摘要:
A system and method for wafer level global bitmap characterization include determining chip level defect data bitmaps from a semiconductor wafer, and consolidating the chip level defect data bitmaps into a global wafer level bitmap that characterizes substantially the entire wafer failure configuration. The global wafer level bitmap is then analyzed and compared with other global wafer level bitmaps to develop correlations thereamong and develop global wafer level bitmap definitions for conducting at least one of wafer-to-wafer, boat-to-boat, and lot-to-lot process analysis based upon the global wafer level bitmap definitions.
摘要:
A method and system of processing tester information of a system under test is provided. Data of a tested characteristic of the system under test is generated. A distribution curve is extracted from the data. A signature of the distribution curve is determined, and a map of the signature on a depiction of the system under test is presented. The distribution curve also can be categorized in a plurality of bins, and bitmaps are generated for the sections in each of the plurality of bins. Systematic signatures are determined from the bitmaps in the block, and the signatures are correlated with the locations on the system under test.
摘要:
A method for correlating semiconductor process data analyzes a semiconductor device that has been treated by a process, to produce process data related to the process. The data is converted into an image pattern, and automatic image retrieval is used to identify other devices having similar images. The process data is then correlated with prior process data of the other devices having the similar images.
摘要:
A method of testing an integrated circuit is provided, which includes providing a semiconductor substrate having a semiconductor device provided thereon. A first dielectric layer is formed over the semiconductor substrate and a first channel is formed in the first dielectric layer in contact with the semiconductor device. A first contact pad mask layer is formed and a first contact pad in the first contact pad mask layer is formed in contact with the first channel. The first contact pad is used to test the first channel and the semiconductor device and the first contact pad mask layer and the first contact pad are removed.
摘要:
An image processing system provides a method for processing an image including classifying the image, comparing the image to stored images, storing the image if the image does not match one of the stored images, and storing a link to a stored image if the image matches one of the stored images.
摘要:
A method for failure analysis of small contacts in integrated circuits is provided. A number of opposing electrical contacts is configured to contact a sample in an offset pattern such that any one electrical contact may contact more than one conductor in the sample and any opposing electrical contact is offset-positioned to contact no more than one of the conductors contacted by the one electrical contact.
摘要:
A method for facilitating semiconductor wafer lot disposition includes providing detailed descriptive information of the semiconductor wafer layout and generating data concerning at least one defect in the semiconductor wafers at an intermediate processing stage. At least one layer model is generated from the information and data to disclose the effects of the defect upon at least one later layer of the semiconductor wafers. The layer model is utilized to determine the subsequent disposition of the wafer lot.
摘要:
Ultra-large scale CMOS integrated circuit semiconductor devices are provided which have width- and profile-controlled, inverted trapezoidal gates with LDD structures having gradual doping profiles and salicided for contacts. The structures are manufactured on a substrate by forming a barrier layer over the substrate, forming a gate layer over the barrier layer, forming inverted trapezoidal gate trenches into the gate layer, depositing a gate dielectric in the inverted trapezoidal gate trenches on the substrate, forming polysilicon gates in the inverted trapezoidal gate trenches, removing the gate layer and the barrier layer to define gate spacers, implanting the substrate around the gate spacers with a dopant to form source/drain extension junctions, and preparing the source/drain extension junctions and the gates for conductive connections.
摘要:
A scan tool recipe management database system for recipes utilized in the scanning of semiconductor wafers during the manufacture of the semiconductor wafers. The scan tool recipe management database system includes workstations at each scan tool for simultaneously inputting recipes and changes to the recipes to the scan tool and to a scan tool recipe database.
摘要:
A method of analyzing and classifying defects on semiconductor wafers during a semiconductor manufacturing process using a comparator die selector system wherein an automatic defect classification review tool compares defects on a die location with an identical location on an identical die. The automatic defect classification review tool locates identical die with information from the comparator die selector system.