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    Reduced inter-module circuit path crossovers on circuit boards mounting plural multi-chip modules, through rearranging the north-south-east-west interconnection interfaces of a given module and through selective rotation of each module
    2.
    发明授权
    Reduced inter-module circuit path crossovers on circuit boards mounting plural multi-chip modules, through rearranging the north-south-east-west interconnection interfaces of a given module and through selective rotation of each module 失效
    通过重新布置给定模块的南北 - 东 - 西互连接口和通过每个模块的选择性旋转，减少了安装多个多芯片模块的电路板上的模块间电路路径交叉

    公开(公告)号：US5619719A

    公开(公告)日：1997-04-08

    申请号：US678141

    申请日：1996-07-11

    申请人： John M. Segelken ,  Richard R. Shively ,  Christopher A. Stanziola ,  Lesley J.-Y. Wu

    发明人： John M. Segelken ,  Richard R. Shively ,  Christopher A. Stanziola ,  Lesley J.-Y. Wu

    IPC分类号： G06F15/80 ,  H05K1/14 ,  H05K7/02 ,  G06F15/60

    CPC分类号： G06F15/803 ,  H05K7/023 ,  H05K1/141

    摘要： The number of circuit path crossover points on boards mounting plural connected multichip modules is substantially reduced over the number that would otherwise be required. For 4-sided modules and boards, the modules are arranged on the board in such a way that their inter-connecting north-east-south-west ports are successively reordered to N-S-E-W. Additionally, further advantage in reducing crossover vias may be gained by combining the reordering with a phased rotation of the modules from their nominal congruent board position. For the 4-sided module, these expedients virtually eliminate crossover vias between the east and west ports. It also provides for all MCMs a ready common bus structure located at a common interior area of the mounting board, to which the E- and W-ports are oriented. The invention is applicable to a class of multi-sided, multi-chip modules on boards with a like number of sides.

    摘要翻译： 安装多个连接的多芯片模块的板上的电路路径交叉点的数量大大减少了否则将需要的数量。 对于四面模块和单板，模块安排在板上，使其相互连接的东北 - 西南端口依次重新排列到N-S-E-W。 此外，通过将重新排序与其标称的一致的板位置的模块的相位旋转组合可以获得减少交叉通孔的进一步的优点。 对于四面模块，这些功能实际上可以消除东西端口之间的交叉通孔。 它还为所有MCM提供了一个位于安装板的公共内部区域的准备好的公共总线结构，E端口和W端口定向到该安装板。 本发明适用于具有相同数量侧面的板上的一类多边多芯片模块。

    Optical assembly comprising optical fiber coupling means
    5.
    发明授权
    Optical assembly comprising optical fiber coupling means 失效
    光学组件包括光纤耦合装置

    公开(公告)号：US4995695A

    公开(公告)日：1991-02-26

    申请号：US394911

    申请日：1989-08-17

    申请人： Richard J. Pimpinella ,  John M. Segelken ,  King L. Tai ,  Ross J. Thompson

    发明人： Richard J. Pimpinella ,  John M. Segelken ,  King L. Tai ,  Ross J. Thompson

    IPC分类号： G02B6/42

    CPC分类号： G02B6/4292 ,  G02B6/4202 ,  G02B6/4204 ,  G02B6/421

    摘要： Disclosed is a novel "hermetic" optical assembly. A radiation-transmissive member seals an aperture in the assembly housing. The member comprises two major surfaces and a recess that extends from one surface towards the other, with a "septum" between the bottom of the recess and the other surface. An optical or opto-electronic device typically is mounted on the inside surface of the member, and the end of an optical fiber is maintained outside of the assembly in coupling relationship with the device. In a currently preferred embodiment the recess extends from the outward-facing surface of the member and serves to position the end of the optical fiber with respect to a device mounted in a "well" in the inward-facing surface of the member. In another embodiment, the outward facing surface of the member comprises geometrical features (e.g., recesses) that mate with corresponding features (e.g., protrusions) on a guide plate that serves to position the ends of a multiplicity of fibers with respect to devices mounted on the bottom of a recess extending from the inward-facing surface of the radiation-transmissive member. In all embodiments radiation is transmitted through the septum. In preferred embodiments the radiation-transmissive member is (100) Si, with the recess (and other features) produced by means comprising photolithography and anisotropic etching.

    Means for coupling an optical fiber to an opto-electronic device
    6.
    发明授权
    Means for coupling an optical fiber to an opto-electronic device 失效
    用于将光纤耦合到光电装置的装置

    公开(公告)号：US4826272A

    公开(公告)日：1989-05-02

    申请号：US90263

    申请日：1987-08-27

    申请人： Richard J. Pimpinella ,  John M. Segelken

    发明人： Richard J. Pimpinella ,  John M. Segelken

    IPC分类号： G02B6/36 ,  G02B6/42 ,  H01L31/0203 ,  H01L33/58

    CPC分类号： H01L31/0203 ,  G02B6/4202 ,  G02B6/4204 ,  G02B6/423 ,  G02B6/3644 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/3696 ,  G02B6/4231 ,  G02B6/4239 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2924/30107 ,  H01L33/58

    摘要： The disclosed means for coupling an optical fiber and an opto-electronic device (e.g., LED, Laser, or photodetector) comprises a first body having two substantially parallel major surfaces, with a recessed portion (a "well") formed in one surface, and a through-aperture extending from the other surface to the well. Conductive means extend from the former surface onto the bottom of the well, and the opto-electronic device is to be mounted in the well such that the device does not protrude above the plane of the associated surface, such that electrical contact is established between the device and the conductive means, and such that the active region of the device is centered upon the through-aperture. The first body is advantageously from a (100) Si wafer by means of standard Si processing techniques, including selective etching. The assembly can be mounted on a substrate, e.g., a Si wafer with appropriate metallization thereon, and the end of an optical fiber inserted into the through-aperture and secured to the first body. The assembly can be operated at relatively high speed, due to its relatively low parasitic capacitance and inductance, and can be mounted on the substrate in substantially the same way as IC chips are mounted, in close proximity to associated electrical components.