Underfill composition and packaged solid state device
    3.
    发明授权
    Underfill composition and packaged solid state device 有权
    底部填充成分和包装固态装置

    公开(公告)号:US07279223B2

    公开(公告)日:2007-10-09

    申请号:US10737453

    申请日:2003-12-16

    摘要: An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

    摘要翻译: 具有增强的粘附性和改善的抗开裂性的底部填充剂组合物,其包含环氧树脂与双官能硅氧烷酐环氧固化剂和任选试剂的组合。 在一些实施方案中,环氧树脂包括粒度范围为约1nm至约500nm的官能化胶体二氧化硅填料。 双官能硅氧烷酐环氧固化剂可以任选地与液体酐环氧固化剂组合。 固化催化剂,含羟基单体,粘合促进剂,阻燃剂和消泡剂也可以加入到组合物中。 本公开的另外的实施方案包括包含底部填充剂组合物的包装的固态装置。