鎓增白剂。 用高速电镀设备将钯电镀到基板上，提供足够的搅拌，电流密度为100 ASF及以上，以产生无光泽的无裂纹沉积物。
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6.发明授权
公开(公告)号：US5725640A
公开(公告)日：1998-03-10
申请号：US645743
申请日：1996-05-14
IPC分类号： C25D5/34 , C23C18/04 , C23C18/16 , C23C26/00 , C25D5/54 , C25D5/56 , C25D7/00 , H01L21/288 , H05K3/10 , H05K3/22 , H05K3/24 , H05K3/38 , H05K3/42 , C23C22/05 , C23C22/08
摘要： The disclosure relates to treating a self accelerating and replenishing immersion composition on a substrate with a neutralizing and reducing composition comprising an acid and a salt of an inorganic or organic amine, and then electrolytically coating the treated surface with a metal. The salts in one embodiment comprise salts of hydroxylamine or hydrazine and the acid comprises a mineral acid.
摘要翻译： 本公开涉及用包含酸和无机或有机胺的盐的中和和还原组合物在衬底上处理自加速和补充浸渍组合物，然后用金属电解涂覆处理的表面。 一个实施方案中的盐包括羟胺或肼的盐，酸包括无机酸。
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7.发明授权
公开(公告)号：US5718818A
公开(公告)日：1998-02-17
申请号：US754381
申请日：1996-11-21
CPC分类号： C25D3/22
摘要： A high current density electrogalvanizing process and composition are disclosed for reducing high current density dendrite formation and edge burn and controlling high current density roughness, grain size and orientation of a zinc coating obtained from a zinc sulfate aqueous acidic electrogalvanic coating bath. The composition comprises a high molecular weight polyoxyalkylene glycol grain refining agent in combination with a sulfonated condensation product of naphthalene and formaldehyde which is used as an antidendritic agent.
摘要翻译： 公开了一种高电流密度电镀锌工艺和组合物，用于降低高电流密度枝晶形成和边缘烧蚀，并控制由硫酸锌水性酸性电镀锌浴获得的锌镀层的高电流密度粗糙度，晶粒尺寸和取向。 该组合物包含与萘和甲醛的磺化缩合产物组合的高分子量聚氧亚烷基二醇晶粒澄清剂，其用作抗枝霉剂。
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公开(公告)号：US06585812B2
公开(公告)日：2003-07-01
申请号：US10080664
申请日：2002-02-25
IPC分类号： C25D322
CPC分类号： C25D3/22
摘要： A high current density electrogalvanizing process and composition are disclosed for reducing high current density dendrite formation and controlling high current density roughness, grain size and orientation of a zinc coating obtained from an acidic aqueous zinc salt. The process comprises adding a sulfonated condensation product of naphthalene and formaldehyde to the acidic aqueous zinc salt in an electrolytic cell and applying an electromotive force to the anode and cathode in the cell sufficient to produce a high current density on the cathode. The composition consists essentially of an acidic aqueous zinc salt aqueous in combination with a sulfonated condensation product of naphthalene and formaldehyde which is used as an antidendritic agent.
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9.发明授权Baths and process for electroplating hard,adherent,smooth, wear resistant and corrosion resistant chromium deposits 失效用于电镀坚硬，粘附，光滑，耐磨和耐腐蚀的铬沉积物的浴和工艺
公开(公告)号：US4836897A
公开(公告)日：1989-06-06
申请号：US239565
申请日：1988-09-01
IPC分类号： C25D3/10
CPC分类号： C25D3/10
摘要： Corrosion resistant electrodeposited chromium layers, processes for their electrodepositions and plating baths suitable for use therein are disclosed. The corrosion resistant chromium layers also are bright, adherent, smooth, hard, wear resistant, and exhibit a low coefficient of friction. Electrodeposition is carried out at both high and low currrent densities. The baths used comprise 450-650 g/l of chromic acid, 40-100 g/l of sulfoacetic acid and 0-4.5 g/l of sulfate ion and are substantially free of other carboxylic acids, fluoride ions, iodide ions, bromide ions and selenium ions. The baths used comprise 400-650 g/l of chromic acid, 40-100 g/l of sulfoacetic acid and 0-4.5 g/l of sulfate ion and are substantially free of other carboxylic acids, flouride ions, iodide ions, bromide ions and selenium ions.
摘要翻译： 公开了耐腐蚀电沉积铬层，其电沉积方法和适用于其中的电镀浴。 耐腐蚀铬层也是光亮的，粘附的，光滑的，硬的，耐磨的，并且表现出低的摩擦系数。 电沉积在高和低电流密度下进行。 使用的浴包含450-650g / l的铬酸，40-100g / l的磺基乙酸和0-4.5g / l的硫酸根离子，并且基本上不含其它羧酸，氟离子，碘离子，溴离子 和硒离子。 使用的浴包含400-650g / l的铬酸，40-100g / l的磺基乙酸和0-4.5g / l的硫酸根离子，并且基本上不含其它羧酸，氟离子，碘离子，溴离子 和硒离子。
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公开(公告)号：US20200275663A1
公开(公告)日：2020-09-03
申请号：US16799259
申请日：2020-02-24
摘要： An aqueous oral spray designed to treat mouth guards against bacterial infection comprising: 1. A naturally derived di-basic amino acid derivative, 2. A natural sweetener which inhibits the adhesion of bacteria to the oral cavity and, 3. Optionally a natural flavor and/or natural dye 4. Optionally a mouth guard surface modified to absorb specific components of above oral aqueous solution so as to render mouth guard more effective overtime in inhibiting microorganism growth on surface and in contact with mouth surfaces compared with unmodified mouth guard surface.
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